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Infineon Technologies CY7C1019CV33-10ZXIT
- Part No.:
- CY7C1019CV33-10ZXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 32-SOIC (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1019CV33-10ZXIT.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 32TSOP II
- Quantity:
- Payment:
- Shipping:
Inventory:4,398
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Product details
Overview
CY7C1019CV33-10ZXIT from Cypress Semiconductor is a 1 Mbit (128K × 8) CMOS static RAM operating at 3.3 V with 10 ns access time, industrial temperature range (–40°C to +85°C), and automatic CE-controlled power-down mode. It features tristate I/Os, center power/ground pinout, and pin compatibility with CY7C1019BV33 for drop-in memory upgrades in embedded controllers and data acquisition systems.
For engineers reviewing the CY7C1019CV33-10ZXIT datasheet, CY7C1019CV33-10ZXIT pinout, CY7C1019CV33-10ZXIT application, or CY7C1019CV33-10ZXIT equivalent, key selection criteria include tAA = 10 ns read timing, ISB2 = 5 µA standby current under CMOS input conditions, CE/OE/WE control logic, and TSOP II package compatibility with legacy board layouts.
Technical Context
The CY7C1019CV33-10ZXIT implements a synchronous, non-volatile-retentive SRAM architecture with 17 address lines (A0–A16) supporting 131,072 word locations and 8 bidirectional data lines (I/O0–I/O7). Its dual active-Low enable scheme-Chip Enable (CE) and Output Enable (OE)-enables hierarchical memory banking and interleaved read/write arbitration.
Power management relies on automatic CE-driven transition into low-power mode (ISB2 = 5 µA), triggered when CE exceeds VCC – 0.3 V while inputs remain within valid CMOS thresholds. The device uses TTL-compatible input thresholds (VIH = 2.0 V min, VIL = 0.8 V max) and delivers VOH = 2.4 V / VOL = 0.4 V under full load.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 8 (131,072 words × 8 bits); supports byte-wide data bus interfacing without external demultiplexing. |
| Access Time (tAA) | 10 ns maximum; enables direct connection to 100 MHz bus cycles with zero wait states in FPGA or microcontroller glue logic. |
| Supply Voltage | 3.3 V ± 10%; compatible with standard LVTTL and LVCMOS I/O domains without level translation. |
| Standby Current (ISB2) | 5 µA at VCC max and CMOS input conditions; reduces system-level quiescent power in battery-backed or sleep-mode applications. |
| Operating Current (ICC) | 80 mA max at fMAX; defines thermal budget for dense PCB layouts with multiple parallel SRAM devices. |
| Input/Output Voltage Levels | VIH = 2.0 V min, VIL = 0.8 V max, VOH = 2.4 V min, VOL = 0.4 V max; ensures noise margin >0.4 V under worst-case VCC and temperature. |
| Package | 32-pin TSOP II (JEDEC MO-153AA), Pb-free; matches footprint of CY7C1019BV33-10ZC and supports reflow soldering per J-STD-020. |
Pinout & Package
Package: 32-pin Thin Small Outline Package Type II (TSOP II), 400-mil body width, Pb-free, RoHS-compliant. Pin 1 index marked via notch or dot; pins arranged in two parallel rows with center power (VCC) and ground (VSS) symmetry.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit unidirectional address bus; A0 = LSB, A16 = MSB; decoded internally to select one of 131,072 memory locations. |
| I/O0–I/O7 | Bidirectional Data Bus | 8-bit tristate I/O port; high-impedance during CE HIGH, OE HIGH, or WE LOW to prevent bus contention. |
| CE | Chip Enable (Active Low) | Primary device select; asserts internal array and enables power-up; drives automatic ISB2 standby when deasserted under CMOS input conditions. |
| OE | Output Enable (Active Low) | Controls output buffer only; allows read operations while CE remains asserted; no effect on write or power state. |
| WE | Write Enable (Active Low) | Initiates write cycle when CE is LOW; latches data from I/O0–I/O7 into addressed location on falling edge. |
| VCC | Supply Voltage | 3.3 V core and I/O supply; two dedicated pins (pins 16 and 32) provide low-inductance power delivery and reduce simultaneous switching noise. |
| VSS | Ground | Signal and power return; two dedicated pins (pins 15 and 31) ensure stable reference and minimize ground bounce. |
Key Features
| Feature | Design Value |
|---|---|
| Center Power/Ground Pinout | Reduces simultaneous switching output (SSO) noise by symmetrically distributing VCC/VSS across the package, improving signal integrity in high-speed parallel buses. |
| Automatic CE Power Down | Reduces ICC from 80 mA to 5 µA within 15 ns (tPD) when CE is deasserted, eliminating need for external power-gating circuitry in portable systems. |
| Pin- and Function-Compatible with CY7C1019BV33 | Enables direct replacement in existing designs without layout changes or firmware updates, preserving BOM continuity during technology refresh. |
| Tristate I/O with Independent OE Control | Allows shared data bus operation with multiple peripherals; OE can be toggled independently of CE/WE to manage read burst timing without disrupting chip selection. |
Applications
| Industrial PLC Data Buffer | Automotive Instrument Cluster Memory |
|---|---|
|
Use Scenario: Storing real-time sensor logs and configuration registers in programmable logic controllers with deterministic 10 ns memory access. IC Role / Device Role / Timing Role: Byte-addressable scratchpad memory interfaced directly to ARM Cortex-M4 MCU's external bus interface with no wait-state insertion. Use Value: Enables sub-100 ns round-trip read-modify-write cycles for PID loop variables, meeting IEC 61131-3 scan-time requirements under –40°C cold-start conditions. |
Use Scenario: Holding display frame buffers and calibration tables in digital instrument clusters where EMI resilience and thermal stability are critical. IC Role / Device Role / Timing Role: Nonvolatile-retentive SRAM backing up volatile display controller RAM during ignition cycling; operates continuously across automotive-A temperature range. Use Value: Eliminates boot-time display corruption by retaining last-known gauge positions during 12 V brownout events, supported by 2.0 V data retention capability. |
| Medical Patient Monitor Buffer | Test & Measurement Equipment FIFO |
|
Use Scenario: Capturing high-fidelity ECG waveforms at 1 kSPS with timestamped metadata in Class II medical devices requiring long-term reliability. IC Role / Device Role / Timing Role: Dual-port accessible memory bank synchronized to ADC DMA engine; CE toggled per sample packet to minimize active power draw. Use Value: Achieves 99.99% data integrity over 10-year field life by leveraging <1 µA ISB2 leakage and Pb-free TSOP II hermeticity against moisture ingress. |
Use Scenario: Implementing deep capture buffers in oscilloscopes and logic analyzers where deterministic latency and bus turnaround timing are essential. IC Role / Device Role / Timing Role: High-speed write-through FIFO stage between front-end analog capture ASIC and PCIe host interface; managed via CE/OE strobing. Use Value: Sustains 100 MB/s sustained write throughput using tWC = 10 ns write cycle and tSD = 5 ns data setup, exceeding USB 3.0 host transfer rates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61LV102416L-10MLI | 1 Mbit × 16 organization, 32-pin SOJ, tAA = 10 ns, but requires 16-bit data bus and lacks center VCC/VSS pinout. | Requires PCB redesign for x16 interface and does not support identical x8 bus mapping or pin-compatible upgrade path. | Select only when migrating to wider data paths and redesigning address/data routing; not suitable for drop-in replacement. |
| Cypress CY7C1019DV33-10ZXC | Same 128K × 8 organization and TSOP II package, but rated for commercial (0°C to +70°C) range and uses non-Pb-free lead finish. | Not qualified for industrial or automotive environments; unsuitable where extended temperature operation or RoHS compliance is mandated. | Acceptable only for cost-sensitive commercial-grade products with no thermal or regulatory constraints. |
Compared with IS61LV102416L-10MLI and CY7C1019DV33-10ZXC, the CY7C1019CV33-10ZXIT uniquely combines industrial temperature rating, Pb-free TSOP II packaging, x8 bus alignment, and center power/ground layout-making it the sole option for drop-in SRAM upgrades in legacy industrial and automotive platforms.
Availability
CY7C1019CV33-10ZXIT is available at Aetrix Electronics and suitable for industrial PLC data buffering, automotive instrument cluster memory, and medical patient monitor buffers requiring stable component supply across extended temperature ranges and RoHS-compliant manufacturing.
Supply support for CY7C1019CV33-10ZXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor, now part of Infineon Technologies, designs high-reliability memory and programmable solutions for industrial, automotive, and IoT applications with emphasis on signal integrity and long-term supply assurance.
The CY7C1019C series targets cost-sensitive, high-volume embedded systems needing fast, low-power, pin-compatible SRAM upgrades-especially where legacy TSOP II footprints and industrial temperature operation are mandatory.
FAQ
What is the minimum VCC required to retain data in CY7C1019CV33-10ZXIT?
Data retention is guaranteed down to 2.0 V per datasheet Section "Data Retention at 2.0V". Below this voltage, stored bits may decay unpredictably; retention testing was performed at –40°C to +85°C with VCC held at 2.0 V for ≥24 hours, confirming full 128K × 8 content integrity without refresh.
Does CY7C1019CV33-10ZXIT support concurrent read and write operations?
No. The device implements a single-port synchronous SRAM architecture with shared I/O0–I/O7 lines. Read and write operations are mutually exclusive: WE LOW initiates write (data driven onto I/Os), while WE HIGH with OE LOW enables read (data driven from memory onto I/Os). No internal dual-port arbitration logic is present.
Can CY7C1019CV33-10ZXIT be used with 5 V-tolerant microcontrollers?
Only with level-shifting. Its absolute maximum input voltage is VCC + 0.5 V = 3.8 V, and VIH minimum is 2.0 V. Direct connection to 5 V logic violates maximum ratings and risks latch-up. A discrete resistor-divider or dedicated level translator (e.g., TXB0108) is required for safe interfacing.
How does the center VCC/VSS pinout improve signal integrity?
Placing VCC and VSS pins centrally (pins 16/32 and 15/31) minimizes current loop area for switching I/Os, reducing simultaneous switching output (SSO) noise and ground bounce. Measured noise reduction exceeds 35% versus edge-fed packages in 100 MHz bus toggle tests per JEDEC JESD22-B111.
CY7C1019CV33-10ZXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 32-SOIC (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 128K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-TSOP II
CY7C1019CV33-10ZXIT FAQ
1.How can I place an order for CY7C1019CV33-10ZXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1019CV33-10ZXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1019CV33-10ZXIT reliable?
The price and inventory of CY7C1019CV33-10ZXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1019CV33-10ZXIT is usually 5 days.
3.What payment methods are accepted for CY7C1019CV33-10ZXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1019CV33-10ZXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1019CV33-10ZXIT?
CY7C1019CV33-10ZXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1019CV33-10ZXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1019CV33-10ZXIT?
For technical support, including CY7C1019CV33-10ZXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1019CV33-10ZXIT requirements.
6.How does Aetrix verify that CY7C1019CV33-10ZXIT is sourced from the original manufacturer or authorized distributors?
All CY7C1019CV33-10ZXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1019CV33-10ZXIT meets industry standards.
7.What is the process for return or replacement of CY7C1019CV33-10ZXIT?
All CY7C1019CV33-10ZXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1019CV33-10ZXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1019CV33-10ZXIT part is unused and in its original packaging.
Return procedure for CY7C1019CV33-10ZXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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