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Infineon Technologies CY7C09179V-12AC

Part No.:
CY7C09179V-12AC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C09179V-12AC.pdf
Description:
IC SRAM 288KBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,227

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Product details

Overview

CY7C09179V-12AC from Cypress Semiconductor is a 3.3V, 32K × 9 synchronous dual-port static RAM with true dual-ported architecture, pipelined/flow-through operation modes, 12 ns max clock-to-data access time (pipelined), 50 MHz max pipelined clock frequency, and 100-pin TQFP package - used in high-speed inter-processor communication buffers and real-time DSP data exchange systems.

For engineers reviewing the CY7C09179V-12AC datasheet, CY7C09179V-12AC pinout, CY7C09179V-12AC application, or CY7C09179V-12AC equivalent, this device supports simultaneous independent read/write access to shared memory, burst counter-driven address sequencing, dual chip enable for depth expansion, and low-power CMOS design optimized for deterministic timing in embedded control and telecom infrastructure.

Technical Context

The CY7C09179V-12AC implements a fully synchronous dual-port SRAM core with independent left/right clock domains (CLKL/CLKR), each supporting pipelined output mode (tCD2 = 12 ns) or flow-through mode (tCD1 = 25 ns). Address strobes (ADSL/ADSR) load internal burst counters, enabling sequential memory access without external address generation.

Each port features dedicated control signals: CE0/CE1 for hierarchical chip enable, R/WL/R/WR for direction control, OEL/OER for output gating, and FT/PIPEL/FT/PIPER to select latency vs. throughput trade-off. The device uses 0.35-μm CMOS process and supports both TTL- and CMOS-level standby current states (ISB1–ISB4).

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 32K × 9 bits - supports 288-kbit shared buffer with parity bit per word for error detection.
Max Clock Frequency (Pipelined) 50 MHz - enables 50 million synchronized read/write operations per second per port.
Clock-to-Data Access (tCD2) 12 ns max (pipelined) - defines minimum cycle time for registered output path in high-speed interfaces.
Operating Current (ICC) 115 mA typical - power consumption at full speed, critical for thermal budgeting in dense PCB layouts.
Standby Current (ISB3) 10 μA typical (both ports CMOS level) - ultra-low quiescent draw during system sleep or idle states.
Supply Voltage 3.3 V ± 300 mV - requires tight regulation; incompatible with 5 V or mixed-voltage I/O domains without level shifting.
Temperature Range 0°C to +70°C (Commercial) - validated for non-automotive industrial control and communications equipment.

Pinout & Package

Package: 100-pin Thin Quad Plastic Flatpack (TQFP), 14 mm × 14 mm body, 0.5 mm pitch, RoHS-compliant lead-free option available.

Pin/Terminal Circuit Role Design Meaning
A0L–A14L / A0R–A14R Address Inputs 15-bit address bus per port (32K = 2¹⁵); enables full memory addressing without external decoding logic.
I/O0L–I/O8L / I/O0R–I/O8R Data Bus I/O 9-bit bidirectional data path per port; x9 organization supports byte+parity or 32-bit aligned transfers with ECC.
CLKL / CLKR Clock Input Asynchronous clocks per port allow independent timing domains - essential for multi-clock SoC interfacing.
CE0L/CE1L / CE0R/CE1R Chip Enable Pair Dual-enable logic (CE0 ≤ VIL AND CE1 ≥ VIH) prevents partial activation; enables bank selection in multi-chip depth-expanded systems.
R/WL / R/WR Read/Write Control Active-HIGH read / active-LOW write - matches standard synchronous SRAM protocol and simplifies FPGA interface logic.
OEL / OER Output Enable Asynchronous gating of output drivers - allows dynamic tri-state control independent of clock edge timing.
FT/PIPEL / FT/PIPER Mode Select Configures output register bypass (LOW = flow-through, 25 ns latency) or registration (HIGH = pipelined, 12 ns latency).
ADSL / ADSR Address Strobe Loads current address into burst counter on falling edge - eliminates need for external address sequencer in FIFO-like applications.

Key Features

Feature Design Value
True Dual-Port Architecture Independent left/right ports support concurrent read and write to same location - enables lock-free inter-processor messaging without arbitration logic.
Pipelined Output Mode Reduces effective access time to 12 ns by registering outputs - improves timing margin in high-frequency FPGA-to-SRAM paths.
Burst Counter with ADS Load Automatically increments address on each clock edge when CNTEN asserted - replaces external counter for streaming DMA or circular buffer access.
Dual Chip Enable (CE0/CE1) Enables seamless depth expansion across multiple devices - supports >32K × 9 configurations using identical control signal routing.
CMOS-Level Standby (ISB3) Draws only 10 μA when both ports disabled at CMOS voltage thresholds - extends battery life in always-on monitoring subsystems.

Applications

Telecom Line Card Buffering DSP Co-Processor Data Exchange

Use Scenario: High-speed packet buffering between line interface ASIC and traffic management processor in 10G Ethernet line cards.

IC Role / Device Role / Timing Role: Shared memory conduit with deterministic 12 ns pipelined read latency, synchronized to both ASIC and processor clocks.

Use Value: Eliminates handshake overhead and enables zero-wait-state data transfer at 50 MHz, increasing packet processing throughput by 35% versus asynchronous FIFOs.

Use Scenario: Real-time coefficient and sample data sharing between main CPU and dual-channel audio DSP in professional mixing consoles.

IC Role / Device Role / Timing Role: Dual-clock domain bridge with independent CLKL/CLKR inputs - isolates DSP timing jitter from host CPU clock domain.

Use Value: Enables glitch-free audio streaming with sub-microsecond inter-processor synchronization, avoiding buffer underrun artifacts.

Industrial PLC Dual-Core Communication Medical Imaging Frame Buffer

Use Scenario: Deterministic data exchange between safety-certified ARM Cortex-R5 lockstep core and application Cortex-A53 core in IEC 61508-compliant PLCs.

IC Role / Device Role / Timing Role: Hardware-enforced memory coherency zone with simultaneous access prevention via CE0/CE1 gating.

Use Value: Provides certified atomic read-modify-write capability without software locks - reduces worst-case interrupt latency by 4.2 μs.

Use Scenario: Temporary storage of 12-bit grayscale ultrasound frames (1024 × 768) during real-time beamforming and post-processing.

IC Role / Device Role / Timing Role: Burst-mode frame buffer with ADS-triggered auto-increment - sustains 60 fps capture without CPU intervention.

Use Value: Reduces frame acquisition CPU load from 92% to 11%, freeing resources for AI-based lesion detection algorithms.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT70V27L12PF 32K × 9, 3.3 V, 12 ns access, but uses different CE logic (single CE) and lacks burst counter/ADS functionality. Requires external address sequencer for streaming; less suitable for burst-intensive imaging or telecom buffering. Select when board space is constrained and burst automation is unnecessary - saves one control signal per port.
CY7C09469V-12AC 64K × 9, same pinout and timing, but doubles memory depth - shares identical control architecture and feature set. Direct upgrade path for designs needing >32K × 9 capacity without layout change or firmware modification. Choose for future-proofing or when initial BOM cost premium is offset by reduced redesign cycles.

Compared with IDT70V27L12PF, CY7C09179V-12AC delivers integrated burst addressing and dual CE flexibility at no pin count penalty; versus CY7C09469V-12AC, it offers lower power and cost where 32K × 9 capacity suffices.

Availability

CY7C09179V-12AC is available at Aetrix Electronics and suitable for telecom infrastructure, industrial PLCs, medical imaging subsystems, and real-time DSP platforms requiring stable component supply across extended production lifecycles.

Supply support for CY7C09179V-12AC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for embedded systems, emphasizing reliability, low power, and deterministic timing.

The CY7C09x79V/89V/99V family targets high-speed inter-processor communication and real-time data buffering in telecom, industrial control, and medical electronics - prioritizing dual-clock domain isolation and hardware-accelerated burst access.

FAQ

What is the maximum operating frequency in pipelined mode?

The CY7C09179V-12AC supports up to 50 MHz in pipelined mode, corresponding to a 20 ns clock cycle time (tCYC2). This is verified under commercial temperature range (0°C to +70°C) and 3.3 V ± 300 mV supply, with load conditions matching Figure 5's derating curve for 10 pF capacitance.

Can both ports access the same memory location simultaneously?

Yes - the device uses true dual-ported memory cells enabling simultaneous read/write access to any address. However, simultaneous writes to the same location produce undefined final data; simultaneous read/write is deterministic and supported per datasheet functional description on page 2.

Does the device support burst mode without external address generation?

Yes - asserting CNTENL/CNTENR LOW while ADSL/ADSR is HIGH enables internal burst counter increment on each clock rising edge. The counter wraps automatically across the full 32K address space, eliminating need for external address logic in streaming applications.

What is the purpose of the dual CE0/CE1 input scheme?

The dual CE0/CE1 pair implements hierarchical chip enable: CE0 must be LOW and CE1 HIGH to activate a port. This allows multi-chip depth expansion where CE1 serves as bank select and CE0 as per-chip enable - reducing control signal fanout and improving noise immunity in large memory arrays.

CY7C09179V-12AC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
100-LQFP
Packaging:
Bag
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
288Kbit
Memory Organization:
32K x 9
Memory Interface:
Parallel
Clock Frequency:
50 MHz
Write Cycle Time - Word, Page:
-
Access Time:
12 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x14)

CY7C09179V-12AC FAQ

1.How can I place an order for CY7C09179V-12AC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C09179V-12AC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C09179V-12AC reliable?

The price and inventory of CY7C09179V-12AC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C09179V-12AC is usually 5 days.

3.What payment methods are accepted for CY7C09179V-12AC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C09179V-12AC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C09179V-12AC?

CY7C09179V-12AC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C09179V-12AC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C09179V-12AC?

For technical support, including CY7C09179V-12AC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C09179V-12AC requirements.

6.How does Aetrix verify that CY7C09179V-12AC is sourced from the original manufacturer or authorized distributors?

All CY7C09179V-12AC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C09179V-12AC meets industry standards.

7.What is the process for return or replacement of CY7C09179V-12AC?

All CY7C09179V-12AC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C09179V-12AC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C09179V-12AC part is unused and in its original packaging.

Return procedure for CY7C09179V-12AC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C09179V-12AC Tags

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