Infineon Technologies CY7C1020BN-12ZXC
- Part No.:
- CY7C1020BN-12ZXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1020BN-12ZXC.pdf
- Description:
- IC SRAM 512KBIT PAR 44TSOP II
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1020BN-12ZXC from Cypress Semiconductor is a 32K × 16-bit (512 Kbit) high-speed CMOS static RAM with 12 ns access time, 5 V supply, and automatic CE-controlled power-down. It supports independent byte-wide write enable via BHE/BLE pins and operates across commercial temperature range (0°C to +70°C). Used in legacy industrial controllers and FPGA configuration buffers where deterministic low-latency read/write timing is required.
For engineers reviewing the CY7C1020BN-12ZXC datasheet, CY7C1020BN-12ZXC pinout, CY7C1020BN-12ZXC application, or CY7C1020BN-12ZXC equivalent, key selection criteria include tAA = 12 ns, dual-byte write control, TSOP II 44-pin Pb-free packaging, and ISB2 standby current ≤ 3 mA under CMOS input conditions.
Technical Context
This SRAM implements a synchronous, non-volatile-independent memory array with full address decoding (A0–A15), 16 bidirectional I/O lines (I/O1–I/O16), and TTL/CMOS-compatible control logic for CE, OE, WE, BHE, and BLE. Its architecture enables concurrent lower- and upper-byte writes without bus contention.
The device uses a two-stage decode path-row decoder (A7–A0, A12–A14) and column decoder (A9–A11, A12–A14)-with sense amplifiers driving outputs through controlled output drivers. Power-down activation occurs automatically when CE is HIGH, reducing ICC to ISB2 ≤ 3 mA at VCC max and f = 0.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 32,768 words × 16 bits = 512 Kbit; supports parallel 16-bit data bus interfacing |
| Access Time (tAA) | 12 ns maximum; guarantees data validity within 12 ns after stable address and CE/OE assertion |
| Supply Voltage (VCC) | 5.0 V ±10%; compatible with standard 5 V TTL/CMOS logic families |
| Active Current (ICC) | 140 mA max at fMAX = 83.3 MHz; defines worst-case dynamic power draw during continuous read/write cycling |
| Standby Current (ISB2) | 3 mA max under CMOS input conditions (CE > VCC – 0.3 V); enables low-power idle mode in battery-backed systems |
| Operating Temperature | 0°C to +70°C commercial range; validated for use in non-automotive, non-military embedded environments |
| Package | 44-pin TSOP Type II (Pb-free); 0.8 mm pitch, 10.16 mm × 20.95 mm footprint, JEDEC MO-141AC compliant |
Pinout & Package
Package: 44-pin Thin Small Outline Package (TSOP Type II), Pb-free, body size 10.16 mm × 20.95 mm, 0.8 mm lead pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A15 | Address Inputs | 16-bit address bus; selects one of 32,768 memory locations; latched on CE transition |
| I/O1–I/O8 | Data I/O (Lower Byte) | Bidirectional 8-bit data path enabled by BLE = LOW during read/write; high-Z when disabled |
| I/O9–I/O16 | Data I/O (Upper Byte) | Bidirectional 8-bit data path enabled by BHE = LOW during read/write; isolated from lower byte |
| CE | Chip Enable | Primary device select; HIGH forces automatic power-down and high-Z outputs regardless of other controls |
| OE | Output Enable | Controls output drivers only; must be LOW with CE LOW for valid read data; does not affect write path |
| WE | Write Enable | Active-LOW write strobe; initiates write when CE and WE both LOW; timing referenced to last signal transition |
| BLE / BHE | Byte Low/High Enable | Independent 8-bit write masking; allows partial-word writes without external gating logic |
| VCC / VSS | Power / Ground | Single 5 V supply; requires local 0.1 µF ceramic decoupling per VCC pin per datasheet layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| Dual-byte write control | Enables selective 8-bit writes to upper (I/O9–I/O16) or lower (I/O1–I/O8) byte lanes using BHE/BLE, eliminating need for external byte-mask logic |
| Automatic CE power-down | Reduces ICC to ≤3 mA (ISB2) when CE is deasserted, supporting low-quiescent-power system sleep states without external power management circuitry |
| 12 ns access time | Meets timing requirements for 80 MHz CPU buses and FPGA configuration interfaces requiring sub-15 ns deterministic latency |
| TSOP II Pb-free package | RoHS-compliant 44-pin TSOP (JEDEC MO-141AC) with 0.8 mm pitch; optimized for automated SMT assembly and thermal reliability in reflow profiles |
| TTL/CMOS input compatibility | VIH = 2.2 V min, VIL = 0.8 V max ensures interoperability with both 5 V TTL and CMOS logic families without level-shifting |
Applications
| Industrial PLC Data Buffer | FPGA Configuration Memory |
|---|---|
Use Scenario: Storing real-time I/O status and intermediate logic state in programmable logic controllers with deterministic scan cycles. IC Role / Device Role / Timing Role: Non-volatile-independent fast-access scratchpad memory holding 512 Kbit of process image data between scan intervals. Use Value: 12 ns tAA ensures full 16-bit word reads complete before next PLC instruction fetch, eliminating pipeline stalls in 20 ms cycle applications. |
Use Scenario: Holding configuration bitstreams for Xilinx Spartan or Altera Cyclone FPGAs during power-up or dynamic reconfiguration. IC Role / Device Role / Timing Role: Parallel boot memory providing 16-bit wide configuration data to FPGA's slave parallel interface. Use Value: Dual-byte write capability allows partial reconfiguration of FPGA logic blocks without full bitstream reload, reducing update latency by up to 50%. |
| Legacy Embedded Controller Cache | Communications Protocol Stack Buffer |
Use Scenario: Acting as L1 cache extension for 8051- or 68K-based controllers running real-time OS kernels with limited on-chip RAM. IC Role / Device Role / Timing Role: External SRAM mapped into processor's memory space, accessed via dedicated address/data bus with wait-state-free timing. Use Value: tRC = 12 ns matches 83.3 MHz bus clock, enabling zero-wait-state operation and sustaining >70 MB/s sustained read throughput. |
Use Scenario: Buffering packetized data in RS-485 fieldbus gateways handling Modbus TCP-to-RTU translation. IC Role / Device Role / Timing Role: Dual-port accessible memory segment storing inbound and outbound protocol frames with independent byte addressing. Use Value: Independent BLE/BHE control permits simultaneous write of new inbound frame (lower byte) and read of pending outbound frame (upper byte), improving throughput by 35% vs. single-port SRAM. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar static RAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS6C1008-12TIN | 12 ns access, 128K × 8 organization (1 Mbit), 3.3 V supply only | Requires bus-width adaptation (8-bit vs. 16-bit native) and voltage translation for 5 V systems | Select only if migrating to 3.3 V architecture and accepting 8-bit data path redesign |
| IS61LV51216-12ML | 12 ns access, same 32K × 16 organization, but 54-pin TSOP I package and 3.3 V supply | Pinout incompatible; requires PCB redesign and level-shifting for 5 V host interfaces | Preferable for new 3.3 V designs needing longer lifecycle support; not drop-in for CY7C1020BN-12ZXC |
Compared with AS6C1008-12TIN and IS61LV51216-12ML, the CY7C1020BN-12ZXC offers native 5 V operation and 44-pin TSOP II compatibility-critical for maintaining legacy board layouts and avoiding voltage translation overhead in retrofit upgrades.
Availability
CY7C1020BN-12ZXC is available at Aetrix Electronics and suitable for industrial PLC data buffering, FPGA configuration storage, legacy controller cache expansion, and communications protocol stack buffering requiring stable component supply and long-term obsolescence management.
Supply support for CY7C1020BN-12ZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies since 2020) designed high-reliability mixed-signal and memory ICs for industrial, automotive, and consumer applications, with emphasis on timing precision and robustness.
The CY7C1020BN series was developed specifically for 5 V embedded systems requiring fast, low-power, byte-selectable SRAM-targeting programmable controllers, test equipment, and FPGA-based platforms prior to widespread 3.3 V adoption.
FAQ
Is CY7C1020BN-12ZXC compatible with 3.3 V logic interfaces?
No. The CY7C1020BN-12ZXC is specified only for 5.0 V ±10% operation. Its VIH minimum is 2.2 V and VIL maximum is 0.8 V, which align with 5 V TTL levels-not 3.3 V CMOS thresholds. Direct connection to 3.3 V microcontrollers risks undriven inputs or excessive current leakage; level-shifting circuitry is mandatory.
Does this SRAM retain data when VCC drops below specification?
No. The CY7C1020BN-12ZXC is a volatile static RAM with no internal battery or capacitor backup. Data retention ceases when VCC falls below 2.0 V, and the device enters undefined state below –0.5 V or above +7.0 V. External hold-up capacitors or supervisory circuits are required for graceful power-loss data preservation.
Can BHE and BLE be asserted simultaneously for full 16-bit writes?
Yes. When both BHE and BLE are LOW while CE and WE are LOW, the device performs a full 16-bit write to the addressed location. The truth table explicitly lists "Write – All bits" mode under CE=LOW, WE=LOW, BLE=LOW, BHE=LOW, confirming concurrent activation is supported and electrically safe.
What is the maximum clock frequency supported for burst read operations?
The CY7C1020BN-12ZXC does not support clocked or burst-mode operation. It is an asynchronous SRAM: each read cycle requires explicit CE and OE assertion, with minimum tRC = 12 ns between successive accesses. Maximum effective throughput is 83.3 MHz (1/12 ns), but only under ideal address-stable, control-synchronized conditions-not sustained burst rates.
CY7C1020BN-12ZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 512Kbit
- Memory Organization:
- 32K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 12ns
- Access Time:
- 12 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY7C1020BN-12ZXC FAQ
1.How can I place an order for CY7C1020BN-12ZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1020BN-12ZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1020BN-12ZXC reliable?
The price and inventory of CY7C1020BN-12ZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1020BN-12ZXC is usually 5 days.
3.What payment methods are accepted for CY7C1020BN-12ZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1020BN-12ZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1020BN-12ZXC?
CY7C1020BN-12ZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1020BN-12ZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1020BN-12ZXC?
For technical support, including CY7C1020BN-12ZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1020BN-12ZXC requirements.
6.How does Aetrix verify that CY7C1020BN-12ZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1020BN-12ZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1020BN-12ZXC meets industry standards.
7.What is the process for return or replacement of CY7C1020BN-12ZXC?
All CY7C1020BN-12ZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1020BN-12ZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1020BN-12ZXC part is unused and in its original packaging.
Return procedure for CY7C1020BN-12ZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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