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Texas Instruments CY74FCT827ATQCT
- Part No.:
- CY74FCT827ATQCT
- Manufacturer:
- Texas Instruments
- Package:
- 24-SSOP (0.154", 3.90mm Width)
- Datasheet:
-
CY74FCT827ATQCT.pdf
- Description:
- IC BUF NON-INVERT 5.25V 24SSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,146
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Product details
Overview
CY74FCT827ATQCT from Texas Instruments is a 10-bit noninverting buffer with dual 3-state output enables (OE1, OE2), designed for high-capacitance bus driving in industrial and telecom backplanes. It delivers 64-mA sink / 32-mA source drive strength, supports partial-power-down via Ioff (±1 µA at VCC = 0 V), and operates across –40°C to +85°C with 4.75–5.25 V supply. Its matched rise/fall times and edge-rate control reduce switching noise in dense PCB layouts.
For engineers reviewing the CY74FCT827ATQCT datasheet, CY74FCT827ATQCT pinout, CY74FCT827ATQCT application, or CY74FCT827ATQCT equivalent, key selection criteria include 3-state bus isolation capability, TTL-compatible input thresholds (VIL = 0.8 V, VIH = 2 V), 8 ns max propagation delay (CL = 50 pF), and SSOP-24 package compatibility with space-constrained board designs.
Technical Context
The CY74FCT827ATQCT implements dual NANDed output-enable logic: outputs go high-impedance when either OE1 or OE2 is high. Its FCT-family architecture ensures full TTL-level compatibility on both inputs and outputs while maintaining CMOS-like low input current (±1 µA) and low quiescent ICC (0.1–0.2 mA).
Edge-rate control circuitry actively limits dV/dt at outputs to suppress simultaneous switching noise (SSN), and the Ioff feature guarantees no backflow current during partial power-down-critical for hot-swap and mixed-voltage system designs where VCC may be unpowered while buses remain live.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 4.75–5.25 V - Ensures stable operation under industrial rail tolerances without external regulation. |
| Output Drive | 64 mA sink / 32 mA source - Drives heavy capacitive loads (e.g., >100 pF buses) without signal degradation. |
| Propagation Delay | 1.5–8 ns (CL = 50 pF) - Enables timing-critical 100+ MHz bus interfaces with margin. |
| Ioff Current | ±1 µA at VCC = 0 V - Prevents damaging backfeed current during partial power-down sequences. |
| Input Thresholds | VIL = 0.8 V, VIH = 2.0 V - Fully interoperable with legacy TTL logic without level shifters. |
| ESD Protection | 2000-V HBM, 200-V MM, 1000-V CDM - Meets stringent handling requirements for automated assembly lines. |
| Operating Temp | –40°C to +85°C - Qualified for extended-temperature industrial control and base station applications. |
Pinout & Package
Package: SSOP-24 (DBQ), 5.3 mm × 7.2 mm body, 0.65 mm pitch, RoHS-compliant NiPdAu finish, MSL Level-2-260°C-1 year.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4, 5, 6, 7, 8, 9, 10 | Data Inputs (D0–D9) | CMOS/TTL-compatible inputs accepting 0.8 V/2.0 V thresholds; low input capacitance (5 pF) minimizes bus loading. |
| 11, 12 | Output Enables (OE1, OE2) | NANDed logic: Yn = Dn when OE1 = OE2 = L; outputs enter high-Z if either OE is H - enables flexible bus arbitration. |
| 13–22 | 3-State Outputs (Y0–Y9) | Active-high noninverting buffers with matched rise/fall times; 12 pF output capacitance ensures clean edge integrity. |
| 23 | GND | Ground reference for all I/O and internal logic; dedicated pin reduces ground bounce in multi-bit switching. |
| 24 | VCC | 5-V supply pin; decoupling required within 1 cm due to high transient current (225 mA short-circuit peak). |
Key Features
| Feature | Design Value |
|---|---|
| Dual 3-state enable logic | Independent OE1/OE2 pins allow hierarchical bus control - e.g., OE1 for subsystem enable, OE2 for global reset override. |
| Edge-rate controlled outputs | Controlled slew rate reduces EMI and crosstalk in parallel bus routing, eliminating need for external series resistors. |
| Ioff partial-power-down support | Enables safe insertion/removal in live-backplane systems by blocking reverse current flow when VCC = 0 V. |
| TTL-compatible interface | Accepts standard TTL input voltages and drives TTL loads directly - eliminates level-shifter components in mixed-logic systems. |
| Matched rise/fall times | Ensures symmetrical signal edges (<10% skew), critical for setup/hold timing compliance in synchronous bus protocols. |
Applications
| Industrial Backplane Interface | Telecom Line Card Buffering |
|---|---|
Use Scenario: Isolating CPU address/data buses from high-capacitance backplane traces in programmable logic controllers. IC Role / Device Role / Timing Role: 10-bit bidirectional buffer providing 3-state isolation between processor and peripheral slots during DMA cycles. Use Value: 64-mA sink drive maintains signal integrity across 15-cm, 120-pF backplane runs; 8 ns propagation enables 125-MHz bus clocking. | Use Scenario: Driving differential line drivers (e.g., RS-422 transceivers) from FPGA-based channelized T1/E1 framers. IC Role / Device Role / Timing Role: Parallel data latch buffer synchronizing 10-bit parallel framing words before serial conversion. Use Value: Matched rise/fall times prevent duty-cycle distortion in timing-critical framing signals; Ioff prevents bus contention during hot-swap of line cards. |
| Automated Test Equipment (ATE) | Avionics Data Concentrator |
Use Scenario: Interfacing high-speed pattern generators to DUT load boards with variable capacitive loading (50–200 pF). IC Role / Device Role / Timing Role: Programmable impedance-matching buffer adjusting drive strength per test vector. Use Value: Edge-rate control suppresses ground bounce across 24-pin test fixtures; 8 ns delay allows sub-100-ns timing resolution. | Use Scenario: Aggregating ARINC 429 receiver outputs into a centralized flight management system data bus. IC Role / Device Role / Timing Role: Fault-tolerant bus driver isolating failed channel receivers from shared data path. Use Value: Dual OE pins enable independent channel disable; ±1 µA Ioff prevents power leakage during cold-spare channel standby. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 10-bit 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74FCT827ATSOCT | Same electrical specs, SOIC-24 package (15.4 mm × 7.5 mm vs SSOP's 7.2 mm × 5.3 mm); higher θJA (46°C/W vs 61°C/W). | Better suited for manual prototyping or low-density layouts where board area is less constrained than thermal budget. | Select when thermal derating margin exceeds 15°C or when existing SOIC footprints must be reused. |
| 74AC11010PC | Lower drive (24 mA sink), wider VCC range (2–6 V), no Ioff or edge-rate control; AC-family propagation delay ~9 ns. | Applicable only in non-hot-swap, single-rail 5-V systems with <50 pF loads and relaxed EMI requirements. | Choose only if cost sensitivity outweighs noise immunity, partial-power-down, and drive strength requirements. |
Compared with SN74FCT827ATSOCT and 74AC11010PC, the CY74FCT827ATQCT uniquely combines industrial temperature range, Ioff-enabled hot-swap safety, and edge-rate-controlled noise suppression - making it the sole option for high-reliability, high-density backplane buffering where layout space, thermal headroom, and system availability are simultaneously constrained.
Availability
CY74FCT827ATQCT is available at Aetrix Electronics and suitable for industrial backplane interface, telecom line card buffering, and avionics data concentrator applications requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CY74FCT827ATQCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a U.S.-based semiconductor company founded in 1930, specializing in analog, embedded processing, and logic solutions for industrial, automotive, and communications markets.
The CY74FCT827ATQCT belongs to TI's FCT logic family, engineered specifically for high-speed, low-noise bus interfacing in mission-critical systems where signal integrity, power sequencing robustness, and long-term component availability are mandatory.
FAQ
What is the maximum capacitive load the CY74FCT827ATQCT can reliably drive?
The CY74FCT827ATQCT is characterized for CL = 300 pF in datasheet switching tests, with tPLH/tPHL ≤17 ns. Its 64-mA sink capability supports sustained operation into ≥200 pF loads at 10 MHz without waveform degradation, provided proper PCB layout (short traces, ground plane) and local 0.1-µF decoupling at VCC pin. For >250 pF, verify timing margins using actual board parasitics.
Does the CY74FCT827ATQCT support hot-swap insertion while powered?
Yes - the CY74FCT827ATQCT incorporates Ioff circuitry that limits reverse current to ±1 µA when VCC = 0 V and bus voltages reach up to 4.5 V. This enables safe insertion into live backplanes. However, ensure OE1/OE2 are held low during insertion to avoid momentary bus contention, and confirm system-level hot-swap controller sequencing aligns with TI's recommended power-up order (GND → VCC → inputs).
How does the dual-output-enable (OE1/OE2) logic function in the CY74FCT827ATQCT?
The CY74FCT827ATQCT uses NANDed enable logic: all 10 outputs enter high-impedance state if either OE1 or OE2 is high. Only when both OE1 = OE2 = low do outputs follow D0–D9 inputs. This allows hierarchical control - e.g., OE1 tied to system enable, OE2 driven by local fault signal - enabling fail-safe bus isolation without additional logic gates.
Can the CY74FCT827ATQCT operate at 3.3 V supply?
No - the CY74FCT827ATQCT is specified only for 4.75–5.25 V operation (per Recommended Operating Conditions). Its TTL-compatible input thresholds and output drive strength assume 5-V rails. For 3.3-V systems, consider TI's 74LVC827A (3.3-V tolerant, 24-mA drive) or level-shifting solutions; substituting CY74FCT827ATQCT at 3.3 V violates absolute maximum ratings and risks functional failure.
What is the thermal resistance (θJA) of the CY74FCT827ATQCT in its SSOP-24 package?
The CY74FCT827ATQCT in SSOP-24 (DBQ) package has a published θJA of 61°C/W under JEDEC JESD 51-7 conditions (single-layer 1-in² copper pad). Actual board-level θJA depends on PCB copper area, layer count, and airflow; with 2-in² 2-oz copper pour and moderate convection, typical θJA drops to ~42°C/W. Always validate junction temperature using TI's thermal simulation tools or IR imaging under worst-case load (all 10 outputs sinking 64 mA).
CY74FCT827ATQCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74FCT
- Package/Case:
- 24-SSOP (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 1
- Number of Bits per Element:
- 10
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 32mA, 64mA
- Voltage - Supply:
- 4.75V ~ 5.25V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-SSOP
CY74FCT827ATQCT FAQ
1.How can I place an order for CY74FCT827ATQCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY74FCT827ATQCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY74FCT827ATQCT reliable?
The price and inventory of CY74FCT827ATQCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY74FCT827ATQCT is usually 5 days.
3.What payment methods are accepted for CY74FCT827ATQCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY74FCT827ATQCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY74FCT827ATQCT?
CY74FCT827ATQCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY74FCT827ATQCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY74FCT827ATQCT?
For technical support, including CY74FCT827ATQCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY74FCT827ATQCT requirements.
6.How does Aetrix verify that CY74FCT827ATQCT is sourced from the original manufacturer or authorized distributors?
All CY74FCT827ATQCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY74FCT827ATQCT meets industry standards.
7.What is the process for return or replacement of CY74FCT827ATQCT?
All CY74FCT827ATQCT units undergo pre-shipment inspection (PSI). If there is an issue with CY74FCT827ATQCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY74FCT827ATQCT part is unused and in its original packaging.
Return procedure for CY74FCT827ATQCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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