My Inquiry
My Account
Infineon Technologies CY7C1019CV33-15ZXIT
- Part No.:
- CY7C1019CV33-15ZXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 32-SOIC (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1019CV33-15ZXIT.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 32TSOP II
- Quantity:
- Payment:
- Shipping:
Inventory:4,353
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1019CV33-15ZXIT from Cypress Semiconductor is a 1 Mbit (128K × 8) high-speed CMOS static RAM with 15 ns access time, 3.3 V supply, industrial temperature range (–40°C to +85°C), and automatic CE-controlled power-down mode. It features center power/ground pinout, tristate I/O drivers, and pin compatibility with CY7C1019BV33 for drop-in memory upgrades in embedded controllers and data acquisition systems.
For engineers reviewing the CY7C1019CV33-15ZXIT datasheet, CY7C1019CV33-15ZXIT pinout, CY7C1019CV33-15ZXIT application, or CY7C1019CV33-15ZXIT equivalent, key selection criteria include tAA = 15 ns read timing, ISB2 = 5 mA standby current at CMOS inputs, VCC = 3.3 V ±10%, and TSOP II package compatibility with legacy board layouts.
Technical Context
The CY7C1019CV33-15ZXIT implements a fully asynchronous SRAM architecture with independent CE, OE, and WE controls enabling flexible bus interfacing. Its 128K × 8 organization uses a 17-bit address bus (A0–A16) and 8-bit bidirectional I/O bus (I/O0–I/O7), supporting both CE- and WE-controlled read/write cycles per JEDEC-standard timing waveforms.
Automatic power-down activates when CE is HIGH, reducing ICC to 5 mA (ISB2) without external control logic. The device supports three distinct operating modes-read, write, and high-impedance standby-governed by the truth table-defined interaction of CE, OE, and WE, with all outputs entering high-Z on CE HIGH, OE HIGH, or during write transitions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 1 Mbit (128K words × 8 bits); supports byte-wide data paths without external multiplexing |
| Access Time (tAA) | 15 ns maximum; ensures reliable interface with 66 MHz microcontrollers and FPGAs |
| VCC Supply | 3.3 V ±10%; compatible with standard LVTTL and LVCMOS I/O voltage domains |
| Operating Temperature | –40°C to +85°C industrial grade; validated for use in industrial PLCs and motor drives |
| Standby Current (ISB2) | 5 mA maximum at VCC max and CMOS input conditions; enables low-power sleep states |
| Package | 32-pin TSOP II (51-85095); surface-mount footprint with 0.5 mm pitch and JEDEC MO-153 compliance |
| Pin Compatibility | Pin- and function-compatible with CY7C1019BV33; allows direct replacement in existing designs |
Pinout & Package
Package: 32-pin TSOP II (51-85095), 400-mil body width, lead-free (Pb-free) construction, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit address bus selecting one of 131,072 memory locations |
| I/O0–I/O7 | Bidirectional Data Bus | 8-bit tristate I/O lines shared for read and write operations |
| CE | Chip Enable (active LOW) | Primary device select; enables automatic power-down when HIGH |
| OE | Output Enable (active LOW) | Controls output buffer enable during read cycles only |
| WE | Write Enable (active LOW) | Initiates write operation when CE is LOW; disables outputs during write |
| VCC | Power Supply | 3.3 V core and I/O supply; two pins (pins 16 and 31) provide low-impedance decoupling |
| VSS | Ground | Signal and power ground; two pins (pins 15 and 32) reduce ground bounce |
Key Features
| Feature | Design Value |
|---|---|
| Center Power/Ground Pinout | Reduces simultaneous switching noise (SSN) and improves signal integrity on dense PCBs |
| Automatic CE Power-Down | Reduces standby current to 5 mA without external logic or software intervention |
| Tristate Output Drivers | Enables direct connection to shared data buses without external bus transceivers |
| Easy Memory Expansion Support | CE and OE dual-enable logic allows seamless stacking of multiple devices for wider memory maps |
| Pb-Free TSOP II Packaging | Meets RoHS Directive 2011/65/EU; compatible with standard reflow soldering profiles |
Applications
| Industrial PLC Memory Buffer | Automotive Engine Control Unit (ECU) Data Log |
|---|---|
|
Use Scenario: Storing real-time sensor readings and control state variables in programmable logic controllers with deterministic cycle times. IC Role / Device Role / Timing Role: Asynchronous byte-wide SRAM providing zero-wait-state access for ladder logic execution and I/O scan buffers. Use Value: 15 ns tAA ensures sub-66 MHz bus timing margin; ISB2 = 5 mA extends uptime in battery-backed modules. |
Use Scenario: Capturing transient engine parameters (RPM, throttle position, O2 voltage) during fault events in automotive ECUs. IC Role / Device Role / Timing Role: Non-volatile data capture buffer interfaced directly to microcontroller GPIOs with CE/OE/WE control. Use Value: Industrial temperature rating (–40°C to +85°C) guarantees operation across under-hood thermal cycles. |
| Medical Diagnostic Imaging FIFO | Test & Measurement Equipment Scratchpad |
|
Use Scenario: Acting as a temporary frame buffer between ADC sampling and DSP processing in portable ultrasound units. IC Role / Device Role / Timing Role: High-reliability, low-latency SRAM used in burst-mode acquisition pipelines with strict jitter requirements. Use Value: Center VCC/VSS pinout minimizes ground bounce during high-speed parallel reads, preserving signal fidelity. |
Use Scenario: Providing fast scratchpad memory for firmware calibration routines and self-test sequences in benchtop oscilloscopes. IC Role / Device Role / Timing Role: Standalone memory resource accessed via microcontroller's external bus interface during boot and diagnostics. Use Value: Pin compatibility with CY7C1019BV33 allows reuse of legacy test fixtures and layout patterns. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61LV102416L-15TQLI | 1 Mbit (64K × 16), 15 ns, 3.3 V, 48-pin TSOP II; wider data bus but different address mapping | Requires PCB redesign due to 16-bit interface and non-identical pinout; not drop-in | Select only if system requires 16-bit data path and board revision is feasible |
| Cypress CY7C1019DV33-15ZXC | Same 128K × 8 organization and timing, but Pb-free 48-ball VFBGA (51-85150); no TSOP II footprint | Suitable for space-constrained designs; incompatible with TSOP II sockets or reflow profiles | Choose for new compact designs where VFBGA assembly capability exists |
Compared with IS61LV102416L-15TQLI and CY7C1019DV33-15ZXC, the CY7C1019CV33-15ZXIT uniquely preserves legacy TSOP II layout compatibility while delivering verified 15 ns performance and industrial temperature reliability-critical for cost-sensitive, volume-manufactured embedded systems.
Availability
CY7C1019CV33-15ZXIT is available at Aetrix Electronics and suitable for industrial PLCs, automotive ECUs, medical imaging subsystems, and test equipment requiring stable component supply and long-term obsolescence management.
Supply support for CY7C1019CV33-15ZXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and communications markets.
The CY7C1019C series targets cost-sensitive, high-volume embedded systems needing proven, pin-compatible SRAM upgrades with guaranteed industrial temperature operation and low-power standby modes.
FAQ
What is the minimum VCC required for data retention in CY7C1019CV33-15ZXIT?
Data retention is guaranteed down to 2.0 V per the datasheet, meaning the device maintains stored contents during brown-out conditions or controlled power-down sequences without external backup. This feature enables use in battery-backed systems where main supply may dip below nominal 3.3 V but remains ≥2.0 V.
Does CY7C1019CV33-15ZXIT require external pull-up resistors on its control pins?
No external pull-ups are required: CE, OE, and WE inputs have TTL-compatible thresholds (VIH = 2.0 V min, VIL = 0.8 V max) and operate reliably with direct MCU GPIO drive. Internal input leakage is ≤±1 μA, eliminating need for biasing in standard 3.3 V logic interfaces.
Can CY7C1019CV33-15ZXIT be used with 5 V tolerant microcontrollers?
No-it is strictly a 3.3 V device. Input voltages must stay within –0.3 V to VCC + 0.3 V (i.e., ≤3.6 V), and VCC must be 3.3 V ±10%. Interfacing with 5 V systems requires level-shifting on all address, data, and control lines to avoid damage or parametric failure.
How does the automatic power-down mode activate and what current does it draw?
Power-down activates automatically when CE is driven HIGH, disabling internal circuitry and reducing supply current to 5 mA (ISB2) at VCC max and CMOS input conditions. No additional control signals or configuration registers are needed-activation is purely hardware-driven by CE state.
CY7C1019CV33-15ZXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 32-SOIC (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 128K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 15 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-TSOP II
CY7C1019CV33-15ZXIT FAQ
1.How can I place an order for CY7C1019CV33-15ZXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1019CV33-15ZXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1019CV33-15ZXIT reliable?
The price and inventory of CY7C1019CV33-15ZXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1019CV33-15ZXIT is usually 5 days.
3.What payment methods are accepted for CY7C1019CV33-15ZXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1019CV33-15ZXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1019CV33-15ZXIT?
CY7C1019CV33-15ZXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1019CV33-15ZXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1019CV33-15ZXIT?
For technical support, including CY7C1019CV33-15ZXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1019CV33-15ZXIT requirements.
6.How does Aetrix verify that CY7C1019CV33-15ZXIT is sourced from the original manufacturer or authorized distributors?
All CY7C1019CV33-15ZXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1019CV33-15ZXIT meets industry standards.
7.What is the process for return or replacement of CY7C1019CV33-15ZXIT?
All CY7C1019CV33-15ZXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1019CV33-15ZXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1019CV33-15ZXIT part is unused and in its original packaging.
Return procedure for CY7C1019CV33-15ZXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1019CV33-15ZXIT Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
