Infineon Technologies CY7C1020CV33-10ZXC
- Part No.:
- CY7C1020CV33-10ZXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1020CV33-10ZXC.pdf
- Description:
- IC SRAM 512KBIT PAR 44TSOP II
- Quantity:
- Payment:

- Shipping:

Inventory:2,983
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1020CV33-10ZXC from Cypress Semiconductor is a 512 Kbit (32K × 16) high-speed CMOS static RAM with 10 ns access time, 3.3 V supply, and automatic CE-controlled power-down. It supports independent byte write control via BHE/BLE inputs and operates across commercial (0°C to 70°C), industrial (–40°C to 85°C), and automotive (–40°C to 125°C) temperature ranges in a Pb-free 44-pin TSOP II package. Used in real-time data buffering for network packet processors and FPGA configuration memory.
For engineers reviewing the CY7C1020CV33-10ZXC datasheet, CY7C1020CV33-10ZXC pinout, CY7C1020CV33-10ZXC application, or CY7C1020CV33-10ZXC equivalent, key selection criteria include tAA ≤ 10 ns, dual-byte enable support, ISB2 standby current ≤ 5 mA (CMOS inputs), and TSOP II footprint compatibility with legacy CY7C1020V33 designs.
Technical Context
This SRAM implements a synchronous, non-volatile-independent architecture with fully decoded 15-bit address space (A0–A14) and bidirectional 16-bit I/O (I/O1–I/O16). Its read/write timing is governed by overlapping CE, WE, OE, BHE, and BLE control signals - not clocked - enabling asynchronous operation in microcontroller co-processor interfaces.
The device uses TTL- and CMOS-compatible input thresholds (VIH ≥ 2.0 V, VIL ≤ 0.8 V) and delivers guaranteed VOH ≥ 2.4 V / VOL ≤ 0.4 V under load. Power management relies on two distinct standby modes: ISB1 (TTL input logic levels) and ISB2 (CMOS input logic levels), with ISB2 achieving 5 mA max at VCC = 3.63 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 32,768 words × 16 bits = 512 Kbit; enables single-cycle 16-bit parallel data transfers without interleaving. |
| Access Time (tAA) | 10 ns maximum; ensures sub-100 MHz bus interface compatibility with ARM9, MIPS32, and FPGA soft-core systems. |
| Supply Voltage | 3.3 V ± 10% (3.0 V to 3.6 V); matches standard LVTTL/LVCMOS I/O rails and eliminates level-shifting in 3.3 V systems. |
| Active Current (ICC) | 90 mA max at fMAX = 100 MHz; corresponds to ~325 mW typical active power, suitable for thermally constrained embedded modules. |
| Standby Current (ISB2) | 5 mA max (CMOS inputs); enables low-power sleep states in battery-backed instrumentation and automotive ECUs. |
| Byte Enable Control | BHE and BLE pins allow independent 8-bit writes to upper/lower bytes; reduces bus contention and supports legacy 8-bit peripheral interfacing. |
| Package | 44-pin TSOP II (51-85087); surface-mount, JEDEC-standard footprint with 0.8 mm pitch; compatible with automated reflow assembly. |
Pinout & Package
Package: 44-pin Thin Small Outline Package Type II (TSOP II), Pb-free, body size 18.517 mm × 10.262 mm × 1.194 mm, 0.8 mm lead pitch, JEDEC MO-141AC compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A14 | Address Inputs | 15-bit address bus; selects one of 32,768 memory locations; TTL/CMOS compatible. |
| I/O1–I/O8 | Data I/O (Lower Byte) | Bidirectional 8-bit data path; driven during read when BLE = LOW and OE = LOW; tri-stated otherwise. |
| I/O9–I/O16 | Data I/O (Upper Byte) | Bidirectional 8-bit data path; driven during read when BHE = LOW and OE = LOW; tri-stated otherwise. |
| CE | Chip Enable | Active-LOW chip select; enables internal circuitry and determines power-down entry/exit timing (tPD = 10 ns). |
| WE | Write Enable | Active-LOW write strobe; initiates write cycle when CE = LOW; controls data latching timing (tPWE = 7 ns min). |
| OE | Output Enable | Active-LOW output control; places I/O pins in high-Z state when HIGH; enables read data assertion when LOW. |
| BLE / BHE | Byte Low/High Enable | Independent active-LOW enables for lower/upper data bytes; allows partial-word writes without masking logic. |
| VCC | Power Supply | 3.3 V core and I/O supply; two dedicated pins (11, 33) reduce IR drop and improve noise immunity. |
| VSS | Ground | System ground reference; two dedicated pins (12, 34) provide low-inductance return paths. |
| NC | No Connect | Pins 1, 22, 23, 28 are unconnected on die; must be left floating or tied to GND per layout best practice. |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous Dual-Byte Write | Independent BHE/BLE control enables simultaneous or selective 8-bit writes - eliminates need for external byte-mask logic in 16-bit bus systems. |
| Two-Tier Standby Power Management | ISB1 (15 mA) and ISB2 (5 mA) modes adapt to host controller input logic family, reducing quiescent power by up to 67% in CMOS-driven systems. |
| Guaranteed 10 ns Read Timing | tAA = 10 ns, tACE = 10 ns, tDOE = 5 ns ensure deterministic data availability for tight-timing control loops in motor drives and digital power supplies. |
| Automotive Temperature Support | Qualified for –40°C to +125°C operation with 10 mA ISB2 max; meets AEC-Q100 stress test requirements for engine control and ADAS subsystems. |
| Pb-Free TSOP II Packaging | RoHS-compliant 44-pin TSOP II (51-85087) enables drop-in replacement in legacy designs while meeting modern environmental compliance mandates. |
Applications
| Industrial PLC Data Buffering | FPGA Configuration Storage |
|---|---|
Use Scenario: Real-time I/O scan cycles in programmable logic controllers require fast, deterministic access to transient process data. IC Role / Device Role / Timing Role: Acts as dual-port-accessible scratchpad RAM for ladder logic execution engine; provides 10 ns read access to maintain 100 µs scan intervals. Use Value: Eliminates wait states in ARM Cortex-M7-based PLC CPUs, sustaining >95% CPU utilization during high-speed analog acquisition bursts. | Use Scenario: Storing bitstream configuration for Xilinx Artix-7 FPGAs during cold boot and dynamic partial reconfiguration. IC Role / Device Role / Timing Role: Serves as parallel-programmable configuration memory; loaded via master SPI-to-parallel bridge with CE/OE/WE handshaking. Use Value: Enables <100 ms full reconfiguration time due to 10 ns tAA and no setup/hold timing constraints on address bus. |
| Automotive Body Control Module | Medical Imaging Data Pipeline |
Use Scenario: Storing sensor fusion outputs and actuator command history in vehicle body control units operating under wide ambient temperature swings. IC Role / Device Role / Timing Role: Provides nonvolatile-independent, fast-access working memory for CAN FD message queuing and PWM duty-cycle calculation. Use Value: Maintains functional safety integrity (ISO 26262 ASIL-B) through guaranteed –40°C to +125°C operation and 5 mA ISB2 leakage control. | Use Scenario: Temporary frame storage between ultrasound beamformer ASIC and JPEG2000 compression engine in portable imaging devices. IC Role / Device Role / Timing Role: Functions as ping-pong buffer for 12-bit grayscale pixel streams; leverages BLE/BHE for efficient 16-bit-aligned line buffering. Use Value: Reduces DMA overhead by 40% versus single-byte SRAM, enabling 30 fps real-time B-mode display on low-power Cortex-A53 SoCs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed parallel SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61LV51216AL-10MLI | Same 32K × 16 organization, 10 ns tAA, but uses 44-pin SOJ package; lacks automotive temp grade and BHE/BLE separation. | SOJ footprint requires PCB redesign; no AEC-Q100 qualification limits use to commercial/industrial systems only. | Select when cost sensitivity outweighs automotive compliance and board space permits SOJ mounting. |
| ON Semiconductor MC68HC11E9CP | Not an SRAM - integrated MCU with 512-byte on-chip RAM; no external parallel interface or byte-enable capability. | Cannot replace CY7C1020CV33-10ZXC in external memory roles; only viable as system-level architectural alternative in ultra-low-cost 8-bit control nodes. | Reject as direct alternative; consider only if migrating entire design to monolithic microcontroller architecture. |
Compared with IS61LV51216AL-10MLI, CY7C1020CV33-10ZXC offers automotive qualification and TSOP II footprint compatibility, while MC68HC11E9CP is functionally incompatible as a microcontroller - making the Cypress device the sole viable choice for high-reliability, pin-compatible SRAM upgrades.
Availability
CY7C1020CV33-10ZXC is available at Aetrix Electronics and suitable for industrial PLC data buffering, FPGA configuration storage, and automotive body control modules requiring stable component supply across extended temperature ranges and RoHS-compliant packaging.
Supply support for CY7C1020CV33-10ZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for industrial, automotive, and communications markets, with emphasis on reliability and long-term supply stability.
The CY7C1020CV33 belongs to Cypress's parallel SRAM product line, engineered specifically for low-latency, byte-selectable data buffering in real-time embedded systems where deterministic timing and wide temperature operation are critical.
FAQ
What is the maximum operating frequency supported by CY7C1020CV33-10ZXC?
The device does not operate on a clock signal - it is an asynchronous SRAM. Its maximum usable bus frequency is determined by tRC = 10 ns, supporting up to 100 MHz burst transfers when interfaced with controllers that meet setup/hold timing. No internal oscillator or clock input exists.
Can CY7C1020CV33-10ZXC be used with 5 V tolerant microcontrollers?
No - it is strictly a 3.3 V device with VIH(max) = VCC + 0.3 V (≤ 3.93 V) and absolute maximum VCC = 4.6 V. Direct connection to 5 V I/O buses will damage the part. Level translation (e.g., TXB0108) is required for mixed-voltage systems.
Does this SRAM retain data during power loss?
No - it is volatile memory. Data is lost within microseconds of VCC dropping below 2.0 V. For nonvolatile storage, external EEPROM, Flash, or battery-backed SRAM must be used in conjunction with this device.
Is the 44-pin TSOP II footprint identical to CY7C1020V33?
Yes - CY7C1020CV33-10ZXC is pin- and function-compatible with CY7C1020V33 per datasheet Rev. *E. All signal names, pin numbers, and electrical behavior match exactly, enabling drop-in replacement without layout changes.
CY7C1020CV33-10ZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 512Kbit
- Memory Organization:
- 32K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY7C1020CV33-10ZXC FAQ
1.How can I place an order for CY7C1020CV33-10ZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1020CV33-10ZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1020CV33-10ZXC reliable?
The price and inventory of CY7C1020CV33-10ZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1020CV33-10ZXC is usually 5 days.
3.What payment methods are accepted for CY7C1020CV33-10ZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1020CV33-10ZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1020CV33-10ZXC?
CY7C1020CV33-10ZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1020CV33-10ZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1020CV33-10ZXC?
For technical support, including CY7C1020CV33-10ZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1020CV33-10ZXC requirements.
6.How does Aetrix verify that CY7C1020CV33-10ZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1020CV33-10ZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1020CV33-10ZXC meets industry standards.
7.What is the process for return or replacement of CY7C1020CV33-10ZXC?
All CY7C1020CV33-10ZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1020CV33-10ZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1020CV33-10ZXC part is unused and in its original packaging.
Return procedure for CY7C1020CV33-10ZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1020CV33-10ZXC Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…

