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Infineon Technologies CY7C1011DV33-10ZSXI
- Part No.:
- CY7C1011DV33-10ZSXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1011DV33-10ZSXI.pdf
- Description:
- IC SRAM 2MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:
- Shipping:
Inventory:308
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Product details
Overview
CY7C1011DV33-10ZSXI from Cypress Semiconductor is a 2-Mbit (256 K × 8) high-speed CMOS static RAM with 10 ns access time, 3.3 V supply, TTL-compatible I/O, and automatic CE-controlled power-down. It operates across –40 °C to +85 °C and supports memory expansion via active-low CE, OE, and WE control signals in industrial embedded systems.
For engineers reviewing the CY7C1011DV33-10ZSXI datasheet, CY7C1011DV33-10ZSXI pinout, CY7C1011DV33-10ZSXI application, or CY7C1011DV33-10ZSXI equivalent, this page delivers verified timing parameters, package-mapped pin functions, retention behavior at 2.0 V, and real-world SRAM interface design context for legacy industrial controllers and FPGA co-processor buffers.
Technical Context
The CY7C1011DV33-10ZSXI implements a fully asynchronous 256 K × 8 SRAM array with three-state bidirectional I/Os (I/O0–I/O7), address decoding up to A0–A17, and dual power/ground pins (VCC/GND) in a 44-pin TSOP II package. Its CE-driven automatic power-down reduces standby current to 10 mA while maintaining data retention at 2.0 V.
Read operations require CE and OE low with WE high; write operations require CE and WE low. Output enable timing (tDOE = 5 ns) and chip-enable propagation (tACE = 10 ns) are specified under 30 pF load and 1 V/ns edge rates, supporting tight-cycle microcontroller bus interfacing without wait states.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| tAA | 10 ns - maximum address-to-data valid delay; enables zero-wait-state operation with 100 MHz bus clocks |
| ICC (active) | 90 mA at 10 ns - peak operating current defining PCB trace width and local decoupling requirements |
| ISB2 (standby) | 10 mA - CMOS-mode standby current when CE > VCC – 0.3 V, enabling low-power sleep modes |
| VDR | 2.0 V - minimum VCC for data retention; allows battery-backed hold during main supply loss |
| Address range | A0–A17 - 18-bit addressing supporting 256 K words; matches standard 8-bit microcontroller data buses |
| I/O interface | TTL-compatible - accepts 0.8 V/2.0 V logic thresholds and drives ±4 mA/8 mA loads directly |
| Package | 44-pin TSOP II - surface-mount, center-power/ground pinout; compatible with JEDEC MO-141BA footprint |
Pinout & Package
44-pin TSOP II package with center power (pins 23, 24 = VCC) and ground (pins 21, 22 = GND); pinout follows "revolutionary" layout optimized for signal integrity and thermal dissipation in dense PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address inputs | 18-bit unidirectional address bus; decoded internally to select one of 256 K locations |
| I/O0–I/O7 | Bidirectional data I/O | Three-state CMOS drivers; high-impedance when CE HIGH, OE HIGH, or WE LOW |
| CE | Chip Enable (active low) | Primary device select; triggers automatic power-down when deasserted (HIGH) |
| OE | Output Enable (active low) | Controls output buffer enable; must be LOW with CE LOW for read access |
| WE | Write Enable (active low) | Controls write latch; LOW with CE LOW initiates write cycle; HIGH enables read mode |
| VCC (pins 23, 24) | Supply voltage | 3.3 V ± 0.3 V primary power; dual pins reduce IR drop and improve noise immunity |
| GND (pins 21, 22) | Ground reference | Dual ground pins provide low-inductance return path for I/O and core switching currents |
Key Features
| Feature | Design Value |
|---|---|
| 10 ns access time | Enables direct attachment to 100 MHz microcontroller buses without wait-state insertion |
| Automatic CE power-down | Reduces ICC from 90 mA to 10 mA instantly on CE deassertion-no external control logic needed |
| 2.0 V data retention | Preserves memory contents during brown-out or backup-battery operation without refresh |
| TTL-compatible I/O | Eliminates level-shifter requirements when interfacing with legacy 5 V or mixed-voltage systems |
| Easy memory expansion | CE/OE/WE control scheme supports daisy-chained or bank-switched multi-SRAM configurations |
Applications
| Industrial PLC Data Buffers | FPGA Configuration Cache |
|---|---|
|
Use Scenario: Storing real-time I/O status and ladder logic variables in programmable logic controllers with deterministic scan cycles. IC Role / Device Role / Timing Role: Asynchronous data buffer between ARM Cortex-M4 CPU and field I/O modules; accessed via parallel bus with fixed 10 ns latency. Use Value: 10 ns tAA ensures consistent response within 100 µs PLC scan windows; 2.0 V retention maintains state during brief AC line dips. |
Use Scenario: Holding configuration bitstreams and runtime lookup tables for Xilinx Spartan-6 FPGAs in reconfigurable test equipment. IC Role / Device Role / Timing Role: External configuration RAM mapped into FPGA's AXI HP slave interface; accessed as burst-capable memory region. Use Value: TTL-compatible I/O eliminates level translation; 44-pin TSOP II fits compact carrier boards with minimal routing congestion. |
| Medical Imaging Frame Stores | Avionics Display Controllers |
|
Use Scenario: Temporary storage of digitized ultrasound frames before compression and transmission in portable diagnostic devices. IC Role / Device Role / Timing Role: Dual-port accessible SRAM used as ping-pong frame buffer; CE toggled per frame to manage power during idle intervals. Use Value: ISB2 = 10 mA extends battery life during inter-frame processing; tHZOE = 5 ns supports rapid pixel-readout timing. |
Use Scenario: Storing font glyphs, overlay graphics, and HUD metadata in certified cockpit display units requiring DO-254 compliance. IC Role / Device Role / Timing Role: Nonvolatile shadow RAM holding critical display assets; powered from isolated 3.3 V rail with 2.0 V retention margin. Use Value: Pin-compatible replacement for CY7C1010CV33 simplifies DO-254 hardware reuse; –40 °C to +85 °C rating meets RTCA/DO-160 environmental profiles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61LV25616AL-10TLI | 256 K × 16 organization, 32-pin SOJ, 3.3 V only, tAA = 10 ns, ISB = 25 µA | Wider data bus (16-bit) but incompatible pinout; lower standby current but no 2.0 V retention | Select for higher bandwidth needs where board layout allows SOJ and 16-bit bus alignment |
| AS6C4008-10TIN | 512 K × 8 organization, 44-pin TSOP II, 3.3 V, tAA = 10 ns, ISB = 1 µA, VDR = 2.2 V | Double density, same footprint, lower standby, slightly higher retention voltage | Choose for capacity upgrade paths with identical PCB land pattern and improved power efficiency |
Compared with IS61LV25616AL-10TLI and AS6C4008-10TIN, the CY7C1011DV33-10ZSXI offers guaranteed 2.0 V data retention and industrial temperature support out-of-box, making it preferable for brown-out-resilient designs where pin compatibility with legacy Cypress SRAMs is required.
Availability
CY7C1011DV33-10ZSXI is available at Aetrix Electronics and suitable for industrial PLC data buffers, FPGA configuration caches, and medical imaging frame stores requiring stable component supply and long-term obsolescence management.
Supply support for CY7C1011DV33-10ZSXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable system-on-chip solutions for industrial, automotive, and aerospace applications.
The CY7C1011DV33 belongs to Cypress's legacy parallel SRAM product line, engineered for deterministic, low-latency data buffering in resource-constrained embedded systems with strict timing and power constraints.
FAQ
Is CY7C1011DV33-10ZSXI pin-compatible with CY7C1010DV33?
Yes. CY7C1011DV33-10ZSXI shares identical 44-pin TSOP II pinout, signal assignments, and electrical characteristics with CY7C1010DV33. Both use the same "revolutionary" center VCC/GND layout and support identical CE/OE/WE control protocols. No PCB redesign is required for migration.
What is the maximum clock frequency supported for burst reads?
The CY7C1011DV33-10ZSXI does not support synchronous burst reads-it is an asynchronous SRAM. Maximum effective throughput is determined by tRC = 10 ns, yielding up to 100 million random accesses per second. Burst transfers require external address sequencing logic or controller-side pipelining.
Does this SRAM require external refresh circuitry?
No. As a static RAM, CY7C1011DV33-10ZSXI retains data indefinitely while powered and requires no refresh cycles. During data retention mode (VCC = 2.0 V, CE HIGH), it holds stored bits without any external timing or control signals-only stable bias is needed.
Can CY7C1011DV33-10ZSXI operate at 2.5 V supply?
No. The device is specified only for 3.3 V ± 0.3 V operation (3.0 V to 3.6 V). Operation at 2.5 V violates the Absolute Maximum Ratings and will result in undefined behavior, including failure to meet tAA ≤ 10 ns or data corruption. Use only within the rated VCC range.
CY7C1011DV33-10ZSXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 2Mbit
- Memory Organization:
- 128K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY7C1011DV33-10ZSXI FAQ
1.How can I place an order for CY7C1011DV33-10ZSXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1011DV33-10ZSXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1011DV33-10ZSXI reliable?
The price and inventory of CY7C1011DV33-10ZSXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1011DV33-10ZSXI is usually 5 days.
3.What payment methods are accepted for CY7C1011DV33-10ZSXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1011DV33-10ZSXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1011DV33-10ZSXI?
CY7C1011DV33-10ZSXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1011DV33-10ZSXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1011DV33-10ZSXI?
For technical support, including CY7C1011DV33-10ZSXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1011DV33-10ZSXI requirements.
6.How does Aetrix verify that CY7C1011DV33-10ZSXI is sourced from the original manufacturer or authorized distributors?
All CY7C1011DV33-10ZSXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1011DV33-10ZSXI meets industry standards.
7.What is the process for return or replacement of CY7C1011DV33-10ZSXI?
All CY7C1011DV33-10ZSXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1011DV33-10ZSXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1011DV33-10ZSXI part is unused and in its original packaging.
Return procedure for CY7C1011DV33-10ZSXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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