My Inquiry
My Account
Infineon Technologies CY7C1019B-12ZXC
- Part No.:
- CY7C1019B-12ZXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 32-SOIC (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1019B-12ZXC.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 32TSOP II
- Quantity:
- Payment:
- Shipping:
Inventory:2,499
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1019B-12ZXC from Cypress Semiconductor is a 128K × 8 (131,072 × 8) high-speed CMOS static RAM with 12 ns address access time (tAA), 5 V ±10% supply, industrial temperature range (–40°C to +85°C), and Pb-free 32-pin TSOP Type II package. It serves as main or buffer memory in microcontroller-based systems requiring deterministic read/write timing and low-power deselected operation.
For engineers reviewing the CY7C1019B-12ZXC datasheet, CY7C1019B-12ZXC pinout, CY7C1019B-12ZXC application, or CY7C1019B-12ZXC equivalent, key selection criteria include tAA = 12 ns, ISB2 = 10 mA standby current under CMOS input conditions, CE/OE/WE three-control logic, and compatibility with 8-bit parallel bus architectures in embedded controllers and instrumentation.
Technical Context
The CY7C1019B-12ZXC implements a fully decoded 17-bit address space (A0–A16) driving a 512 × 256 × 8 memory array with sense amplifiers and three-state I/O drivers. Its center power/ground pinout (VCC at pins 16 & 32, VSS at pins 15 & 31) reduces simultaneous switching noise.
It supports three distinct operational modes via CE, OE, and WE: active read (CE=L, OE=L, WE=H), active write (CE=L, WE=L), and automatic power-down (CE=H), where ISB2 drops to 10 mA at VCC max and f = 0. Output enable timing (tHZOE = 7 ns) and chip enable deactivation (tHZCE = 7 ns) are specified under 5 pF load.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 131,072 words × 8 bits - provides byte-wide data interface compatible with 8-bit microcontrollers and peripherals |
| Access Time (tAA) | 12 ns - guarantees maximum latency from address valid to data stable on read cycles |
| VCC Supply | 5 V ±10% - requires single-rail 4.5–5.5 V supply; not compatible with 3.3 V systems without level translation |
| Operating Temperature | –40°C to +85°C - qualified for industrial environments including factory automation and motor control |
| Standby Current (ISB2) | 10 mA - measured with CE > VCC – 0.3 V and CMOS-level inputs; enables low-power sleep states |
| I/O Capacitance | CIN = 6 pF, COUT = 8 pF - defines AC loading impact on bus rise/fall times and signal integrity margins |
| Output Enable Delay (tHZOE) | 7 ns - time from OE HIGH to output entering high-impedance state; critical for bus sharing and multi-drop designs |
Pinout & Package
Package: 32-pin TSOP Type II (ZS32), Pb-free, 12 × 20 mm body, 0.5 mm pitch, JEDEC MO-141AC compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit unidirectional address bus; A0 = LSB, A16 = MSB; no internal latching |
| I/O0–I/O7 | Bidirectional Data Bus | 8-bit tristatable I/O lines; high-impedance when CE=H, OE=H, or WE=L during write |
| CE | Chip Enable (active LOW) | Primary device select; enables automatic power-down when HIGH; controls tHZCE/tLZCE timing |
| OE | Output Enable (active LOW) | Controls output driver enable; does not affect write operations; determines tHZOE/tLZOE |
| WE | Write Enable (active LOW) | Initiates write cycle when CE=L; overlapping CE/L and WE/L defines write window per tSCE/tPWE |
| VCC (pins 16, 32) | Power Supply | Dual VCC pins reduce IR drop and improve noise immunity; must be decoupled locally |
| VSS (pins 15, 31) | Ground | Dual ground pins provide low-inductance return path; required for stable tAA and ICC performance |
Key Features
| Feature | Design Value |
|---|---|
| Center power/ground pinout | Reduces simultaneous switching noise and improves signal integrity on dense PCB layouts |
| Automatic CE power-down | Reduces ICC to 10 mA (ISB2) with no external control logic-simplifies low-power system design |
| Three-state outputs with fast disable | tHZOE = 7 ns ensures rapid bus release for multi-master arbitration and memory-mapped peripheral sharing |
| Functionally equivalent to CY7C1019 | Enables drop-in replacement in legacy designs without layout or firmware changes |
| Industrial temperature qualification | Validated operation from –40°C to +85°C supports deployment in harsh environmental conditions |
Applications
| Industrial PLC Data Buffer | Medical Instrumentation Memory |
|---|---|
|
Use Scenario: Stores real-time sensor acquisition buffers and configuration registers in programmable logic controller backplanes. IC Role / Device Role / Timing Role: Byte-accessible SRAM providing deterministic 12 ns read/write cycles synchronized to 8-bit ISA-style bus timing. Use Value: Enables deterministic interrupt response (<200 ns worst-case latency) and eliminates DRAM refresh overhead in cyclic scan architectures. |
Use Scenario: Holds waveform capture buffers and calibration tables in portable ECG and pulse oximeter units. IC Role / Device Role / Timing Role: Low-power standby memory retaining data during sleep mode while supporting burst reads at 83 MHz effective bandwidth. Use Value: Achieves 10 mA ISB2 current draw during patient monitoring idle periods, extending battery life by >18% versus standard 5 V SRAM alternatives. |
| Automotive Engine Control Unit | Test & Measurement Equipment |
|
Use Scenario: Provides non-refreshing scratchpad memory for transient engine parameter logging in ECU diagnostic modules. IC Role / Device Role / Timing Role: Industrial-grade SRAM operating reliably across –40°C to +85°C ambient with 5 V ±10% rail tolerance. Use Value: Eliminates data corruption risk from thermal cycling-induced timing margin loss seen with marginal 15 ns parts. |
Use Scenario: Serves as acquisition memory in digital oscilloscopes and logic analyzers requiring glitch-free parallel bus reads. IC Role / Device Role / Timing Role: High-speed 12 ns tAA SRAM interfaced directly to FPGA-based capture engines without wait states. Use Value: Supports 83.3 MHz sustained read throughput (1/12 ns) enabling real-time 100 MS/s waveform reconstruction. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar static RAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS6C1008-12ZINTR | 12 ns tAA, 5 V, 32-pin TSOP II, but uses different pinout (VCC at pin 1, VSS at pin 32) and lacks center power/ground | Requires PCB redesign due to incompatible power pin placement and higher COUT (10 pF vs. 8 pF) | Select only if footprint redesign is acceptable and lower cost outweighs layout effort |
| IS61LV1024-12ML | 12 ns tAA, 3.3 V supply only, 32-pin SOJ (not TSOP), 10 mA ISB at 3.3 V | Not voltage-compatible; requires level-shifting or system rail change; SOJ package limits board density | Use only in new 3.3 V designs where footprint and voltage alignment justify migration |
Compared with AS6C1008-12ZINTR and IS61LV1024-12ML, the CY7C1019B-12ZXC offers verified industrial temperature operation, center power/ground noise reduction, and direct pin compatibility with legacy CY7C1019 designs-making it optimal for reliability-critical upgrades without layout revision.
Availability
CY7C1019B-12ZXC is available at Aetrix Electronics and suitable for industrial PLC data buffering, medical instrumentation memory, and automotive engine control unit applications requiring stable component supply, long-term lifecycle support, and Pb-free compliance.
Supply support for CY7C1019B-12ZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor Corporation, now part of Infineon Technologies, designs high-reliability memory and programmable logic solutions for industrial, automotive, and communications markets.
The CY7C1019B series delivers industrial-grade parallel SRAM optimized for deterministic timing, low-power deselected operation, and seamless integration into 8-bit microcontroller and FPGA-based systems.
FAQ
Is CY7C1019B-12ZXC compatible with 3.3 V systems?
No. The CY7C1019B-12ZXC is specified only for 5 V ±10% operation (4.5–5.5 V). Applying 3.3 V will result in undefined logic levels, excessive tAA degradation, and potential data retention failure. Level-shifting circuitry is required for interface with 3.3 V controllers.
What is the maximum clock frequency supported for read/write cycles?
The device has no internal clock. Its maximum effective throughput is determined by tRC = 12 ns, enabling up to 83.3 MHz sustained read/write cycles when interfaced with a controller capable of meeting setup/hold timing (e.g., tAW = 10 ns, tSD = 8 ns). No external clock signal is required or accepted.
Does CY7C1019B-12ZXC require an external refresh circuit?
No. As a static RAM, it retains data indefinitely while powered and CE is asserted, with no refresh cycles needed. Data retention in power-down mode (CE=H) is guaranteed for ≥200 μs recovery time (tR) after VCC stabilization, per datasheet page 4.
Can OE be left unconnected in write-only applications?
No. OE must be actively driven-either tied LOW for permanent output enable or controlled by system logic. Leaving OE floating violates VIH/VIL specifications and may cause bus contention or excessive ICC due to indeterminate output state.
CY7C1019B-12ZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 32-SOIC (0.400", 10.16mm Width)
- Packaging:
- Bag
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 128K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 12ns
- Access Time:
- 12 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-TSOP II
CY7C1019B-12ZXC FAQ
1.How can I place an order for CY7C1019B-12ZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1019B-12ZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1019B-12ZXC reliable?
The price and inventory of CY7C1019B-12ZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1019B-12ZXC is usually 5 days.
3.What payment methods are accepted for CY7C1019B-12ZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1019B-12ZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1019B-12ZXC?
CY7C1019B-12ZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1019B-12ZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1019B-12ZXC?
For technical support, including CY7C1019B-12ZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1019B-12ZXC requirements.
6.How does Aetrix verify that CY7C1019B-12ZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1019B-12ZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1019B-12ZXC meets industry standards.
7.What is the process for return or replacement of CY7C1019B-12ZXC?
All CY7C1019B-12ZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1019B-12ZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1019B-12ZXC part is unused and in its original packaging.
Return procedure for CY7C1019B-12ZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1019B-12ZXC Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…
