My Inquiry
My Account
Infineon Technologies CY7C1018DV33-10VXIT
- Part No.:
- CY7C1018DV33-10VXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 32-BSOJ (0.300", 7.62mm Width)
- Datasheet:
-
CY7C1018DV33-10VXIT.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 32SOJ
- Quantity:
- Payment:
- Shipping:
Inventory:3,018
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1018DV33-10VXIT from Cypress Semiconductor is a 1-Mbit (128 K × 8) high-speed CMOS static RAM with 10 ns access time, 3.3 V supply, and automatic CE-controlled power-down. It features center power/ground pinout, three-state I/O drivers, and supports memory expansion via independent CE, OE, and WE controls. Used in industrial embedded controllers requiring deterministic low-latency data storage.
For engineers reviewing the CY7C1018DV33-10VXIT datasheet, CY7C1018DV33-10VXIT pinout, CY7C1018DV33-10VXIT application, or CY7C1018DV33-10VXIT equivalent, key selection criteria include tAA ≤ 10 ns, ISB2 ≤ 3 mA standby current, 2.0 V data retention capability, and Pb-free 48-ball VFBGA package compatibility with industrial temperature range (–40 °C to +85 °C).
Technical Context
This SRAM implements a synchronous read/write interface with dual active-Low control signals (CE and OE for reads; CE and WE for writes), enabling precise bus timing control in microcontroller co-processor systems. Its architecture includes separate row/column decoders, sense amplifiers, and input buffers with automatic power-down activation when CE is HIGH.
The device operates exclusively at 3.3 V ±0.3 V and guarantees full functionality across –40 °C to +85 °C. Data retention is maintained down to 2.0 V with ICCDR ≤ 3 mA, and all AC timing parameters-including tRC = 10 ns, tDOE = 5 ns, and tHZOE = 5 ns-are specified under defined load conditions (5 pF for high-Z transitions, 30 pF for data valid).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| tAA | 10 ns - maximum address-to-data-valid delay ensures deterministic timing in real-time control loops |
| ICC (active) | 60 mA @ 10 ns - defines peak power draw during burst read/write operations at rated speed |
| ISB2 (standby) | 3 mA - CMOS CE-driven power-down current enabling ultra-low idle consumption in battery-backed systems |
| VDR | 2.0 V - minimum VCC sustaining data integrity during brown-out or backup power mode |
| Operating Temp | –40 °C to +85 °C - qualified for industrial-grade reliability without derating |
| Package | 48-ball VFBGA - fine-pitch, thermally efficient package with θJA = 36 °C/W for compact PCB layouts |
| Organization | 128 K × 8 - single-byte-wide parallel interface compatible with 8-bit microcontrollers and FPGA glue logic |
Pinout & Package
Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm, 0.8 mm pitch, Pb-free, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address inputs | 17-bit address bus supporting full 128 K-word decoding; no internal latching |
| I/O0–I/O7 | Bidirectional data bus | Three-state CMOS I/O pins sharing function for read and write; high-impedance when CE or OE HIGH or during write |
| CE | Chip Enable (active LOW) | Primary device select; enables automatic power-down when HIGH and disables outputs regardless of OE/WE state |
| OE | Output Enable (active LOW) | Controls output buffer enable only; requires CE LOW to be effective; does not affect power state |
| WE | Write Enable (active LOW) | Initiates write cycle when CE is LOW; forces I/O pins into input mode and gates write data into memory array |
| VCC | Power supply | 3.3 V ±0.3 V core supply; two dedicated VCC balls (pins A1 and D1) support low-noise distribution |
| VSS | Ground | Two dedicated ground balls (pins B1 and E1) minimize switching noise and improve signal integrity |
| NC | No-connect | 12 unconnected balls (e.g., C2, C3, D2, etc.)-must be left floating or grounded per layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| Center power/ground pinout | Reduces simultaneous switching noise (SSN) by symmetrically distributing VCC/VSS across die edges, improving signal integrity in dense routing |
| Automatic CE power-down | Reduces ICC from 60 mA to 3 mA within 10 ns of CE deassertion, eliminating need for external power management circuitry |
| 2.0 V data retention | Enables seamless transition to backup power during main supply interruption without data loss or controller intervention |
| Pb-free VFBGA packaging | Meets RoHS Directive 2011/65/EU and JEDEC J-STD-020D moisture sensitivity requirements for reflow-compatible assembly |
| Pin- and function-compatible with CY7C1018CV33/CY7C1019CV33 | Allows drop-in replacement in legacy designs without PCB or firmware changes, preserving system validation effort |
Applications
| Industrial PLC I/O Buffering | Medical Imaging Frame Memory |
|---|---|
|
Use Scenario: Storing real-time sensor acquisition buffers and command queue entries in programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Parallel-access SRAM serving as zero-wait-state scratchpad memory for ARM Cortex-M4-based motion control engines. Use Value: 10 ns tAA enables sub-microsecond response to encoder interrupts; ISB2 ≤ 3 mA extends uptime during auxiliary power fallback. |
Use Scenario: Holding uncompressed grayscale image frames (e.g., 512 × 512 × 8-bit) in portable ultrasound devices between DSP processing stages. IC Role / Device Role / Timing Role: High-reliability frame buffer interfaced directly to FPGA video pipeline with synchronous read/write handshaking. Use Value: VFBGA thermal resistance (θJA = 36 °C/W) prevents thermal throttling during sustained 100 MHz burst transfers; 2.0 V retention sustains data during battery swap. |
| Avionics Display Controller Cache | Test Equipment Pattern Memory |
|
Use Scenario: Caching display list instructions and glyph bitmaps in DO-254-compliant cockpit display units with strict EMI and thermal constraints. IC Role / Device Role / Timing Role: Deterministic-access memory mapped into ARM A53 MMU space, accessed via AXI4-lite with fixed latency guarantees. Use Value: Center VCC/VSS pinout minimizes radiated emissions in 200+ MHz clock domains; industrial temp rating eliminates derating in sealed enclosures. |
Use Scenario: Storing stimulus/response vectors in automated test equipment (ATE) pattern generators performing high-speed digital functional testing. IC Role / Device Role / Timing Role: Dual-port emulated via CE/OE/WE sequencing to support concurrent vector fetch and result capture on shared 8-bit bus. Use Value: tRC = 10 ns supports ≥100 MHz pattern rates; tHZOE = 5 ns enables tight setup windows for comparator sampling clocks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar static RAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61LV102416L-10TLI | 1 Mbit × 16 organization, 10 ns access, 3.3 V, TSOP-44 package; higher density but wider bus | Requires 16-bit data path redesign; unsuitable for 8-bit MCU interfaces without glue logic | Select only if migrating to 16-bit architecture or needing higher throughput per cycle |
| AS6C1008-10TIN | 1 Mbit × 8, 10 ns, 3.3 V, SOJ-32 package; lower standby current (ISB = 1 µA) but no VFBGA option | Limited to through-hole or wide-body surface-mount; incompatible with space-constrained VFBGA footprints | Prefer for cost-sensitive industrial boards where board area is not constrained and reflow profile allows SOJ |
Compared with IS61LV102416L-10TLI and AS6C1008-10TIN, CY7C1018DV33-10VXIT uniquely combines VFBGA packaging, industrial temperature rating, and guaranteed 2.0 V data retention-making it optimal for compact, mission-critical embedded systems where footprint, thermal performance, and brown-out resilience are non-negotiable.
Availability
CY7C1018DV33-10VXIT is available at Aetrix Electronics and suitable for industrial PLCs, medical imaging subsystems, and avionics display controllers requiring stable component supply across extended product lifecycles.
Supply support for CY7C1018DV33-10VXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, PSoC mixed-signal arrays, and USB/USB-C solutions.
The CY7C1018DV33 belongs to Cypress's industrial-grade parallel SRAM product line, engineered for deterministic timing, low-power standby operation, and robustness in mission-critical embedded systems.
FAQ
What is the maximum clock frequency supported for burst read operations?
The CY7C1018DV33-10VXIT does not use a clock signal-it is an asynchronous SRAM. Its maximum operational speed is defined by tRC = 10 ns, enabling up to 100 MHz sustained random-access cycles when driven by properly timed CE/OE/WE strobes. No internal PLL or clock multiplier is present.
Can this SRAM be used with a 5 V microcontroller interface?
No. The CY7C1018DV33-10VXIT is strictly a 3.3 V device: VIH(max) = VCC + 0.3 V = 3.6 V, and absolute maximum input voltage is VCC + 0.3 V. Direct connection to 5 V logic will damage the inputs. Level-shifting circuitry is required for interoperability with 5 V systems.
Does the VFBGA package require special PCB layout considerations?
Yes. The 48-ball VFBGA demands controlled impedance routing, dedicated ground/power planes, and thermal vias under the package per Cypress AN98512. Solder mask-defined pads and stencil thickness ≤ 0.12 mm are recommended to prevent bridging and voiding during reflow.
How does automatic power-down behave during partial address transitions?
Automatic power-down activates only when CE is HIGH-regardless of address or data bus state. Partial address changes with CE LOW maintain full active current (ICC = 60 mA). CE must remain HIGH for >10 ns to guarantee ISB2 ≤ 3 mA; no address stability requirement applies.
CY7C1018DV33-10VXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 32-BSOJ (0.300", 7.62mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 128K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-SOJ
CY7C1018DV33-10VXIT FAQ
1.How can I place an order for CY7C1018DV33-10VXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1018DV33-10VXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1018DV33-10VXIT reliable?
The price and inventory of CY7C1018DV33-10VXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1018DV33-10VXIT is usually 5 days.
3.What payment methods are accepted for CY7C1018DV33-10VXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1018DV33-10VXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1018DV33-10VXIT?
CY7C1018DV33-10VXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1018DV33-10VXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1018DV33-10VXIT?
For technical support, including CY7C1018DV33-10VXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1018DV33-10VXIT requirements.
6.How does Aetrix verify that CY7C1018DV33-10VXIT is sourced from the original manufacturer or authorized distributors?
All CY7C1018DV33-10VXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1018DV33-10VXIT meets industry standards.
7.What is the process for return or replacement of CY7C1018DV33-10VXIT?
All CY7C1018DV33-10VXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1018DV33-10VXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1018DV33-10VXIT part is unused and in its original packaging.
Return procedure for CY7C1018DV33-10VXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1018DV33-10VXIT Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
