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Texas Instruments CY74FCT16827ETPAC
- Part No.:
- CY74FCT16827ETPAC
- Manufacturer:
- Texas Instruments
- Package:
- 56-TFSOP (0.240", 6.10mm Width)
- Datasheet:
-
CY74FCT16827ETPAC.pdf
- Description:
- IC BUFF NON-INVERT 5.5V 56TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:4,823
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Product details
Overview
CY74FCT16827ETPAC from Texas Instruments is a 20-bit non-inverting 3-state buffer/line driver with dual 10-bit sections, 64 mA sink / 32 mA source drive capability, <4.2 ns propagation delay (CL=50 pF), and Ioff partial-power-down support - designed for high-capacitance bus driving in industrial backplane and memory interface applications.
For engineers reviewing the CY74FCT16827ETPAC datasheet, CY74FCT16827ETPAC pinout, CY74FCT16827ETPAC application, or CY74FCT16827ETPAC equivalent, key selection criteria include output drive strength, ground-bounce performance (VOLP <1.0 V), TSSOP-56 package compatibility, and industrial temperature range (−40°C to +85°C) compliance.
Technical Context
The CY74FCT16827ETPAC implements two independent 10-bit buffer sections, each with NANDed OE1/OE2 inputs enabling flexible enable logic. Its FCT-family CMOS/TTL-compatible input thresholds (VIH = 2.0 V, VIL = 0.8 V) ensure robust interfacing with legacy 5-V logic systems.
It features edge-rate control circuitry to suppress switching noise, supports Ioff protection during partial power-down (preventing backflow current when VCC = 0 V), and delivers low ground bounce (VOLP <1.0 V at 64 mA sink) critical for signal integrity on dense PCBs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Supply | 5 V ±10% - compatible with standard TTL/CMOS 5-V rails without regulation overhead |
| Propagation Delay | 1.5–4.2 ns (CL = 50 pF) - enables timing-critical 100+ MHz bus operation |
| Output Drive | 64 mA sink / 32 mA source - drives heavy capacitive loads (e.g., >100 pF traces or multi-drop buses) |
| Ground Bounce (VOLP) | <1.0 V at VCC = 5 V, TA = 25°C - minimizes noise-induced logic errors during simultaneous switching |
| Ioff Current | ±1 µA at VCC = 0 V - prevents damaging back-current flow in hot-swap or partial-power-down systems |
| Operating Temp | −40°C to +85°C - qualified for industrial-grade embedded and infrastructure equipment |
| ESD Rating | >2000 V HBM - withstands handling and board-level electrostatic discharge events |
Pinout & Package
Package: 56-pin Thin Shrink Small Outline Package (TSSOP), 0.5 mm pitch, 13.9 × 7.9 mm body, 1.2 mm max height (JEDEC MO-153 compliant).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, ..., 10 12, 13, ..., 21 23, 24, ..., 33 35, 36, ..., 45 47, 48, ..., 56 | Data Inputs (A1–A20) | 20 dedicated TTL/CMOS-compatible inputs, grouped as two 10-bit banks (A1–A10, A11–A20) |
| 11, 22, 34, 46 | Output Enable (OE1, OE2 per bank) | NANDed active-low enables per 10-bit section - allows independent or combined gating of outputs |
| 14–20, 25–31, 37–43, 49–55 | Three-State Outputs (Y1–Y20) | 20 high-drive buffered outputs; tri-stated when corresponding OE pair is HIGH |
| 5, 19, 32, 44 | GND | Four ground pins distributed across package - reduce ground impedance and improve noise immunity |
| 27, 40 | VCC | Two 5-V supply pins - minimize IR drop and stabilize internal rail under fast switching |
Key Features
| Feature | Design Value |
|---|---|
| Ioff partial-power-down support | Enables safe insertion/removal in live backplanes by disabling outputs and blocking reverse current at VCC = 0 V |
| Edge-rate controlled outputs | Reduces simultaneous switching noise (SSN) and EMI without external series resistors |
| Low ground bounce (VOLP <1.0 V) | Maintains valid LOW logic levels even under full 64-mA sink load - avoids false triggering on shared ground planes |
| Dual 10-bit enable architecture | Permits independent control of two 10-bit data paths or coordinated 20-bit operation via NANDed OE inputs |
| Industrial temperature rating | Validated operation from −40°C to +85°C - suitable for uncontrolled ambient environments in networking and automation hardware |
Applications
| Backplane Interface | Memory Subsystem Buffering |
|---|---|
Use Scenario: Driving wide parallel address/data buses across multi-slot industrial backplanes with >80 pF trace capacitance. IC Role / Device Role / Timing Role: 20-bit non-inverting buffer providing level translation, fanout expansion, and noise-suppressed signal integrity. Use Value: 64 mA sink strength ensures reliable LOW-level signaling across long traces; edge-rate control limits crosstalk between adjacent lines. | Use Scenario: Isolating and buffering SRAM or Flash memory data/address lines in real-time control systems. IC Role / Device Role / Timing Role: Bidirectional bus driver with fast 4.2 ns propagation enabling tight memory access timing budgets. Use Value: Low skew (<0.5 ns) and precise enable/disable timing (tPZL ≤5.6 ns) prevent bus contention during read/write transitions. |
| Industrial PLC I/O Expansion | Legacy System Interfacing |
Use Scenario: Interfacing microcontroller GPIOs to high-current discrete I/O modules (relays, LEDs, sensors) in programmable logic controllers. IC Role / Device Role / Timing Role: Level-shifting and current-boosting buffer between low-drive MCU pins and ruggedized field-side circuits. Use Value: Ioff protection allows safe hot-swap of I/O modules while controller remains powered; industrial temp rating matches PLC enclosure conditions. | Use Scenario: Connecting modern FPGA or ASIC peripherals to legacy 5-V TTL bus standards (e.g., ISA, VME, custom control buses). IC Role / Device Role / Timing Role: Signal conditioning and drive reinforcement for backward-compatible system upgrades. Use Value: TTL-compatible VIH/VIL thresholds and 5-V supply eliminate need for external level shifters; TSSOP-56 footprint fits legacy board layouts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 20-bit buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY74FCT162827CTPACT | Balanced 24 mA output drivers; lower VOLP (<0.6 V); reduced switching noise; no 64 mA sink capability | Optimized for transmission-line driving (e.g., point-to-point buses), not high-capacitance backplanes | Select when minimizing ground bounce and EMI outweighs raw drive strength requirements |
| SN74FCT162827CTPVC | Same electrical specs as CY74FCT162827CTPACT but in SSOP-56 (300-mil width); identical speed and drive | Requires PCB layout change due to wider SSOP package; same functional use case as TSSOP variant | Choose only if existing design uses SSOP-56 footprint or thermal/mounting constraints favor SSOP |
Compared with CY74FCT16827ETPAC, CY74FCT162827CTPACT trades peak sink current for superior noise control and transmission-line suitability, while SN74FCT162827CTPVC offers identical functionality in a mechanically distinct SSOP package - neither provides the 64 mA sink strength essential for legacy backplane loading.
Availability
CY74FCT16827ETPAC is available at Aetrix Electronics and suitable for industrial backplane interfaces, memory subsystem buffering, and PLC I/O expansion requiring stable component supply across extended product lifecycles.
Supply support for CY74FCT16827ETPAC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and communications markets.
The CY74FCT16827ETPAC belongs to TI's FCT logic family - engineered for high-speed, low-noise 5-V bus interface applications where drive strength, timing precision, and robustness in harsh environments are critical.
FAQ
What is the maximum output sink current specification for CY74FCT16827ETPAC?
The CY74FCT16827ETPAC is rated for 64 mA sink current per output pin under specified test conditions (VCC = min, VOL = 0.55 V). This value is guaranteed across the industrial temperature range and enables direct driving of high-capacitance buses or multiple TTL inputs without external buffers. The CY74FCT16827ETPAC datasheet confirms this in the "Output Drive Characteristics" table.
Does CY74FCT16827ETPAC support partial power-down operation?
Yes, CY74FCT16827ETPAC includes Ioff circuitry that disables all outputs and limits off-state current to ±1 µA when VCC = 0 V. This feature prevents damaging current backflow during hot-swap or partial-power-down scenarios - a key requirement for modular industrial systems. The Ioff behavior is fully characterized in the Electrical Characteristics table.
What package type and dimensions does CY74FCT16827ETPAC use?
CY74FCT16827ETPAC uses a 56-pin Thin Shrink Small Outline Package (TSSOP) with 0.5 mm pitch, JEDEC MO-153 compliant outline. Its body measures 13.9 mm × 7.9 mm with 1.2 mm maximum height. Pin 1 location and land pattern details are provided in TI's DGG0056A package drawing - critical for accurate PCB layout and stencil design.
How does CY74FCT16827ETPAC differ from CY74FCT162827T variants?
CY74FCT16827ETPAC delivers asymmetric 64 mA sink / 32 mA source drive optimized for driving heavy capacitive loads, whereas CY74FCT162827T variants provide balanced 24 mA drive for lower-noise transmission-line applications. The CY74FCT16827ETPAC also exhibits higher ground bounce (VOLP <1.0 V vs. <0.6 V) but superior sink capability - making it distinct in bus-loading scenarios.
What is the typical propagation delay of CY74FCT16827ETPAC at 50-pF load?
The typical propagation delay (tPLH/tPHL) of CY74FCT16827ETPAC is 4.2 ns when loaded with 50 pF and driven at VCC = 5 V, TA = 25°C. This value is confirmed in the "Switching Characteristics" table for the 'C' speed grade. The maximum delay under same conditions is 4.2 ns - indicating tight process control and predictable timing for synchronous bus designs.
CY74FCT16827ETPAC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 56-TFSOP (0.240", 6.10mm Width)
- Packaging:
- Tube
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 10
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 15mA, 64mA
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSSOP
CY74FCT16827ETPAC FAQ
1.How can I place an order for CY74FCT16827ETPAC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY74FCT16827ETPAC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY74FCT16827ETPAC reliable?
The price and inventory of CY74FCT16827ETPAC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY74FCT16827ETPAC is usually 5 days.
3.What payment methods are accepted for CY74FCT16827ETPAC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY74FCT16827ETPAC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY74FCT16827ETPAC?
CY74FCT16827ETPAC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY74FCT16827ETPAC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY74FCT16827ETPAC?
For technical support, including CY74FCT16827ETPAC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY74FCT16827ETPAC requirements.
6.How does Aetrix verify that CY74FCT16827ETPAC is sourced from the original manufacturer or authorized distributors?
All CY74FCT16827ETPAC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY74FCT16827ETPAC meets industry standards.
7.What is the process for return or replacement of CY74FCT16827ETPAC?
All CY74FCT16827ETPAC units undergo pre-shipment inspection (PSI). If there is an issue with CY74FCT16827ETPAC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY74FCT16827ETPAC part is unused and in its original packaging.
Return procedure for CY74FCT16827ETPAC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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