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Infineon Technologies CY7C1011G30-10ZSXAT
- Part No.:
- CY7C1011G30-10ZSXAT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1011G30-10ZSXAT.pdf
- Description:
- IC SRAM 2MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:
- Shipping:
Inventory:3,146
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Product details
Overview
CY7C1011G30-10ZSXAT from Infineon Technologies (formerly Cypress) is an AEC-Q100 qualified automotive-grade 2-Mbit (128K × 16-bit) static RAM with embedded single-bit error-correcting code (ECC), 10 ns access time, 2.2–3.6 V operating voltage, and -40 °C to +125 °C temperature range - deployed in engine control units for real-time fault-tolerant data storage.
For engineers reviewing the CY7C1011G30-10ZSXAT datasheet, CY7C1011G30-10ZSXAT pinout, CY7C1011G30-10ZSXAT application, or CY7C1011G30-10ZSXAT equivalent, key selection criteria include ECC support for ASIL-B systems, TSOP II package compatibility, 6 mA standby current at Automotive-E grade, and byte-level write enable via BHE/ BLE signals.
Technical Context
The CY7C1011G30-10ZSXAT implements a synchronous CMOS SRAM core with dedicated ECC encoder/decoder circuitry that detects and corrects single-bit errors on-the-fly during read operations; it does not perform automatic write-back on error detection.
It supports TTL-compatible I/O signaling, dual-byte write control (BHE for I/O8–I/O15, BLE for I/O0–I/O7), and three power states: active (CE LOW), standby (CE HIGH with CMOS inputs), and data retention (1.0 V VCC). Its timing architecture enforces strict tAA = 10 ns and tRC = 10 ns under Automotive-E conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory size | 2 Mbit (128K words × 16-bit) - provides sufficient buffer space for real-time sensor fusion buffers in ADAS ECUs. |
| Access time (tAA) | 10 ns - enables deterministic response within tight timing budgets of safety-critical automotive microcontrollers. |
| ECC capability | Single-bit error correction (SEC), SER < 0.1 FIT/Mb - meets ISO 26262 ASIL-B fault coverage requirements without external logic. |
| Supply voltage | 2.2 V to 3.6 V - compatible with modern automotive 3.3 V domains and brown-out tolerant operation down to 2.2 V. |
| Standby current (ISB2) | 6 mA typical (Automotive-E) - reduces quiescent power in always-on vehicle subsystems such as telematics gateways. |
| Operating temperature | –40 °C to +125 °C (Automotive-E grade) - validated for under-hood deployment including transmission control modules. |
| Data retention voltage | 1.0 V - maintains memory state during deep sleep or battery backup scenarios without full VCC. |
Pinout & Package
Package: 44-pin TSOP II (Type II, 400 mil width), RoHS-compliant, Pb-free, JEDEC MO-141AC compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address inputs | 17-bit address bus supporting full 128K-word addressing; A16 is MSB for 16-bit word access. |
| I/O0–I/O15 | Bidirectional data lines | 16-bit parallel data interface; high-impedance when CE, OE, BHE, and BLE are deasserted. |
| CE | Chip Enable | Active-low global enable; places device in low-power standby (ISB2) when HIGH, disables outputs. |
| OE | Output Enable | Active-low read strobe; controls output drivers only - does not affect internal memory state. |
| WE | Write Enable | Active-low write strobe; initiates write cycle when CE and WE both LOW; overlaps with BHE/ BLE for byte select. |
| BHE | Byte High Enable | Active-low control for upper byte (I/O8–I/O15); enables 8-bit writes to high byte independently of lower byte. |
| BLE | Byte Low Enable | Active-low control for lower byte (I/O0–I/O7); enables 8-bit writes to low byte without disturbing upper byte. |
| VCC / VSS | Power / Ground | Dual VCC pins (pins 11 & 34) and dual VSS pins (pins 12 & 33) reduce IR drop and improve noise immunity in high-speed operation. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q100 qualification | Qualified to Grade 1 (Automotive-A) and Grade 0 (Automotive-E), enabling use in powertrain and chassis control modules. |
| Embedded SEC ECC | On-die ECC logic corrects single-bit errors per 16-bit word without software intervention or external circuitry. |
| Low-voltage data retention | Maintains stored data at 1.0 V VCC - supports fail-safe memory hold during ignition-off or battery-swap events. |
| TTL-compatible I/O | Accepts standard 3.3 V TTL logic levels (VIH = 2.0 V min, VOL = 0.4 V max), simplifying interface with legacy MCU buses. |
| Byte-select write capability | Independent BHE/ BLE control allows partial-word updates - critical for atomic flag or status register writes in safety firmware. |
Applications
| Engine Control Unit (ECU) | Advanced Driver Assistance System (ADAS) Camera Module |
|---|---|
Use Scenario: Real-time logging of combustion timing, knock sensor data, and fuel trim parameters during closed-loop engine operation. IC Role / Device Role / Timing Role: High-reliability SRAM buffer with ECC for volatile runtime variables and calibration scratchpad storage. Use Value: Prevents silent data corruption in safety-critical engine maps; 10 ns access ensures synchronization with 100 MHz MCU peripherals. | Use Scenario: Frame buffering and metadata storage for multi-camera fusion in lane departure warning and automatic emergency braking. IC Role / Device Role / Timing Role: Low-latency, fault-tolerant memory for pre-processing buffers between image sensor interface and SoC vision processor. Use Value: ECC mitigates cosmic-ray-induced bit flips in under-hood camera modules operating at 125 °C ambient. |
| Transmission Control Module (TCM) | Electric Power Steering (EPS) Controller |
Use Scenario: Storing gear shift strategy tables, torque converter lock-up profiles, and adaptive learning coefficients across drive cycles. IC Role / Device Role / Timing Role: Non-refreshed, deterministic-access memory for ASIL-B functional safety data structures. Use Value: 6 mA ISB2 enables energy-efficient wake-on-event operation while maintaining integrity of learned transmission behavior. | Use Scenario: Holding motor position feedback history, assist torque lookup tables, and fault event logs in steer-by-wire systems. IC Role / Device Role / Timing Role: Safety-redundant SRAM for real-time torque calculation buffers where single-point failure must be detected and corrected. Use Value: Embedded SEC satisfies ISO 26262 hardware fault tolerance requirements without adding external ECC IC overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV102416BLL-10MLI | No embedded ECC; requires external error handling; 10 ns access, same 128K × 16 organization. | Suitable for non-safety-critical infotainment or body control modules where ASIL compliance is not required. | Select if cost sensitivity outweighs functional safety needs and system-level ECC can be implemented in firmware. |
| MT28EW256ABA1HPC-0SIT | Quad SPI NOR Flash with ECC; serial interface; 256 Mbit density; no random-access SRAM performance. | Used for firmware storage and configuration, not for volatile runtime buffers requiring nanosecond access. | Choose only for code/data storage roles - not a drop-in replacement due to interface, timing, and volatility differences. |
Compared with IS61WV102416BLL-10MLI and MT28EW256ABA1HPC-0SIT, the CY7C1011G30-10ZSXAT uniquely delivers integrated SEC ECC, parallel 16-bit bus, and AEC-Q100 Grade 0 qualification - making it the only option for ASIL-B-compliant, low-latency volatile memory in powertrain and steering ECUs.
Availability
CY7C1011G30-10ZSXAT is available at Aetrix Electronics and suitable for engine control units, ADAS camera modules, transmission control modules, and electric power steering controllers requiring stable component supply across extended automotive lifecycles.
Supply support for CY7C1011G30-10ZSXAT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power systems, sensors, and automotive ICs with strong emphasis on functional safety and reliability.
This device belongs to Infineon's automotive SRAM portfolio, designed specifically to meet AEC-Q100 Grade 0 requirements and support ASIL-B system architectures in powertrain and chassis control applications.
FAQ
Does CY7C1011G30-10ZSXAT support automatic error correction write-back?
No. The device performs single-bit error correction on read operations but does not automatically rewrite corrected data to the memory array. Error detection and correction occur transparently during read cycles only; no write-back mechanism is implemented in hardware or firmware.
What is the maximum clock frequency supported by CY7C1011G30-10ZSXAT?
The CY7C1011G30-10ZSXAT is a static RAM and does not use a clock signal. Its maximum operational speed is defined by access time (tAA = 10 ns) and cycle time (tRC = 10 ns), enabling reliable interfacing with microcontrollers running up to 100 MHz bus frequencies in asynchronous mode.
Can CY7C1011G30-10ZSXAT operate at 1.8 V?
No. The device requires a minimum VCC of 2.2 V and supports operation up to 3.6 V. Operation below 2.2 V violates the specified operating range and may result in data corruption, timing violations, or failure to enter data retention mode reliably.
Is the 44-pin TSOP II package of CY7C1011G30-10ZSXAT pin-compatible with CY7C1011DN-10ZSXI?
Yes. Both devices share identical 44-pin TSOP II pinouts, address/data bus width (128K × 16), and control signal definitions (CE, OE, WE, BHE, BLE). However, CY7C1011DN-10ZSXI lacks ECC and is rated only for Industrial temperature range (–40 °C to +85 °C), not Automotive-E.
CY7C1011G30-10ZSXAT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 2Mbit
- Memory Organization:
- 128K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY7C1011G30-10ZSXAT FAQ
1.How can I place an order for CY7C1011G30-10ZSXAT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1011G30-10ZSXAT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1011G30-10ZSXAT reliable?
The price and inventory of CY7C1011G30-10ZSXAT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1011G30-10ZSXAT is usually 5 days.
3.What payment methods are accepted for CY7C1011G30-10ZSXAT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1011G30-10ZSXAT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1011G30-10ZSXAT?
CY7C1011G30-10ZSXAT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1011G30-10ZSXAT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1011G30-10ZSXAT?
For technical support, including CY7C1011G30-10ZSXAT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1011G30-10ZSXAT requirements.
6.How does Aetrix verify that CY7C1011G30-10ZSXAT is sourced from the original manufacturer or authorized distributors?
All CY7C1011G30-10ZSXAT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1011G30-10ZSXAT meets industry standards.
7.What is the process for return or replacement of CY7C1011G30-10ZSXAT?
All CY7C1011G30-10ZSXAT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1011G30-10ZSXAT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1011G30-10ZSXAT part is unused and in its original packaging.
Return procedure for CY7C1011G30-10ZSXAT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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