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Texas Instruments CY74FCT16827ETPACT
- Part No.:
- CY74FCT16827ETPACT
- Manufacturer:
- Texas Instruments
- Package:
- 56-TFSOP (0.240", 6.10mm Width)
- Datasheet:
-
CY74FCT16827ETPACT.pdf
- Description:
- IC BUFF NON-INVERT 5.5V 56TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:12,800
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Product details
Overview
CY74FCT16827ETPACT from Texas Instruments is a 20-bit non-inverting buffer/line driver with dual 10-bit sections, each controlled by NANDed output-enable inputs. It delivers 64 mA sink and 32 mA source drive capability at 5V, supports partial-power-down via Ioff, operates across −40°C to +85°C, and targets high-capacitance bus and backplane driving in industrial computing systems.
For engineers reviewing the CY74FCT16827ETPACT datasheet, CY74FCT16827ETPACT pinout, CY74FCT16827ETPACT application, or CY74FCT16827ETPACT equivalent, key selection criteria include output drive strength (64 mA sink), ground-bounce performance (VOLP <1.0 V), propagation delay (≤4.2 ns @ 50 pF), Ioff-enabled power-down safety, and TSSOP-56 packaging for space-constrained PCB layouts.
Technical Context
The CY74FCT16827ETPACT implements two independent 10-bit buffer sections, each with paired active-low OE inputs logically NANDed to enable output control-providing flexible gating without external logic. Its FCT-family CMOS-compatible inputs accept TTL-level signals and feature hysteresis (100 mV) for noise immunity.
It uses bipolar-CMOS (BiCMOS) output stages optimized for low ground bounce (VOLP <1.0 V) and fast edge rates, with typical output skew under 250 ps. The Ioff circuit actively disables outputs during VCC = 0 V, preventing back-drive current and enabling hot-insertion in powered-backplane systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Supply | 5 V ±10% - compatible with standard 5-V TTL/CMOS system rails |
| Output Drive | 64 mA sink / 32 mA source - sufficient to drive 50-Ω transmission lines or high-capacitance (>100 pF) buses |
| Propagation Delay | ≤4.2 ns (CL = 50 pF) - enables reliable operation in >100 MHz address/data bus timing windows |
| Ground Bounce (VOLP) | <1.0 V at TA = 25°C - minimizes noise coupling into shared VCC/GND planes during switching |
| Ioff Support | Active at VCC = 0 V - prevents reverse current flow when device is unpowered but bus remains live |
| Operating Temperature | −40°C to +85°C - qualified for industrial-grade embedded control and communications equipment |
| ESD Rating | >2000 V HBM - withstands handling and board-level electrostatic events without latch-up |
Pinout & Package
Package: 56-pin Thin Shrunk Small Outline Package (TSSOP), 0.5 mm pitch, 13.9 × 7.9 mm footprint, 1.2 mm max height (JEDEC MO-153 compliant).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A1–1A10, 2A1–2A10 | Data Inputs | 20 TTL-compatible input pins accepting 0.8 V/2.0 V logic thresholds; each drives corresponding Y output |
| 1Y1–1Y10, 2Y1–2Y10 | Three-State Outputs | 20 buffered, non-inverting outputs with 64 mA sink capability; enter high-Z when OE asserted |
| 1OE1, 1OE2, 2OE1, 2OE2 | Output Enable Inputs | Four active-low enables; each pair (e.g., 1OE1 & 1OE2) NANDed internally to control one 10-bit section |
| VCC (Pins 25, 36, 48) | Power Supply | Three dedicated 5-V supply pins reduce IR drop and improve noise margin across wide die |
| GND (Pins 26, 37, 49) | Ground | Three ground pins provide low-inductance return paths for simultaneous switching outputs |
Key Features
| Feature | Design Value |
|---|---|
| Ioff partial-power-down protection | Prevents damaging back-current when VCC = 0 V while bus remains active - essential for hot-swap backplanes |
| Edge-rate control circuitry | Reduces simultaneous switching noise (SSN) and EMI without external series resistors |
| Typical output skew < 250 ps | Ensures tight timing alignment across all 20 outputs - critical for parallel bus integrity |
| Balanced drive strength per section | Dual 10-bit architecture allows independent enable control of two data groups - simplifies memory or peripheral interface partitioning |
| Low ground bounce (VOLP <1.0 V) | Maintains signal fidelity on shared ground planes during heavy capacitive loading - avoids false logic transitions |
Applications
| Industrial Backplane Interface | Memory Expansion Subsystem |
|---|---|
Use Scenario: Driving 20-bit address/data lines between CPU module and expansion slot in ruggedized PLC chassis. IC Role / Device Role / Timing Role: Non-inverting buffer providing level translation, fanout, and noise-suppressed signal integrity across 15-cm backplane traces. Use Value: 64 mA sink drive ensures full logic swing into 100-pF net capacitance; Ioff prevents backfeed during hot-plug insertion. | Use Scenario: Interfacing microcontroller GPIO bank to external SRAM or Flash memory array with 20-bit data bus. IC Role / Device Role / Timing Role: Bus driver isolating controller from memory load while meeting tight tPLH/tPHL ≤4.2 ns timing budgets. Use Value: Low propagation delay and sub-250-ps output skew preserve setup/hold margins across all bits at 25 MHz operation. |
| Telecom Line Card Data Path | Test Equipment Digital I/O Module |
Use Scenario: Buffering configuration and status signals between FPGA and multiple daughter cards in modular telecom shelf. IC Role / Device Role / Timing Role: Dual-section driver enabling independent enable control of control vs. status bus segments. Use Value: NANDed OE architecture eliminates need for external gate logic; 2000-V ESD rating protects against field maintenance events. | Use Scenario: Providing programmable digital stimulus and response capture in automated test equipment (ATE) mainframe. IC Role / Device Role / Timing Role: High-drive buffer translating FPGA I/O to DUT-level voltage/current requirements. Use Value: VOLP <1.0 V ensures clean low-state definition even with 20 outputs switching simultaneously into 50-Ω loads. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 20-bit buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY74FCT16827CTPACT | Same pinout and function; faster 4.2 ns propagation delay (vs. 8.0 ns for 'E' grade); identical Ioff, drive, and package | Preferred for timing-critical 20-bit buses requiring tighter skew and lower delay - e.g., high-speed memory interfaces | Select CY74FCT16827CTPACT when propagation delay ≤4.2 ns is required; CY74FCT16827ETPACT remains optimal for cost-sensitive industrial designs where 8.0 ns is acceptable |
| CY74FCT162827ATPVC | SSOP-56 package (300-mil width); balanced 24 mA drivers; lower ground bounce (VOLP <0.6 V); no Ioff support | Better for transmission-line driving with minimal termination; unsuitable for partial-power-down systems due to missing Ioff | Choose CY74FCT162827ATPVC only for fixed-voltage, non-hot-swap applications demanding ultra-low ground bounce - not a drop-in replacement for CY74FCT16827ETPACT |
Compared with CY74FCT16827CTPACT, the CY74FCT16827ETPACT trades 3.8 ns higher propagation delay for broader availability and legacy design continuity; versus CY74FCT162827ATPVC, it retains Ioff and higher drive but exhibits higher VOLP - making it the sole choice for industrial hot-swap bus interfaces.
Availability
CY74FCT16827ETPACT is available at Aetrix Electronics and suitable for industrial backplane interfaces, memory expansion subsystems, and telecom line card data paths requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.
Supply support for CY74FCT16827ETPACT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and logic solutions for industrial, automotive, and communications markets.
The CY74FCT16827ETPACT belongs to TI's FCT logic family - engineered for high-speed, low-noise 5-V bus interfacing in industrial control, instrumentation, and legacy computing systems.
FAQ
What is the maximum operating frequency supported by CY74FCT16827ETPACT?
The CY74FCT16827ETPACT does not specify a maximum clock frequency directly, but its propagation delay of ≤8.0 ns (at CL = 50 pF) and output skew <250 ps enable reliable operation in 20-bit parallel buses running up to approximately 60 MHz. System-level timing must account for board trace delays and load capacitance; for 100-MHz+ applications, the faster CY74FCT16827CTPACT variant is recommended. The CY74FCT16827ETPACT is optimized for robustness over raw speed in industrial environments.
Does CY74FCT16827ETPACT support hot-swap or partial-power-down operation?
Yes, CY74FCT16827ETPACT fully supports partial-power-down via its Ioff circuitry. When VCC = 0 V, the outputs enter a high-impedance state and block reverse current flow - protecting both the device and live backplane signals during hot-insertion or staged power sequencing. This behavior is tested per JEDEC JESD78 and is a defining feature distinguishing CY74FCT16827ETPACT from non-Ioff logic families. Always verify system-level grounding and decoupling to maintain Ioff effectiveness.
What are the key differences between CY74FCT16827ETPACT and CY74FCT162827ATPVC?
CY74FCT16827ETPACT offers 64 mA sink drive, Ioff support, and 8.0 ns propagation delay in TSSOP-56 packaging, targeting industrial backplane driving. CY74FCT162827ATPVC provides balanced 24 mA drivers, lower ground bounce (VOLP <0.6 V), but lacks Ioff and uses SSOP-56. They are not pin-compatible: CY74FCT162827ATPVC has different OE architecture (single OE per 10-bit section) and drive characteristics. The CY74FCT16827ETPACT remains the only option for systems requiring both high drive and safe power-down.
Can CY74FCT16827ETPACT be used with 3.3-V logic inputs?
CY74FCT16827ETPACT accepts 3.3-V logic inputs safely: its VIH threshold is 2.0 V (min), and VIL is 0.8 V (max), making it compatible with 3.3-V CMOS/TTL outputs. However, it requires a 5-V supply (VCC = 5 V ±10%) and produces 5-V output swings. Level-shifting is needed if interfacing with 3.3-V receivers; the CY74FCT16827ETPACT itself does not translate voltages. Input hysteresis (100 mV) improves noise margin for marginal 3.3-V signals.
What package type and dimensions does CY74FCT16827ETPACT use?
CY74FCT16827ETPACT uses a 56-pin Thin Shrunk Small Outline Package (TSSOP), designated DGG per TI, with 0.5 mm lead pitch, 13.9 mm × 7.9 mm body size, and 1.2 mm maximum height. It complies with JEDEC MO-153 and is RoHS-compliant with NiPdAu lead finish. The footprint matches standard TSSOP-56 land patterns; stencil design should follow TI's recommended 0.125 mm thickness with trapezoidal apertures for optimal solder paste release.
CY74FCT16827ETPACT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 56-TFSOP (0.240", 6.10mm Width)
- Packaging:
- Bulk
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 10
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 15mA, 64mA
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSSOP
CY74FCT16827ETPACT FAQ
1.How can I place an order for CY74FCT16827ETPACT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY74FCT16827ETPACT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY74FCT16827ETPACT reliable?
The price and inventory of CY74FCT16827ETPACT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY74FCT16827ETPACT is usually 5 days.
3.What payment methods are accepted for CY74FCT16827ETPACT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY74FCT16827ETPACT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY74FCT16827ETPACT?
CY74FCT16827ETPACT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY74FCT16827ETPACT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY74FCT16827ETPACT?
For technical support, including CY74FCT16827ETPACT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY74FCT16827ETPACT requirements.
6.How does Aetrix verify that CY74FCT16827ETPACT is sourced from the original manufacturer or authorized distributors?
All CY74FCT16827ETPACT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY74FCT16827ETPACT meets industry standards.
7.What is the process for return or replacement of CY74FCT16827ETPACT?
All CY74FCT16827ETPACT units undergo pre-shipment inspection (PSI). If there is an issue with CY74FCT16827ETPACT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY74FCT16827ETPACT part is unused and in its original packaging.
Return procedure for CY74FCT16827ETPACT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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