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Infineon Technologies CY7C1019CV33-12ZXC
- Part No.:
- CY7C1019CV33-12ZXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 32-SOIC (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1019CV33-12ZXC.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 32TSOP II
- Quantity:
- Payment:
- Shipping:
Inventory:4,916
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Product details
Overview
CY7C1019CV33-12ZXC from Cypress Semiconductor is a 1 Mbit (128K × 8) CMOS static RAM with 12 ns access time, 3.3 V supply, and industrial temperature range (–40°C to +85°C). It features automatic CE-controlled power-down, tristate I/Os, center power/ground pinout, and pin compatibility with CY7C1019BV33. Used in embedded controllers requiring fast, low-power, nonvolatile-critical memory buffering.
For engineers reviewing the CY7C1019CV33-12ZXC datasheet, CY7C1019CV33-12ZXC pinout, CY7C1019CV33-12ZXC application, or CY7C1019CV33-12ZXC equivalent, key selection criteria include tAA = 12 ns read timing, ISB2 = 5 mA standby current, CE/OE/WE control logic, and TSOP II Pb-free package compatibility with legacy board layouts.
Technical Context
The CY7C1019CV33-12ZXC implements a synchronous, address-decoded 128K × 8 SRAM array with dual-level decoding (row/column), sense amplifiers, and input/output buffers. Its CE/OE/WE three-control architecture enables precise read/write gating and high-impedance state management across all eight bidirectional I/O lines.
Automatic power-down is triggered solely by CE HIGH under TTL or CMOS input thresholds, reducing ICC to 5 mA (ISB2) at VCC max and f = 0. The device supports easy memory expansion via CE daisy-chaining and OE-controlled output enable, with no internal refresh or clock required.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 1 Mbit (131,072 × 8), enabling 128 KB of byte-addressable buffer space without external multiplexing |
| Access Time (tAA) | 12 ns maximum - supports CPU bus cycles up to 83 MHz in burst-read configurations |
| Supply Voltage | 3.3 V ±10% - compatible with standard LVTTL and LVCMOS I/O domains |
| Standby Current (ISB2) | 5 mA maximum at VCC max and f = 0 - enables low-power hold mode during system sleep |
| Operating Temperature | –40°C to +85°C - qualified for industrial control and automotive-A environments |
| I/O Interface | 8-bit bidirectional tristate bus (I/O0–I/O7) - eliminates need for external transceivers in simple microcontroller interfaces |
| Control Inputs | CE̅, OE̅, WE̅ active-low - enables direct connection to FPGA or MCU address/data buses with minimal glue logic |
Pinout & Package
This device is packaged in a 32-pin TSOP II (Thin Small Outline Package, Type II), Pb-free, 400-mil body width, with 0.5 mm lead pitch. Pin 1 is marked by a beveled corner or notch on the package top surface.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit address bus supporting full 128K-word decoding; A16 is MSB |
| I/O0–I/O7 | Bidirectional Data I/O | 8-bit tristate data bus shared for read and write; high-impedance when CE̅ or OE̅ HIGH |
| CE̅ | Chip Enable | Active-low global select; forces automatic power-down and high-Z I/O when HIGH |
| OE̅ | Output Enable | Active-low read gate; controls output drivers only; does not affect power state |
| WE̅ | Write Enable | Active-low write strobe; latches data on I/O0–I/O7 when CE̅ also LOW |
| VCC | Power Supply | 3.3 V core and I/O supply; two pins (pins 16 and 32) provide low-impedance decoupling paths |
| VSS | Ground | Signal and power ground; two pins (pins 15 and 31) reduce ground bounce in high-speed operation |
Key Features
| Feature | Design Value |
|---|---|
| Center Power/Ground Pinout | Dual VCC (pins 16, 32) and dual VSS (pins 15, 31) placed centrally to minimize simultaneous switching noise and improve signal integrity |
| Automatic CE Power-Down | Reduces ICC from 75 mA (active) to 5 mA (standby) without external control logic or sequencing |
| Pb-Free TSOP II Package | RoHS-compliant 32-pin TSOP II footprint (51-85095) ensures drop-in replacement for legacy assemblies and reflow compatibility |
| Pin-Compatible Upgrade | Direct replacement for CY7C1019BV33 with identical pinout and function - simplifies migration from -10/-15 speed grades |
Applications
| Industrial PLC Data Buffer | Automotive Instrument Cluster Memory |
|---|---|
Use Scenario: Stores real-time sensor logs and configuration registers in programmable logic controller backplanes with intermittent CPU access. IC Role / Device Role / Timing Role: Nonvolatile-critical SRAM buffer holding firmware scratchpad and last-known-state variables during power cycling. Use Value: 12 ns tAA enables deterministic response to interrupt-driven I/O scans; 5 mA ISB2 extends battery-backed runtime during brownout conditions. | Use Scenario: Holds display frame buffers and CAN message queues in digital instrument clusters operating across –40°C to +85°C ambient. IC Role / Device Role / Timing Role: Standalone parallel SRAM interfaced directly to MCU's external memory bus for zero-latency UI rendering. Use Value: Industrial-grade temperature qualification and CE-controlled power-down meet ASIL-B functional safety requirements for non-safety-critical memory subsystems. |
| Medical Diagnostic Imaging Cache | Test & Measurement Equipment FIFO |
Use Scenario: Temporarily stores digitized waveform segments from analog front-end ADCs before DSP processing in portable ultrasound units. IC Role / Device Role / Timing Role: High-speed, low-power data staging memory between sampling and compression engines. Use Value: Tristate I/O and OE-controlled output enable allow seamless handoff to downstream processors without bus contention or added isolation logic. | Use Scenario: Implements configurable depth FIFO in automated test equipment for capturing serial protocol bursts (e.g., SPI, I²C) at up to 83 MHz sample rate. IC Role / Device Role / Timing Role: Asynchronous parallel memory used as first-in-first-out buffer with external address sequencer. Use Value: Center VCC/VSS layout and 8 pF CIN/COUT ensure stable timing margins under 3 ns signal transition conditions per AC test spec. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61LV102416-12TQLI | 1 Mbit × 16 organization, 12 ns, 3.3 V, same TSOP II package but 44-pin | Requires PCB redesign due to different pin count and data bus width; supports wider data path | Select only if 16-bit bus interface is required and board layout allows 44-pin footprint change |
| AS6C1008-12ZIN | 1 Mbit × 8, 12 ns, 3.3 V, 32-pin SOJ (not TSOP II); higher ISB = 15 mA | Same pinout function but different mechanical package; incompatible with TSOP II socket or stencil | Choose only for SOJ-based legacy systems where TSOP II rework is prohibited |
Compared with IS61LV102416-12TQLI and AS6C1008-12ZIN, the CY7C1019CV33-12ZXC offers direct TSOP II footprint compatibility, lower standby current (5 mA vs. 15 mA), and guaranteed industrial temperature operation without derating - making it optimal for space-constrained, power-sensitive upgrades.
Availability
CY7C1019CV33-12ZXC is available at Aetrix Electronics and suitable for industrial PLC data buffering, automotive instrument cluster memory, and medical diagnostic imaging cache requiring stable component supply and long-term manufacturing continuity.
Supply support for CY7C1019CV33-12ZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and communications markets.
The CY7C1019C series delivers cost-optimized, low-power parallel SRAMs targeting legacy bus-based microcontroller and FPGA systems needing deterministic access timing and extended temperature support.
FAQ
What is the maximum clock frequency supported by CY7C1019CV33-12ZXC?
The CY7C1019CV33-12ZXC is an asynchronous SRAM and does not use a clock signal. Its maximum effective interface speed is determined by tRC = 12 ns, enabling reliable operation with microcontrollers or FPGAs generating bus cycles up to approximately 83 MHz in read-only or interleaved read/write modes. Timing compliance depends on proper setup/hold margins for CE̅, OE̅, and WE̅ relative to address and data transitions.
Does CY7C1019CV33-12ZXC require external refresh circuitry?
No. As a static RAM, the CY7C1019CV33-12ZXC retains data indefinitely while powered, with no external refresh required. Data retention is guaranteed down to 2.0 V VCC, and the device enters automatic low-power mode (ISB2 = 5 mA) when CE̅ is deasserted - eliminating need for refresh controllers or periodic wake-up sequences.
Can CY7C1019CV33-12ZXC be used with 5 V tolerant microcontrollers?
No. The CY7C1019CV33-12ZXC operates strictly at 3.3 V ±10% and has absolute maximum input voltage of VCC + 0.5 V (≤3.8 V). Direct connection to 5 V logic violates VIH/VIL specifications and risks latch-up or permanent damage. Level-shifting circuitry or 3.3 V–compatible MCUs (e.g., ARM Cortex-M3/M4, Renesas RX, Infineon XMC) are required for safe interface.
Is the 32-pin TSOP II package of CY7C1019CV33-12ZXC compatible with CY7C1019BV33 footprints?
Yes. The CY7C1019CV33-12ZXC uses the identical 32-pin TSOP II mechanical outline (51-85095) and pinout as the CY7C1019BV33, including matching VCC, VSS, address, data, and control pin assignments. No PCB modification is needed for drop-in replacement, though users must verify timing margin compliance at 12 ns versus the original device's speed grade.
CY7C1019CV33-12ZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 32-SOIC (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 128K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 12ns
- Access Time:
- 12 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-TSOP II
CY7C1019CV33-12ZXC FAQ
1.How can I place an order for CY7C1019CV33-12ZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1019CV33-12ZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1019CV33-12ZXC reliable?
The price and inventory of CY7C1019CV33-12ZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1019CV33-12ZXC is usually 5 days.
3.What payment methods are accepted for CY7C1019CV33-12ZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1019CV33-12ZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1019CV33-12ZXC?
CY7C1019CV33-12ZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1019CV33-12ZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1019CV33-12ZXC?
For technical support, including CY7C1019CV33-12ZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1019CV33-12ZXC requirements.
6.How does Aetrix verify that CY7C1019CV33-12ZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1019CV33-12ZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1019CV33-12ZXC meets industry standards.
7.What is the process for return or replacement of CY7C1019CV33-12ZXC?
All CY7C1019CV33-12ZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1019CV33-12ZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1019CV33-12ZXC part is unused and in its original packaging.
Return procedure for CY7C1019CV33-12ZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1019CV33-12ZXC Tags
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M24C02-WMN6TP
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