Infineon Technologies CY7C1011DV33-10BVXIT

Overview

CY7C1011DV33-10BVXIT from Cypress Semiconductor is a 2-Mbit (128 K × 16) asynchronous CMOS static RAM with 10 ns access time, 3.3 V supply, and dual-byte write control via BHE/ BLE. It operates across –40 °C to +85 °C and supports independent upper/lower byte writes in industrial embedded systems requiring deterministic timing and low-power standby.

For engineers reviewing the CY7C1011DV33-10BVXIT datasheet, CY7C1011DV33-10BVXIT pinout, CY7C1011DV33-10BVXIT application, or CY7C1011DV33-10BVXIT equivalent, this page delivers verified package mapping, functional pin roles, real-world SRAM expansion use cases, and validated alternatives for memory subsystem design.

Technical Context

The device implements a fully asynchronous 128 K × 16-bit memory array with separate Byte High Enable (BHE) and Byte Low Enable (BLE) inputs, enabling granular 8-bit writes without external logic. Address decoding uses 17 address lines (A0–A16) to select one of 131,072 words.

It features automatic CE-controlled power-down into CMOS standby mode (ISB2 = 10 mA), data retention down to 2.0 V, and high-impedance I/O states during deselect, OE HIGH, or write cycles - all critical for bus-sharing and low-noise system integration.

Key Specifications

Pinout & Package

Available in Pb-free 48-ball VFBGA (package code BVXI) with 0.5 mm pitch and center power/ground layout optimized for signal integrity and thermal dissipation in dense PCB layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar asynchronous SRAM applications.

Compared with IS61LV102416-10ML and MC10116P, CY7C1011DV33-10BVXIT uniquely combines 10 ns speed, 3.3 V operation, VFBGA packaging, and true dual-byte write capability - making it optimal for space-constrained, low-voltage, high-throughput embedded memory subsystems.

Availability

CY7C1011DV33-10BVXIT is available at Aetrix Electronics and suitable for industrial PLC memory buffers, medical imaging frame stores, avionics data loggers, and test & measurement equipment requiring stable component supply and long-term manufacturability.

Supply support for CY7C1011DV33-10BVXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in memory, microcontrollers, and connectivity solutions for industrial, automotive, and consumer applications.

CY7C1011DV33 belongs to Cypress's high-speed asynchronous SRAM product line, designed specifically for deterministic, low-latency memory interfacing in FPGA- and microcontroller-based systems where timing predictability and bus flexibility are critical.

FAQ

Is CY7C1011DV33-10BVXIT pin-compatible with CY7C1011CV33?

Yes - the datasheet explicitly states pin-and function-compatibility with CY7C1011CV33. Both share identical pinouts, electrical characteristics, and timing parameters, allowing drop-in replacement in existing designs using the CV33 variant, provided the VFBGA footprint matches the BVXI package.

What is the maximum clock frequency supported for burst read operations?

This is an asynchronous SRAM and has no internal clock. Its maximum effective throughput is governed by tRC = 10 ns, enabling up to 100 million read cycles per second when continuously accessed. System-level bandwidth depends on bus arbitration and controller timing margins, not a clock domain.

Can BHE and BLE be asserted simultaneously for full 16-bit writes?

Yes - asserting both BHE and BLE LOW while CE and WE are LOW performs a full 16-bit write to the addressed location. The device treats this as a standard write cycle; no timing penalty or restriction applies beyond standard AC specifications.

Does the VFBGA package require special PCB layout considerations?

Yes - the 48-ball VFBGA (0.5 mm pitch) requires controlled-impedance routing, thermal vias under the die pad, and strict solder mask-defined pads. Cypress recommends 8–10 thermal vias in the central ground area and 5-mil trace widths for signal integrity at 10 ns timing margins.