Infineon Technologies CY7C1020CV33-10ZXCT
- Part No.:
- CY7C1020CV33-10ZXCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1020CV33-10ZXCT.pdf
- Description:
- IC SRAM 512KBIT PAR 44TSOP II
- Quantity:
- Payment:

- Shipping:

Inventory:2,214
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1020CV33-10ZXCT from Cypress Semiconductor is a 512 Kbit (32K × 16) high-speed CMOS static RAM with 10 ns access time, 3.3 V supply, and independent byte write control via BHE/ BLE pins. It operates across industrial temperature range (–40°C to +85°C), features automatic CE-controlled power-down (ISB2 = 5 mA), and is packaged in a Pb-free 44-pin TSOP II for space-constrained embedded memory subsystems.
For engineers reviewing the CY7C1020CV33-10ZXCT datasheet, CY7C1020CV33-10ZXCT pinout, CY7C1020CV33-10ZXCT application, or CY7C1020CV33-10ZXCT equivalent, key selection criteria include tAA ≤ 10 ns read timing, dual-byte enable logic, CMOS-compatible 3.3 V I/O levels, low active current (90 mA max), and TSOP II footprint compatibility with legacy CY7C1020V33 designs.
Technical Context
This SRAM implements a synchronous, non-volatile-access memory array with full address decoding (A0–A14), bidirectional 16-bit data bus (I/O1–I/O16), and three-level chip select architecture (CE, OE, WE). Its byte-select logic enables partial-word writes without read-modify-write cycles.
The device uses TTL-compatible input thresholds (VIH ≥ 2.0 V, VIL ≤ 0.8 V) and delivers guaranteed VOH ≥ 2.4 V / VOL ≤ 0.4 V under load, supporting direct interfacing with 3.3 V microcontrollers and FPGAs. Power management relies on CE-driven automatic transition between ICC (90 mA) and ISB2 (5 mA) states.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 32,768 × 16 bits - supports 16-bit data bus alignment without external multiplexing |
| Access Time (tAA) | 10 ns - enables direct interface with 100 MHz bus systems without wait states |
| Supply Voltage | 3.3 V ± 10% - matches standard LVTTL and LVCMOS I/O domains |
| Operating Current (ICC) | 90 mA max - defines thermal budget for dense PCB layouts |
| Standby Current (ISB2) | 5 mA max - ensures low quiescent draw during idle periods in battery-backed systems |
| Input Capacitance | 8 pF - limits trace-length-induced signal integrity degradation at 100+ MHz edge rates |
| Output Drive | VOH ≥ 2.4 V @ –4 mA, VOL ≤ 0.4 V @ 8 mA - meets 3.3 V LVTTL output compliance |
Pinout & Package
Package: 44-pin TSOP Type II (Pb-free), 18.5 mm × 10.3 mm × 1.2 mm body, 0.8 mm pitch, JEDEC MO-141AC compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A14 | Address Input | 15-bit address bus selecting one of 32,768 memory locations |
| I/O1–I/O8 | Bidirectional Data (Lower Byte) | Data path for D0–D7; enabled only when BLE = LOW during read/write |
| I/O9–I/O16 | Bidirectional Data (Upper Byte) | Data path for D8–D15; enabled only when BHE = LOW during read/write |
| CE | Chip Enable | Active-LOW global select; triggers automatic power-down when HIGH |
| WE | Write Enable | Active-LOW control for write initiation; must be LOW with CE and BHE/ BLE to store data |
| OE | Output Enable | Active-LOW gate for output drivers; tri-states I/O pins when HIGH |
| BLE / BHE | Byte Write Enable | Independent active-LOW controls for lower/upper byte writes - eliminates RMW overhead |
| VCC (Pins 11, 33) | Power Supply | Dual 3.3 V supply pins reduce IR drop and improve noise immunity |
| VSS (Pins 12, 34) | Ground | Dual ground pins provide low-inductance return paths for switching currents |
Key Features
| Feature | Design Value |
|---|---|
| Independent byte write control | Enables atomic 8-bit updates to either half of 16-bit word without disturbing adjacent bytes |
| Automatic CE power-down | Reduces current from 90 mA to 5 mA within 15 ns of CE deassertion - critical for burst-mode operation |
| TSOP II footprint compatibility | Direct replacement for CY7C1020V33 in existing 44-pin layouts - no PCB rework required |
| Industrial temperature support | Guaranteed operation from –40°C to +85°C - suitable for factory automation and transportation electronics |
| Pb-free packaging | Meets RoHS Directive 2011/65/EU - supports environmentally compliant manufacturing |
Applications
| Industrial PLC Memory Buffer | Automotive ADAS Sensor Cache |
|---|---|
Use Scenario: Stores real-time I/O scan data and ladder logic state variables in programmable logic controllers with deterministic 10 ns read latency. IC Role / Device Role / Timing Role: Primary working memory for cyclic execution engine - accessed synchronously with 100 kHz scan cycles. Use Value: 10 ns tAA eliminates wait-state insertion, enabling sub-microsecond response to fieldbus interrupts. | Use Scenario: Buffers raw pixel frames from radar preprocessing units before DSP-based object detection in advanced driver assistance systems. IC Role / Device Role / Timing Role: High-bandwidth temporary storage for 16-bit sensor fusion data streams operating at 50+ MHz clock rates. Use Value: Dual-byte write capability allows parallel ingestion of upper/lower radar channel outputs without bus arbitration delay. |
| Medical Imaging Front-End FIFO | Avionics Display Frame Buffer |
Use Scenario: Acts as line buffer between analog-to-digital converters and FPGA-based image reconstruction pipelines in portable ultrasound devices. IC Role / Device Role / Timing Role: Synchronous FIFO stage holding 32K × 16-bit samples - clocked by ADC sampling clock with precise tOHA = 3 ns hold margin. Use Value: Low 5 mA standby current extends battery life during intermittent acquisition modes while preserving data integrity. | Use Scenario: Stores rendered GUI layers and overlay metadata for multifunction cockpit displays requiring flicker-free 60 Hz refresh. IC Role / Device Role / Timing Role: Dual-port accessible frame buffer - read by display controller, written by graphics processor via separate byte lanes. Use Value: Independent BHE/ BLE control permits simultaneous update of alpha channel (upper byte) and RGB payload (lower byte) without frame tearing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed parallel SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61LV51216AL-10MLI | 10 ns access, 3.3 V, 44-pin TSOP II, but lacks BHE/ BLE - uses single WE for full-word writes only | Requires external logic or firmware overhead for byte-level writes; unsuitable where partial-word atomicity is mandatory | Select only if system design already uses full-word write protocols and board layout cannot accommodate BHE/ BLE routing |
| AS6C4008-10TIN | 10 ns access, 3.3 V, 44-pin TSOP II, supports BYTE# pin for lower/upper selection but not independent dual-byte enables | Supports byte masking but not concurrent upper/lower writes - limits bandwidth in multi-channel sensor interfaces | Prefer when cost sensitivity outweighs need for true dual-byte concurrency and timing-critical partial writes |
Compared with IS61LV51216AL-10MLI and AS6C4008-10TIN, CY7C1020CV33-10ZXCT uniquely delivers true independent byte write capability with zero-cycle overlap penalty, making it essential for real-time systems requiring deterministic partial-word updates without bus contention or software intervention.
Availability
CY7C1020CV33-10ZXCT is available at Aetrix Electronics and suitable for industrial PLC memory buffers, automotive ADAS sensor caches, and medical imaging front-end FIFOs requiring stable component supply and long-term lifecycle assurance.
Supply support for CY7C1020CV33-10ZXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in memory, microcontrollers, and programmable system-on-chip solutions for industrial, automotive, and communications markets.
The CY7C1020CV33 belongs to Cypress's high-speed parallel SRAM product line, designed specifically for deterministic, low-latency memory interfacing in real-time embedded systems where bus cycle predictability and partial-word write efficiency are critical.
FAQ
What is the maximum clock frequency supported for continuous read cycles?
The CY7C1020CV33-10ZXCT does not use a clock signal; it is an asynchronous SRAM. Its maximum sustained read throughput is determined by tRC = 10 ns, enabling up to 100 million reads per second in burst mode with proper address setup and hold timing maintained.
Can BHE and BLE be asserted simultaneously for full 16-bit writes?
Yes - asserting both BHE and BLE LOW while CE and WE are LOW enables concurrent writing of all 16 data bits (I/O1–I/O16) to the addressed location. This is the standard full-word write mode and requires no additional timing constraints beyond those specified for individual byte writes.
Does this device require external pull-up resistors on control pins?
No - all control inputs (CE, OE, WE, BHE, BLE) have internal TTL-compatible input circuitry with defined VIH/VIL thresholds. External pull-ups are unnecessary unless system-level noise immunity requirements mandate them per board-level EMI design rules.
Is the 44-pin TSOP II package compatible with reflow soldering per J-STD-020?
Yes - the Pb-free TSOP II package (JEDEC MO-141AC) is qualified for lead-free reflow per J-STD-020D. Peak temperature rating is 260°C for 30 seconds, with ramp-up rate ≤ 3°C/s and cooling rate ≤ 6°C/s, matching standard Class 3 assembly processes.
CY7C1020CV33-10ZXCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 512Kbit
- Memory Organization:
- 32K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY7C1020CV33-10ZXCT FAQ
1.How can I place an order for CY7C1020CV33-10ZXCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1020CV33-10ZXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1020CV33-10ZXCT reliable?
The price and inventory of CY7C1020CV33-10ZXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1020CV33-10ZXCT is usually 5 days.
3.What payment methods are accepted for CY7C1020CV33-10ZXCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1020CV33-10ZXCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1020CV33-10ZXCT?
CY7C1020CV33-10ZXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1020CV33-10ZXCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1020CV33-10ZXCT?
For technical support, including CY7C1020CV33-10ZXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1020CV33-10ZXCT requirements.
6.How does Aetrix verify that CY7C1020CV33-10ZXCT is sourced from the original manufacturer or authorized distributors?
All CY7C1020CV33-10ZXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1020CV33-10ZXCT meets industry standards.
7.What is the process for return or replacement of CY7C1020CV33-10ZXCT?
All CY7C1020CV33-10ZXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1020CV33-10ZXCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1020CV33-10ZXCT part is unused and in its original packaging.
Return procedure for CY7C1020CV33-10ZXCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1020CV33-10ZXCT Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…

