Infineon Technologies CY7C1009D-10VXIT
- Part No.:
- CY7C1009D-10VXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 32-BSOJ (0.300", 7.62mm Width)
- Datasheet:
-
CY7C1009D-10VXIT.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 32SOJ
- Quantity:
- Payment:

- Shipping:

Inventory:1,118
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1009D-10VXIT from Cypress Semiconductor is a 1-Mbit (128 K × 8) high-speed CMOS static RAM with 10 ns access time, 5 V supply operation, TTL-compatible I/O, and automatic CE power-down. It features 32-pin 300-mil SOJ packaging, 2.0 V data retention, and dual chip enable (CE1 active LOW, CE2 active HIGH) for flexible memory expansion in embedded control systems.
For engineers reviewing the CY7C1009D-10VXIT datasheet, CY7C1009D-10VXIT pinout, CY7C1009D-10VXIT application, or CY7C1009D-10VXIT equivalent, key selection criteria include tAA ≤ 10 ns read timing, ISB2 = 3 mA CMOS standby current, VCC = 5 V ± 0.5 V operation, and compatibility with legacy 5 V microcontrollers requiring TTL-level inputs.
Technical Context
The CY7C1009D-10VXIT implements a synchronous, non-volatile-retentive SRAM architecture with tri-state bidirectional I/O drivers and independent CE1/CE2 control logic enabling hierarchical memory mapping. Its address decoding supports full 17-bit addressing (A0–A16) for 131,072 × 8-bit organization and uses internal sense amplifiers for reliable read stability under varying load conditions.
Power management is handled via automatic CE-driven power-down: ISB2 = 3 mA is achieved when CE1 > VCC – 0.3 V or CE2 < 0.3 V with CMOS input thresholds, while ISB1 = 10 mA applies under TTL input conditions. Data retention at VDR = 2.0 V is supported with tCDR = 0 ns chip deselect-to-retention transition.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| tAA | 10 ns maximum address-to-data valid delay - ensures compatibility with 100 MHz bus timing budgets |
| ICC (active) | 80 mA at 10 ns - defines peak power draw during burst read/write cycles at rated speed |
| ISB2 (standby) | 3 mA at VCC = 5 V - enables low-power hold mode when deselected using CMOS-compatible CE thresholds |
| VDR | 2.0 V minimum retention voltage - allows battery-backed operation during main supply brownout |
| VIL / VIH | 0.8 V / 2.2 V TTL input thresholds - guarantees interoperability with legacy 5 V microcontrollers and FPGAs |
| tRC | 10 ns read cycle time - sets minimum interval between successive read operations without wait states |
| Capacitance | 8 pF typical input/output capacitance - constrains trace length and fanout in high-speed PCB layout |
Pinout & Package
Package: 32-pin 300-mil wide molded SOJ (Small Outline J-lead), RoHS-compliant, lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit address bus supporting full 128 K-word addressing; no internal latching |
| I/O0–I/O7 | Bidirectional Data Bus | Tri-state CMOS drivers with 8 mA sink capability; high-impedance when CE1 HIGH, CE2 LOW, or OE HIGH |
| CE1 | Active-LOW Chip Enable | Primary selection signal; must be LOW with CE2 HIGH to enable read/write; initiates automatic power-down when HIGH |
| CE2 | Active-HIGH Chip Enable | Secondary enable; complements CE1 for multi-chip decode; forces power-down when LOW |
| OE | Active-LOW Output Enable | Controls output driver state independently of CE; enables data output only when CE1 LOW and CE2 HIGH |
| WE | Active-LOW Write Enable | Initiates write cycle when CE1 LOW and CE2 HIGH; disables outputs during write (I/O pins become inputs) |
| VCC | Power Supply | +5.0 V ± 0.5 V nominal; supplies core logic and I/O buffers; decoupling required per JEDEC guidelines |
| GND | Ground Reference | Signal and power return path; requires low-inductance connection to minimize switching noise |
Key Features
| Feature | Design Value |
|---|---|
| Dual Chip Enable (CE1/CE2) | Enables hierarchical memory banking and seamless expansion beyond 128 K words without external logic |
| TTL-Compatible I/O | Guarantees direct interface with legacy 5 V microcontrollers (e.g., Intel 80C188, Motorola 68HC11) without level-shifting |
| Automatic Power-Down | Reduces standby current to 3 mA without external control signals-critical for battery-backed systems |
| 2.0 V Data Retention | Preserves memory contents during main supply interruption down to 2.0 V, supporting graceful shutdown sequences |
| 10 ns Access Time | Meets timing requirements of 100 MHz CPU buses with zero wait states in read-modify-write cycles |
Applications
| Industrial PLC Data Buffering | Automotive Engine Control Unit (ECU) Scratchpad |
|---|---|
Use Scenario: Storing real-time sensor fusion results and intermediate control calculations in programmable logic controllers with 5 V backplane buses. IC Role / Device Role / Timing Role: High-reliability, non-refreshing scratchpad memory interfaced directly to 80C186-based control processors. Use Value: 10 ns tAA eliminates wait states on 100 MHz instruction fetch, while 3 mA ISB2 extends backup battery life during maintenance mode. | Use Scenario: Holding transient calibration tables and fault logs in engine control modules operating across –40 °C to +125 °C ambient range. IC Role / Device Role / Timing Role: Temperature-stable SRAM providing deterministic read/write latency for safety-critical fuel injection timing routines. Use Value: 2.0 V data retention ensures EEPROM-like persistence during cranking voltage drop, and SOJ package withstands automotive thermal cycling. |
| Medical Infusion Pump Memory | Avionics Display Controller Frame Buffer |
Use Scenario: Caching dosage history and alarm thresholds in Class II medical devices requiring long-term data integrity and low-power sleep modes. IC Role / Device Role / Timing Role: Battery-backed volatile memory serving as secure, fast-access log buffer with deterministic access timing. Use Value: ISB2 = 3 mA enables >72-hour backup runtime on coin-cell batteries; Pb-free SOJ meets IEC 60601-1 soldering compliance. | Use Scenario: Supporting dual-buffered graphics rendering in cockpit display units where EMI resilience and thermal stability are mandatory. IC Role / Device Role / Timing Role: Dedicated frame buffer memory synchronized to video controller clock with jitter-free read timing. Use Value: tHZOE = 5 ns ensures clean pixel data transitions between buffer swaps; 8 pF COUT minimizes signal distortion on 15 cm flex traces. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS6C1008-10TIN | 10 ns access, 3.3 V only, 28-pin SOJ, ISB = 1 μA | Requires level translation for 5 V systems; lower standby power but incompatible VCC range | Select only if migrating to 3.3 V architecture and redesigning power delivery |
| IS61LV102410AL-10TLI | 10 ns access, 3.3 V supply, 32-pin TSOP, ISB = 12 μA | Lacks CE2 pin; single CE simplifies decode but limits multi-bank expansion | Prefer for space-constrained designs needing TSOP footprint, not for 5 V legacy upgrades |
Compared with AS6C1008-10TIN and IS61LV102410AL-10TLI, CY7C1009D-10VXIT uniquely supports 5 V TTL interfacing and dual CE expansion without voltage translation or board redesign-making it the only drop-in replacement for existing industrial 5 V SRAM sockets.
Availability
CY7C1009D-10VXIT is available at Aetrix Electronics and suitable for industrial PLC data buffering, automotive ECU scratchpad, and medical infusion pump memory requiring stable component supply and long-lifecycle support.
Supply support for CY7C1009D-10VXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in memory, microcontrollers, and programmable system-on-chip solutions for industrial, automotive, and consumer applications.
The CY7C1009D belongs to Cypress's legacy parallel SRAM product line, designed specifically for pin-compatible migration from older NMOS and CMOS SRAMs in 5 V embedded systems requiring deterministic timing and TTL-level interoperability.
FAQ
Is CY7C1009D-10VXIT compatible with 3.3 V systems?
No. The device requires VCC = 5.0 V ± 0.5 V and specifies TTL input thresholds (VIH = 2.2 V min, VIL = 0.8 V max). Driving inputs from 3.3 V logic may result in marginal VIH margin and is not guaranteed per datasheet electrical characteristics. Use level translators or select a 3.3 V SRAM variant.
What is the function of the NC pin on CY7C1009D-10VXIT?
Pin 18 is marked NC (No Connect) in the 32-pin SOJ pinout and is not bonded to the die. It must remain unconnected on the PCB; routing traces or applying voltage to this pin violates the device's maximum ratings and may cause functional failure or accelerated wear-out.
Does CY7C1009D-10VXIT support asynchronous burst reads?
No. It is a static RAM with no internal burst counter or sequential address generation. Each read requires a full address setup (tAA = 10 ns) and valid CE1/OE assertion. Burst transfers must be implemented externally via address sequencing logic or processor DMA with individual address writes.
Can CY7C1009D-10VXIT retain data during VCC ramp-down?
Yes. When VCC drops to ≥2.0 V and CE1 is deasserted (HIGH) or CE2 is deasserted (LOW), the device enters data retention mode with ICCDR ≤ 3 mA. Data remains valid as long as VCC stays ≥2.0 V and temperature remains within –40 °C to +85 °C; no external hold signal is required.
CY7C1009D-10VXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 32-BSOJ (0.300", 7.62mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 128K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-SOJ
CY7C1009D-10VXIT FAQ
1.How can I place an order for CY7C1009D-10VXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1009D-10VXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1009D-10VXIT reliable?
The price and inventory of CY7C1009D-10VXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1009D-10VXIT is usually 5 days.
3.What payment methods are accepted for CY7C1009D-10VXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1009D-10VXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1009D-10VXIT?
CY7C1009D-10VXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1009D-10VXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1009D-10VXIT?
For technical support, including CY7C1009D-10VXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1009D-10VXIT requirements.
6.How does Aetrix verify that CY7C1009D-10VXIT is sourced from the original manufacturer or authorized distributors?
All CY7C1009D-10VXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1009D-10VXIT meets industry standards.
7.What is the process for return or replacement of CY7C1009D-10VXIT?
All CY7C1009D-10VXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1009D-10VXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1009D-10VXIT part is unused and in its original packaging.
Return procedure for CY7C1009D-10VXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1009D-10VXIT Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

