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Infineon Technologies CY7C1011G30-10BAJXE
- Part No.:
- CY7C1011G30-10BAJXE
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
CY7C1011G30-10BAJXE.pdf
- Description:
- IC SRAM 2MBIT PARALLEL 48FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,307
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Product details
Overview
CY7C1011G30-10BAJXE from Infineon Technologies (formerly Cypress) is an AEC-Q100 qualified automotive-grade 2-Mbit static RAM with embedded single-bit error-correcting code (ECC), 128K × 16-bit organization, 10 ns access time, and operation over –40 °C to +125 °C. It delivers ECC-protected data storage for safety-critical ADAS control units requiring high reliability under extended temperature stress.
For engineers reviewing the CY7C1011G30-10BAJXE datasheet, CY7C1011G30-10BAJXE pinout, CY7C1011G30-10BAJXE application, or CY7C1011G30-10BAJXE equivalent, this page provides verified package mapping (48-ball VFBGA), byte-enable-controlled 16-bit I/O architecture, automotive-E grade thermal performance, and real-world ECC implementation details-not generic SRAM summaries.
Technical Context
The CY7C1011G30-10BAJXE implements a synchronous CMOS SRAM core with dedicated on-die ECC encoder/decoder logic that detects and corrects single-bit errors in real time during read operations. Its dual-byte enable (BHE/BLE) architecture enables independent upper- and lower-byte writes without external logic.
It supports TTL-compatible signaling across 2.2 V–3.6 V supply range, features automatic CE-driven power-down modes (ISB2 = 6 mA typical), and maintains 1.0 V data retention-critical for automotive cold-cranking scenarios where VCC dips below nominal operating voltage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory size | 2 Mbit (128K words × 16-bit); supports full-word or byte-aligned access without address translation overhead |
| Access time (tAA) | 10 ns at VCC = 3.6 V; enables direct interface with 100 MHz microcontrollers without wait states |
| ECC capability | Single-bit error correction per 16-bit word; SER < 0.1 FIT/Mb; no automatic write-back required |
| Supply voltage | 2.2 V–3.6 V; accommodates wide automotive battery transients and LDO dropout margins |
| Operating temperature | –40 °C to +125 °C (Automotive-E grade); validated for engine bay and radar module placement |
| Standby current (ISB2) | 6 mA typical at VCC = 3.6 V; reduces system-level power budget in sleep-mode ADAS sensors |
| Data retention voltage | 1.0 V minimum; sustains memory contents during cranking events down to 1.0 V rail collapse |
Pinout & Package
Package: 48-ball Very Fine Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm, 0.5 mm pitch, RoHS-compliant, Pb-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address inputs | 17-bit address bus supporting full 128K-word addressing; no internal multiplexing |
| I/O0–I/O7 | Lower byte data I/O | Driven by BLE; enables isolated 8-bit writes/reads without disturbing upper byte |
| I/O8–I/O15 | Upper byte data I/O | Driven by BHE; supports parallel 16-bit transfers or independent upper-byte access |
| CE | Chip Enable | Active-low global enable; places all I/Os in high-Z when deasserted; triggers ISB2 power-down mode |
| WE | Write Enable | Active-low write strobe; overlapping WE, CE, and BHE/BLE defines write window per JEDEC timing |
| OE | Output Enable | Active-low read strobe; controls output drivers only; does not affect internal state or power mode |
| BLE / BHE | Byte Low/High Enable | Independent active-low enables for lower/upper byte; essential for MISRA-C-compliant partial-word updates |
| VCC / VSS | Power / Ground | Dual VCC pins (balls E2, D3) and multiple VSS balls (A1, C1, D1, F1, G1, H1) reduce IR drop and noise coupling |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q100 qualification | Validated for Automotive-E grade (–40 °C to +125 °C); includes HTOL, TC, ESD, and latch-up testing per standard |
| Embedded ECC logic | On-die Hamming-code encoder/decoder corrects single-bit errors per 16-bit word without software intervention |
| Low-power standby mode | ISB2 = 6 mA typical at 3.6 V; achieved via CE-driven internal clock gating and bias current reduction |
| TTL-compatible I/O | VIH/VIL thresholds match legacy 5 V TTL logic families; eliminates level-shifter requirement in mixed-voltage systems |
| 1.0 V data retention | Maintains stored data at VCC ≥ 1.0 V; supports fail-safe memory hold during engine start voltage sag |
Applications
| Radar Signal Processing Unit | ADAS Domain Controller |
|---|---|
|
Use Scenario: Stores intermediate FFT results and calibration coefficients in 77 GHz automotive radar modules during continuous beamforming. IC Role / Device Role / Timing Role: High-speed, ECC-protected scratchpad memory interfaced directly to DSP core with 10 ns tAA timing. Use Value: Prevents single-event upsets from cosmic radiation in engine-bay-mounted radar units; eliminates need for external ECC controller logic. |
Use Scenario: Holds real-time sensor fusion buffers and ASIL-B diagnostic state variables in centralized vehicle domain controllers. IC Role / Device Role / Timing Role: Safety-relevant SRAM with deterministic ECC correction latency (< 1 ns added delay) for ISO 26262 ASIL-B compliance. Use Value: Enables fault-tolerant memory subsystem without software overhead; meets FMEDA requirements for latent fault detection coverage. |
| Electronic Brake Control Module | Automotive Camera ISP Buffer |
|
Use Scenario: Caches brake pressure lookup tables and actuator command history in ABS/ESC ECUs exposed to under-hood thermal cycling. IC Role / Device Role / Timing Role: Automotive-E grade SRAM with 125 °C junction rating and 1.0 V data retention for cranking resilience. Use Value: Guarantees memory integrity across 10,000+ thermal cycles; eliminates EEPROM wear-out concerns for critical calibration data. |
Use Scenario: Buffers raw image frames between MIPI CSI-2 receiver and ISP pipeline in surround-view camera systems. IC Role / Device Role / Timing Role: Dual-byte-enabled 16-bit SRAM enabling concurrent read/write of YUV422 pixel streams without bank conflicts. Use Value: Supports 60 fps HD video buffering with zero frame loss; BHE/BLE allows simultaneous ISP read and sensor write to same address space. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C3256A-10TIN | No embedded ECC; requires external error detection logic; 10 ns access, 256K × 16-bit | Lacks hardware-level single-bit correction; increases software validation burden for ASIL-B systems | Select only if ECC is implemented at SoC level and system-level FIT budget permits |
| IS61WV102416BLL-10MLI | Industrial-grade (–40 °C to +85 °C); no AEC-Q100 qualification; 10 ns access, 1024K × 16-bit | Not qualified for automotive under-hood use; unsuitable for engine control or radar modules | Acceptable only for infotainment head units or cabin-domain modules outside AEC-Q100 scope |
Compared with AS7C3256A-10TIN and IS61WV102416BLL-10MLI, CY7C1011G30-10BAJXE uniquely integrates AEC-Q100 Automotive-E qualification with on-die ECC-reducing BOM count, eliminating external correction logic, and meeting ISO 26262 hardware fault tolerance requirements out-of-the-box.
Availability
CY7C1011G30-10BAJXE is available at Aetrix Electronics and suitable for radar signal processing units, ADAS domain controllers, and electronic brake control modules requiring stable component supply across extended automotive lifecycles.
Supply support for CY7C1011G30-10BAJXE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
CY7C1011G30-10BAJXE belongs to Infineon's automotive SRAM portfolio, designed specifically for safety-critical embedded systems requiring AEC-Q100 qualification, ECC protection, and extended temperature operation.
FAQ
Does CY7C1011G30-10BAJXE support automatic error correction write-back?
No. The device performs single-bit error correction on read operations only and does not automatically rewrite corrected data to memory. Error detection flags are not exposed externally, and correction occurs transparently within the ECC decoder path without CPU intervention or bus cycle extension.
What is the maximum junction temperature for continuous operation?
The maximum junction temperature is +125 °C, validated per AEC-Q100 Grade 0 (Automotive-E) requirements. Thermal resistance θJA is 30.68 °C/W for the 48-ball VFBGA package on a four-layer PCB, enabling reliable operation in engine compartment environments with proper board layout.
Can BLE and BHE be asserted simultaneously for full 16-bit access?
Yes. Asserting both BLE and BHE LOW enables full 16-bit data transfer on I/O0–I/O15. This configuration matches standard SRAM read/write behavior and is required for non-byte-aligned operations such as firmware loading or bulk buffer transfers.
Is the 1.0 V data retention specification tested or guaranteed?
The 1.0 V data retention voltage is guaranteed by design per datasheet specifications and confirmed through characterization across process corners and temperature extremes. It is not a typical-only value-it applies across the full Automotive-E operating range and is validated for minimum retention time under worst-case conditions.
CY7C1011G30-10BAJXE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 48-TFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 2Mbit
- Memory Organization:
- 128K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-FBGA (6x8)
CY7C1011G30-10BAJXE FAQ
1.How can I place an order for CY7C1011G30-10BAJXE through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1011G30-10BAJXE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1011G30-10BAJXE reliable?
The price and inventory of CY7C1011G30-10BAJXE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1011G30-10BAJXE is usually 5 days.
3.What payment methods are accepted for CY7C1011G30-10BAJXE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1011G30-10BAJXE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1011G30-10BAJXE?
CY7C1011G30-10BAJXE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1011G30-10BAJXE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1011G30-10BAJXE?
For technical support, including CY7C1011G30-10BAJXE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1011G30-10BAJXE requirements.
6.How does Aetrix verify that CY7C1011G30-10BAJXE is sourced from the original manufacturer or authorized distributors?
All CY7C1011G30-10BAJXE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1011G30-10BAJXE meets industry standards.
7.What is the process for return or replacement of CY7C1011G30-10BAJXE?
All CY7C1011G30-10BAJXE units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1011G30-10BAJXE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1011G30-10BAJXE part is unused and in its original packaging.
Return procedure for CY7C1011G30-10BAJXE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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