Infineon Technologies CY7C1019DV33-10VXIT
- Part No.:
- CY7C1019DV33-10VXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 32-BSOJ (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1019DV33-10VXIT.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 32SOJ
- Quantity:
- Payment:

- Shipping:

Inventory:776
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Product details
Overview
CY7C1019DV33-10VXIT from Cypress Semiconductor is a 1-Mbit (128 K × 8) high-speed CMOS static RAM with 10 ns access time, 3.3 V supply, and automatic CE-controlled power-down. It features center power/ground pinout, 3 mA standby current (ISB2), and 2.0 V data retention-designed for embedded control memory buffers in industrial PLCs and real-time data acquisition systems.
For engineers reviewing the CY7C1019DV33-10VXIT datasheet, CY7C1019DV33-10VXIT pinout, CY7C1019DV33-10VXIT application, or CY7C1019DV33-10VXIT equivalent, key selection criteria include tAA ≤ 10 ns read timing, ISB2 ≤ 3 mA low-power standby, CE/OE/WE three-state control logic, and Pb-free 48-ball VFBGA package compatibility with space-constrained industrial controllers.
Technical Context
This SRAM implements a synchronous, non-volatile-retentive memory array organized as 131,072 × 8 bits with fully decoded address inputs (A0–A16) and bidirectional I/O0–I/O7 pins. Its automatic power-down activates when CE is HIGH, reducing ICC to 3 mA (ISB2) without external control logic.
Read operations require CE and OE LOW with WE HIGH; writes require CE and WE LOW while OE may be HIGH or LOW. Output enable timing (tDOE = 5 ns) and chip-enable disable timing (tHZCE = 5 ns) support tight bus cycle integration in microcontroller-based systems with 100 MHz clock domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128 K × 8 (131,072 words × 8 bits); supports byte-wide parallel interface without external data multiplexing |
| Access Time (tAA) | 10 ns maximum; enables direct interfacing with ARM Cortex-M4/M7 MCUs running at ≤100 MHz without wait states |
| Supply Voltage | 3.3 V ± 0.3 V; compatible with standard LDO-regulated industrial 3.3 V rails and avoids level-shifting circuitry |
| Active Current (ICC) | 60 mA at 10 ns / 100 MHz; defines thermal budget for continuous burst reads in data logging subsystems |
| Standby Current (ISB2) | 3 mA at VCC = 3.3 V, CE HIGH; enables low-power sleep modes in battery-backed industrial gateways |
| Data Retention Voltage | 2.0 V minimum; allows memory state preservation during brown-out events down to 2.0 V on VCC rail |
| Package | 48-ball VFBGA (6.5 mm × 8.0 mm, 0.8 mm pitch); supports high-density PCB layouts in compact edge-node sensors |
Pinout & Package
Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), RoHS-compliant, 6.5 mm × 8.0 mm body, 0.8 mm ball pitch, bottom-side thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit address bus supporting full 128 K-word decoding; no external address latching required |
| I/O0–I/O7 | Bidirectional Data Bus | 8-bit tristate I/O lines; high-impedance during CE HIGH, OE HIGH, or WE LOW-enables shared bus arbitration |
| CE | Chip Enable (active LOW) | Primary device select; triggers automatic power-down when HIGH, reducing ICC to 3 mA (ISB2) |
| OE | Output Enable (active LOW) | Controls output drivers only; does not affect internal power state-allows read-modify-write cycles |
| WE | Write Enable (active LOW) | Initiates write when CE is also LOW; overlapping CE/WE LOW defines write window per JEDEC SRAM timing |
| VCC | Power Supply | 3.3 V core supply; two dedicated VCC balls (B1, E5) minimize IR drop in high-frequency operation |
| VSS | Ground | Four VSS balls (A2, C1, D6, F4) provide low-inductance return paths for switching noise suppression |
| NC | No Connect | Ball G1 is unconnected; must be left floating or grounded per PCB layout guidelines-no internal die connection |
Key Features
| Feature | Design Value |
|---|---|
| Pin- and function-compatible with CY7C1018CV33/CY7C1019CV33 | Enables drop-in replacement in legacy 3.3 V SRAM designs without board rework or firmware changes |
| Center power/ground pinout | Reduces simultaneous switching noise (SSN) by symmetrically distributing VCC/VSS balls across the array |
| Easy memory expansion via CE/OE options | Supports multi-chip memory banks using daisy-chained CE signals or independent bank decoding |
| Automatic power-down on CE deassertion | Eliminates need for external power-gating logic-reduces BOM count and PCB area in portable instrumentation |
| 2.0 V data retention | Maintains stored configuration during undervoltage lockout (UVLO) events, ensuring system state recovery post-reset |
Applications
| Industrial PLC Memory Buffer | Medical Sensor Data Cache |
|---|---|
|
Use Scenario: Real-time I/O scan buffering in modular programmable logic controllers with deterministic 10 ms cycle times. IC Role / Device Role / Timing Role: High-speed parallel SRAM providing zero-wait-state access to 128 KB of process image memory for ladder logic execution. Use Value: 10 ns tAA ensures full memory read/write within one 100 MHz MCU bus cycle, eliminating pipeline stalls during scan updates. |
Use Scenario: Temporary storage of raw ADC samples from multi-channel ECG front-ends before DSP processing or wireless transmission. IC Role / Device Role / Timing Role: Byte-accessible cache holding up to 128 K samples at 10 kSPS, synchronized to DMA bursts from Cortex-M4 peripherals. Use Value: 3 mA ISB2 enables >72-hour battery life in standby mode between patient monitoring sessions without data loss. |
| Automotive Telematics Log Buffer | Test Equipment Pattern Memory |
|
Use Scenario: Storing CAN FD message logs during vehicle road testing under extended temperature range (−40°C to +85°C). IC Role / Device Role / Timing Role: Industrial-grade SRAM retaining valid data across cold cranking voltage dips down to 2.0 V on 3.3 V rail. Use Value: Guaranteed 2.0 V data retention prevents log corruption during engine start transients where VCC sags below 2.5 V. |
Use Scenario: Holding digital stimulus patterns for automated functional test of ASICs in ATE systems requiring precise timing alignment. IC Role / Device Role / Timing Role: Deterministic 10 ns read cycle (tRC) synchronizes with 100 MHz pattern generator clocks for sub-nanosecond edge placement. Use Value: Center VCC/VSS pinout minimizes ground bounce-induced timing jitter, maintaining <±50 ps setup/hold margin at 100 MHz. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS6C1008-10TIN | 10 ns access, 3.3 V, but uses 32-pin SOJ (not VFBGA); ISB2 = 2 mA (slightly lower standby) | Larger footprint (18.4 mm × 10.2 mm vs. 6.5 mm × 8.0 mm); unsuitable for ultra-compact modules | Select when board space permits SOJ and lowest possible ISB2 is critical over density |
| IS61LV102416-10ML | 10 ns, 3.3 V, 1 Mbit × 16 organization; requires data bus width change and address remapping | 16-bit interface increases throughput but demands MCU GPIO reassignment and firmware adaptation | Select only when migrating to wider data paths and redesigning memory controller logic |
Compared with AS6C1008-10TIN and IS61LV102416-10ML, CY7C1019DV33-10VXIT uniquely balances VFBGA miniaturization, 8-bit native interface, and guaranteed 10 ns timing across −40°C to +85°C-making it optimal for space-constrained industrial controllers requiring minimal firmware impact.
Availability
CY7C1019DV33-10VXIT is available at Aetrix Electronics and suitable for industrial PLCs, medical sensor nodes, automotive telematics loggers, and ATE pattern memory requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CY7C1019DV33-10VXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and IoT applications, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q100.
CY7C1019DV33 belongs to Cypress's high-speed parallel SRAM product line, engineered specifically for deterministic, low-latency memory buffering in real-time embedded systems operating across industrial temperature grades.
FAQ
Is CY7C1019DV33-10VXIT pin-compatible with CY7C1019DV33-10ZSXI?
No. CY7C1019DV33-10VXIT uses a 48-ball VFBGA package (6.5 mm × 8.0 mm), while CY7C1019DV33-10ZSXI uses a 32-pin TSOP II package (11.8 mm × 13.1 mm). Pin numbering, ball/pad layout, and thermal pad configuration differ entirely-PCB redesign is required for substitution.
Does this SRAM support asynchronous burst reads?
No. CY7C1019DV33-10VXIT is a classic asynchronous SRAM with no internal burst counter or sequential address generation. Each read requires a full address setup (tAA = 10 ns) and CE/OE assertion-burst transfers must be managed externally by the host controller.
What is the maximum junction temperature during continuous operation at 100 MHz?
At 100 MHz, ICC = 60 mA, and with θJA = 36 °C/W (VFBGA), power dissipation is ~0.198 W. With TA = +85°C, TJ ≈ 85 + (0.198 × 36) = +92.1°C-within the rated 125°C absolute maximum, leaving 33°C margin for reliability derating.
Can CE and OE both be tied LOW permanently for simplified interface?
Yes, but only if the host never performs writes. With CE and OE permanently LOW, outputs remain enabled continuously-requiring strict control of WE to avoid bus contention. For read-only boot memory, this reduces control logic; for R/W use, independent CE/OE control is mandatory per timing specifications.
CY7C1019DV33-10VXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 32-BSOJ (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 128K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-SOJ
CY7C1019DV33-10VXIT FAQ
1.How can I place an order for CY7C1019DV33-10VXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1019DV33-10VXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1019DV33-10VXIT reliable?
The price and inventory of CY7C1019DV33-10VXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1019DV33-10VXIT is usually 5 days.
3.What payment methods are accepted for CY7C1019DV33-10VXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1019DV33-10VXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1019DV33-10VXIT?
CY7C1019DV33-10VXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1019DV33-10VXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1019DV33-10VXIT?
For technical support, including CY7C1019DV33-10VXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1019DV33-10VXIT requirements.
6.How does Aetrix verify that CY7C1019DV33-10VXIT is sourced from the original manufacturer or authorized distributors?
All CY7C1019DV33-10VXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1019DV33-10VXIT meets industry standards.
7.What is the process for return or replacement of CY7C1019DV33-10VXIT?
All CY7C1019DV33-10VXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1019DV33-10VXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1019DV33-10VXIT part is unused and in its original packaging.
Return procedure for CY7C1019DV33-10VXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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