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Infineon Technologies CY7C1011DV33-10ZSXIT

Part No.:
CY7C1011DV33-10ZSXIT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
44-TSOP (0.400", 10.16mm Width)
Datasheet:
AetrixCY7C1011DV33-10ZSXIT.pdf
Description:
IC SRAM 2MBIT PARALLEL 44TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:398

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Product details

Overview

CY7C1011DV33-10ZSXIT from Cypress Semiconductor is a 2-Mbit (128 K × 16) high-speed CMOS static RAM with 10 ns access time, 3.3 V supply, and independent byte enable (BHE/ BLE) for 16-bit data bus partitioning. It supports automatic CE-controlled power-down, data retention at 2.0 V, and operates across –40 °C to +85 °C for industrial embedded memory applications.

For engineers reviewing the CY7C1011DV33-10ZSXIT datasheet, CY7C1011DV33-10ZSXIT pinout, CY7C1011DV33-10ZSXIT application, or CY7C1011DV33-10ZSXIT equivalent, key selection criteria include tAA = 10 ns read timing, ISB2 = 10 µA standby current, dual-byte write control, TSOP II / VFBGA package options, and compatibility with legacy CY7C1011CV33-based designs.

Technical Context

The device implements a synchronous, non-volatile-retentive SRAM architecture with fully decoded 17-bit address space (A0–A16), supporting concurrent upper- and lower-byte writes via separate BHE and BLE controls. Its I/O pins (I/O0–I/O15) enter high-impedance state during deselection (CE HIGH), output disable (OE HIGH), or write cycles (WE LOW).

Timing behavior is defined by strict AC parameters including tACE = 10 ns (CE LOW to data valid), tDOE = 5 ns (OE LOW to data valid), and tPD = 10 ns (CE HIGH to power-down), enabling integration into fast microcontroller and FPGA memory interfaces requiring deterministic latency and low-power idle states.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Size2 Mbit (128 K × 16) - supports full 16-bit parallel data bus without external multiplexing
Access Time (tAA)10 ns - enables direct interface with 100 MHz microcontrollers without wait states
Supply Voltage3.3 V ±0.3 V - compatible with standard LVCMOS I/O domains and eliminates level-shifting needs
Active Current (ICC)90 mA @ 10 ns - defines peak power draw during burst read/write sequences
Standby Current (ISB2)10 µA - enables ultra-low-power hold mode when CE is deasserted in CMOS input configuration
Data Retention Voltage2.0 V - allows battery-backed operation or brown-out survival without data loss
Operating Temperature–40 °C to +85 °C - qualified for industrial-grade embedded systems with thermal cycling

Pinout & Package

Available in Pb-free 44-pin TSOP II (standard center power/ground pinout) and 48-ball VFBGA packages. This part uses the TSOP II variant per ordering code "ZSXIT".

Pin/TerminalCircuit RoleDesign Meaning
A0–A16Address Inputs17-bit row/column decode path selecting one of 128 K locations
I/O0–I/O7Lower-Byte Data I/OBi-directional 8-bit bus controlled by BLE; isolated during BHE-only operations
I/O8–I/O15Upper-Byte Data I/OBi-directional 8-bit bus controlled by BHE; isolated during BLE-only operations
CEChip EnablePrimary device select; enables automatic power-down when HIGH in CMOS mode
OEOutput EnableGates read data output drivers; must be LOW with CE LOW and WE HIGH for valid reads
WEWrite EnableControls write latch; LOW with CE LOW initiates write cycle regardless of OE state
BLEByte Low EnableEnables write/read on I/O0–I/O7 only; permits partial-word updates without disturbing upper byte
BHEByte High EnableEnables write/read on I/O8–I/O15 only; supports 8-bit peripheral coexistence on shared bus

Key Features

FeatureDesign Value
Pin- and function-compatible with CY7C1011CV33Drop-in replacement for legacy 2-Mbit SRAM designs without PCB or firmware changes
Independent upper/lower byte controlEliminates need for external byte masking logic in mixed 8/16-bit system architectures
Automatic CE power-down (ISB2 = 10 µA)Reduces system standby power without requiring external sleep controllers or sequencing
Data retention at 2.0 VPermits use with single-cell Li-ion backup or low-voltage supervisor ICs in fail-safe memory hold
Pb-free 44-pin TSOP II packagingMeets RoHS compliance requirements and supports standard surface-mount reflow profiles

Applications

Industrial PLC Memory BufferMedical Imaging Frame Store

Use Scenario: Storing real-time I/O scan data and configuration registers in programmable logic controllers with cyclic execution.

IC Role / Device Role / Timing Role: Non-volatile-retentive SRAM buffer interfacing directly to ARM Cortex-M7 MCU's external memory bus.

Use Value: 10 ns tAA ensures zero-wait-state operation at 100 MHz bus clock; 2.0 V data retention maintains critical state during brief AC mains interruption.

Use Scenario: Holding uncompressed grayscale image frames (1024 × 768 × 16-bit) in portable ultrasound devices between acquisition and DSP processing.

IC Role / Device Role / Timing Role: High-bandwidth frame buffer accessed concurrently by imaging sensor controller and DSP DMA engine.

Use Value: Dual-byte enables simultaneous pixel packing (lower byte) and metadata tagging (upper byte); ISB2 = 10 µA extends battery runtime during idle acquisition phases.

Avionics Display Controller CacheTest Equipment Pattern Memory

Use Scenario: Caching GUI assets and overlay bitmaps in DO-254-compliant cockpit display units subject to extended temperature cycling.

IC Role / Device Role / Timing Role: Deterministic-latency SRAM providing glitch-free video refresh under –40 °C to +85 °C ambient conditions.

Use Value: TSOP II package offers proven thermal reliability in conduction-cooled avionics enclosures; tHZOE = 5 ns guarantees clean output disable during vertical blanking intervals.

Use Scenario: Storing digital stimulus/response patterns in automated boundary-scan test systems requiring precise timing alignment.

IC Role / Device Role / Timing Role: Synchronous pattern store synchronized to 100 MHz JTAG TCK with sub-ns edge control.

Use Value: tACE = 10 ns and tLZCE = 3 ns enable tight setup/hold windows for pattern launch; BHE/ BLE allow selective update of pass/fail flags without rewriting full vectors.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
ISSI IS61LV102416AL-10TLISame density, speed, and voltage; 44-pin TSOP II; ICC = 85 mA (slightly lower active current)No data retention below 2.2 V; lacks explicit ISB2 spec - standby current measured at 25 °C onlyPreferred where absolute minimum active power matters more than extended low-VCC hold capability
Winbond W9825G6JH-10SDRAM, not SRAM; requires refresh circuitry; 54-pin TSOP; tRC = 12 ns (slower effective access)Higher density (32 Mbit) but adds controller complexity and timing uncertainty due to refresh overheadOnly suitable when system already includes SDRAM controller and density outweighs determinism requirements

Compared with IS61LV102416AL-10TLI and W9825G6JH-10, CY7C1011DV33-10ZSXIT delivers guaranteed 2.0 V data retention and deterministic 10 ns access without refresh management - critical for safety-critical industrial and medical systems where memory predictability is non-negotiable.

Availability

CY7C1011DV33-10ZSXIT is available at Aetrix Electronics and suitable for industrial PLC memory buffers, medical imaging frame stores, and avionics display controller caches requiring stable component supply and long-term obsolescence management.

Supply support for CY7C1011DV33-10ZSXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in memory, microcontrollers, and connectivity solutions for industrial, automotive, and consumer markets.

The CY7C1011DV33 belongs to Cypress's high-reliability parallel SRAM product line, designed specifically for deterministic, low-latency memory expansion in resource-constrained embedded systems where refresh-free operation and wide temperature tolerance are mandatory.

FAQ

Is CY7C1011DV33-10ZSXIT pin-compatible with CY7C1011CV33?

Yes, it is pin- and function-compatible per the datasheet Feature section. Both share identical 44-pin TSOP II pinout, address/data/control signal mapping, and timing behavior. No PCB redesign or firmware modification is required for migration, though voltage tolerance and standby current specs differ slightly.

What is the maximum operating frequency supported by this SRAM?

The device does not operate on a clock signal; its performance is defined by asynchronous timing parameters. With tRC = 10 ns, it supports up to 100 MHz effective bus throughput in continuous read/write cycles. System-level frequency depends on controller timing margins, not an internal clock.

Does this part require external refresh circuitry?

No. As a static RAM, CY7C1011DV33-10ZSXIT retains data indefinitely while powered and enabled, with no refresh cycles needed. Data retention continues down to 2.0 V VCC without external support, distinguishing it from DRAM or pseudo-SRAM devices.

Can BHE and BLE be asserted simultaneously for full 16-bit access?

Yes. Asserting both BHE and BLE LOW enables full 16-bit read or write operations across I/O0–I/O15. The device treats this as a unified 16-bit transaction - no internal arbitration or timing penalty applies when both byte enables are active.

CY7C1011DV33-10ZSXIT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
44-TSOP (0.400", 10.16mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
2Mbit
Memory Organization:
128K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
44-TSOP II

CY7C1011DV33-10ZSXIT FAQ

1.How can I place an order for CY7C1011DV33-10ZSXIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1011DV33-10ZSXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1011DV33-10ZSXIT reliable?

The price and inventory of CY7C1011DV33-10ZSXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1011DV33-10ZSXIT is usually 5 days.

3.What payment methods are accepted for CY7C1011DV33-10ZSXIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1011DV33-10ZSXIT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1011DV33-10ZSXIT?

CY7C1011DV33-10ZSXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1011DV33-10ZSXIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1011DV33-10ZSXIT?

For technical support, including CY7C1011DV33-10ZSXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1011DV33-10ZSXIT requirements.

6.How does Aetrix verify that CY7C1011DV33-10ZSXIT is sourced from the original manufacturer or authorized distributors?

All CY7C1011DV33-10ZSXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1011DV33-10ZSXIT meets industry standards.

7.What is the process for return or replacement of CY7C1011DV33-10ZSXIT?

All CY7C1011DV33-10ZSXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1011DV33-10ZSXIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1011DV33-10ZSXIT part is unused and in its original packaging.

Return procedure for CY7C1011DV33-10ZSXIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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