Infineon Technologies CY7C1011G30-12ZSXET
- Part No.:
- CY7C1011G30-12ZSXET
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1011G30-12ZSXET.pdf
- Description:
- IC SRAM 2MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:

- Shipping:

Inventory:1,324
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Product details
Overview
CY7C1011G30-12ZSXET from Infineon Technologies (formerly Cypress) is an AEC-Q100 qualified automotive-grade 2-Mbit static RAM with embedded ECC, organized as 128K × 16-bit, operating at 12 ns access time over –40 °C to +125 °C, supporting 2.2 V–3.6 V supply and delivering 40 mA typical active current for safety-critical memory buffering in engine control units.
For engineers reviewing the CY7C1011G30-12ZSXET datasheet, CY7C1011G30-12ZSXET pinout, CY7C1011G30-12ZSXET application, or CY7C1011G30-12ZSXET equivalent, key selection criteria include ECC-enabled single-bit error correction, TSOP II package compatibility, automotive temperature grade E, low 6 mA standby current, and TTL-compatible I/O interface timing.
Technical Context
This SRAM implements a synchronous, single-cycle read/write architecture with dedicated Byte High Enable (BHE) and Byte Low Enable (BLE) inputs for independent upper/lower byte access, enabling efficient 8-bit data transfers within 16-bit memory maps. The ECC logic operates transparently during all read cycles, detecting and correcting single-bit errors without CPU intervention.
It features dual power-down modes: ISB1 (TTL input thresholds) and ISB2 (CMOS input thresholds), with ISB2 = 6 mA typical at 3.6 V, and supports 1.0-V data retention. All I/Os enter high-impedance state when CE is HIGH or OE/BHE/ BLE are deasserted, ensuring clean bus isolation in multi-device systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory size | 2 Mbit (128K words × 16-bit); enables full 16-bit microcontroller data bus interfacing without external multiplexing |
| Access time (tAA) | 12 ns (Automotive-E grade); meets timing budgets for 80 MHz CPU interfaces with setup/hold margin |
| ECC capability | Single-bit error correction per 16-bit word; reduces uncorrectable error rate to < 0.1 FIT/Mb per AN88889 |
| Supply voltage range | 2.2 V–3.6 V; compatible with modern automotive 3.3-V domains and brown-out tolerant operation |
| Operating temperature | –40 °C to +125 °C (Automotive-E); qualified for under-hood ECU deployment |
| Standby current (ISB2) | 6 mA typical at 3.6 V; enables low-power sleep modes in always-on vehicle networks |
| Data retention voltage | 1.0 V minimum; preserves memory contents during deep battery discharge events |
Pinout & Package
Package: 44-pin TSOP II (Type II, 400-mil width), JEDEC MO-141AC compliant, lead-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address inputs | 17-bit address bus supporting full 128K-word addressing; A16 is MSB |
| I/O0–I/O7 | Data bus (lower byte) | Bi-directional 8-bit data path controlled by BLE; TTL-compatible drive strength |
| I/O8–I/O15 | Data bus (upper byte) | Bi-directional 8-bit data path controlled by BHE; independent byte write capability |
| CE | Chip Enable | Active-LOW global device select; enables automatic power-down when HIGH |
| WE | Write Enable | Active-LOW write strobe; initiates write cycle on falling edge with CE LOW |
| OE | Output Enable | Active-LOW output control; places I/Os in HI-Z when HIGH or CE HIGH |
| BLE | Byte Low Enable | Active-LOW enable for I/O0–I/O7; allows lower-byte-only writes/reads |
| BHE | Byte High Enable | Active-LOW enable for I/O8–I/O15; allows upper-byte-only writes/reads |
| VCC | Power supply | 2.2–3.6 V core supply; two pins (pins 11 & 34) reduce IR drop and noise coupling |
| VSS | Ground | Two ground pins (pins 12 & 33) provide low-inductance return paths for I/O and core |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC logic | Hardware-accelerated single-bit correction per 16-bit word; eliminates need for software ECC overhead in safety-critical firmware |
| Dual byte-enable architecture | Independent BHE/ BLE control enables precise 8-bit memory updates without read-modify-write cycles |
| Automotive-AEC-Q100 qualification | Validated for automotive electronics per stress test requirements; supports functional safety documentation (ISO 26262 ASIL-B ready) |
| Low-voltage data retention | Maintains stored data at 1.0 V VCC; ensures non-volatile behavior during ignition-off battery sag |
| Two standby current modes | ISB1 (15 mA max) and ISB2 (6 mA typical); selectable via input threshold configuration for optimal power trade-offs |
Applications
| Engine Control Unit (ECU) | Advanced Driver Assistance System (ADAS) Camera Module |
|---|---|
Use Scenario: Real-time storage of sensor fusion buffers and actuator command histories in diesel/gasoline engine management systems. IC Role / Device Role / Timing Role: Primary working memory for MCU executing closed-loop fuel injection and spark timing algorithms. Use Value: ECC protection prevents corrupted control data from causing unintended throttle or ignition events under EMI-rich under-hood conditions. | Use Scenario: Frame buffering for 1–2 MP image pipelines in surround-view camera ECUs with latency constraints ≤ 5 ms. IC Role / Device Role / Timing Role: High-speed scratchpad memory for ISP preprocessing before GPU offload. Use Value: 12 ns tAA and byte-enable support enable burst-aligned pixel transfers without pipeline stalls. |
| Electric Power Steering (EPS) Controller | Vehicle-to-Everything (V2X) Communication Module |
Use Scenario: Storing torque compensation lookup tables and real-time motor position history for fail-operational redundancy. IC Role / Device Role / Timing Role: Safety-redundant memory holding critical steering assist parameters with fault detection. Use Value: AEC-Q100 Grade E and <0.1 FIT/Mb SER ensure integrity across 15-year vehicle lifetime under thermal cycling. | Use Scenario: Temporary packet buffering for DSRC/WAVE protocol stacks processing multi-node beacon messages in dense traffic. IC Role / Device Role / Timing Role: Low-latency packet staging memory between RF transceiver and host processor. Use Value: 6 mA ISB2 and 1.0 V data retention allow graceful degradation during intermittent 12-V supply dips in roadside units. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV12816EDBLL-12MLI | No embedded ECC; requires external error handling; 12 ns access, same 128K×16 organization | Suitable only where functional safety certification is not required | Select if cost sensitivity outweighs ASIL-B compliance needs and ECC can be implemented in software |
| MT28EW256ABA1HPC-0SIT | Quad SPI NOR Flash with internal ECC; 256 Mb density; serial interface vs parallel | Used for code storage, not volatile working memory; no random-access byte writes | Choose only for boot code storage-not as SRAM replacement-due to fundamental interface and latency mismatch |
Compared with IS61WV12816EDBLL-12MLI and MT28EW256ABA1HPC-0SIT, CY7C1011G30-12ZSXET uniquely delivers hardware ECC, parallel bus timing, and automotive-grade reliability in a single 16-bit SRAM component-enabling direct integration into safety-critical MCU memory maps without architectural compromise.
Availability
CY7C1011G30-12ZSXET is available at Aetrix Electronics and suitable for engine control units, ADAS camera modules, and electric power steering controllers requiring stable component supply across extended automotive product lifecycles.
Supply support for CY7C1011G30-12ZSXET includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive ICs, and security solutions with strong ISO/TS 16949 manufacturing compliance.
CY7C1011G30-12ZSXET belongs to Infineon's automotive SRAM portfolio, designed specifically to meet AEC-Q100 Grade E requirements for mission-critical memory in powertrain and chassis control systems.
FAQ
Does CY7C1011G30-12ZSXET support automatic error correction during reads without CPU intervention?
Yes. The embedded ECC logic automatically detects and corrects single-bit errors on every read access. No software overhead or CPU cycle consumption is required-the corrected data appears directly on the I/O bus. However, it does not perform automatic write-back on error detection, as noted in the datasheet footnote 1.
What is the maximum clock frequency supported for continuous read/write bursts?
CY7C1011G30-12ZSXET has no internal clock; it is an asynchronous SRAM. Its maximum effective throughput is determined by tRC = 12 ns, enabling up to ~83.3 MHz sustained random access. For burst transfers, timing depends on address/data setup/hold margins relative to CE/OE/WE edges-not a fixed clock rate.
Can CY7C1011G30-12ZSXET operate reliably at 2.2 V across the full –40 °C to +125 °C range?
Yes. The datasheet specifies full DC and AC functionality-including tAA = 12 ns and ISB2 ≤ 14 mA-at 2.2 V minimum supply across Automotive-E temperature range. This is validated per AEC-Q100 stress testing and reflected in the Operating Range table on page 4.
Is the 44-pin TSOP II package of CY7C1011G30-12ZSXET pin-compatible with legacy CY7C1011 series devices?
Yes. The 44-pin TSOP II pinout matches CY7C1011DV33-10ZSXI and CY7C1011DN33-10ZSXI, including identical A0–A16, I/O0–I/O15, CE, OE, WE, BHE, BLE, VCC, and VSS placements. NC pins are consistent, and timing parameters are backward-compatible at same speed grade.
CY7C1011G30-12ZSXET Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 2Mbit
- Memory Organization:
- 128K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY7C1011G30-12ZSXET FAQ
1.How can I place an order for CY7C1011G30-12ZSXET through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1011G30-12ZSXET on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1011G30-12ZSXET reliable?
The price and inventory of CY7C1011G30-12ZSXET are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1011G30-12ZSXET is usually 5 days.
3.What payment methods are accepted for CY7C1011G30-12ZSXET?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1011G30-12ZSXET transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1011G30-12ZSXET?
CY7C1011G30-12ZSXET orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1011G30-12ZSXET order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1011G30-12ZSXET?
For technical support, including CY7C1011G30-12ZSXET datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1011G30-12ZSXET requirements.
6.How does Aetrix verify that CY7C1011G30-12ZSXET is sourced from the original manufacturer or authorized distributors?
All CY7C1011G30-12ZSXET products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1011G30-12ZSXET meets industry standards.
7.What is the process for return or replacement of CY7C1011G30-12ZSXET?
All CY7C1011G30-12ZSXET units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1011G30-12ZSXET, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1011G30-12ZSXET part is unused and in its original packaging.
Return procedure for CY7C1011G30-12ZSXET:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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