Infineon Technologies CY7C1020CV33-15ZC
- Part No.:
- CY7C1020CV33-15ZC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1020CV33-15ZC.pdf
- Description:
- IC SRAM 512KBIT PAR 44TSOP II
- Quantity:
- Payment:

- Shipping:

Inventory:3,018
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Product details
Overview
CY7C1020CV33-15ZC from Cypress Semiconductor is a 512 Kbit (32K × 16) high-speed CMOS static RAM with 15 ns maximum access time, 3.3 V supply, and automatic CE-controlled power-down. It supports independent byte write via BHE/BLE controls and operates across commercial temperature range (0°C to +70°C) in a 44-pin TSOP II package. Used in embedded controllers and real-time data buffering where low-latency random access and selective byte writes are required.
For engineers reviewing the CY7C1020CV33-15ZC datasheet, CY7C1020CV33-15ZC pinout, CY7C1020CV33-15ZC application, or CY7C1020CV33-15ZC equivalent, key selection criteria include tAA ≤ 15 ns, ISB2 ≤ 5 mA standby current, dual-byte enable architecture, and TSOP II footprint compatibility with legacy CY7C1020V33 designs.
Technical Context
The CY7C1020CV33-15ZC implements a fully decoded 32K × 16 asynchronous SRAM array with separate address decoding for rows (A0–A14) and columns. Its read/write control logic uses active-low CE, OE, WE, BHE, and BLE signals to manage chip select, output enable, write initiation, and upper/lower byte masking - enabling partial-word writes without external gating.
It features two distinct power states: active mode (ICC ≤ 80 mA at fMAX) and automatic CE-driven power-down (ISB2 = 5 mA), with fast transition times (tPD = 15 ns, tPU = 0 ns). All I/O pins (I/O1–I/O16) enter high-impedance state during deselect, output disable, or write cycles - eliminating bus contention in multi-device systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 32,768 words × 16 bits - provides 512 Kbit capacity with true parallel 16-bit data bus interface. |
| Access Time (tAA) | 15 ns max - guarantees deterministic read latency for real-time control loops and FIFO buffering. |
| Supply Voltage | 3.3 V ± 10% - compatible with standard LVCMOS I/O domains and eliminates level-shifting in 3.3 V systems. |
| Standby Current (ISB2) | 5 mA max - enables low-power hold mode during processor sleep without external power management circuitry. |
| Byte Write Control | BHE and BLE inputs - allow independent 8-bit writes to upper or lower byte lanes, reducing bus traffic and write overhead. |
| Package | 44-pin TSOP II (51-85087) - surface-mount footprint with 0.8 mm pitch, optimized for high-density PCB layouts. |
| Operating Temperature | 0°C to +70°C - validated for commercial-grade industrial and networking equipment environments. |
Pinout & Package
The CY7C1020CV33-15ZC is housed in a 44-pin Thin Small Outline Package Type II (TSOP II), measuring 18.517 mm × 10.262 mm × 1.194 mm, with gull-wing leads and pin 1 identifier marked on the top surface.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A14 | Address Inputs | 15-bit address bus selecting one of 32,768 memory locations; TTL/CMOS-compatible input thresholds. |
| I/O1–I/O8 | Data I/O (Lower Byte) | Bidirectional 8-bit data path enabled by BLE = LOW during read/write; tri-stated when BLE or OE HIGH. |
| I/O9–I/O16 | Data I/O (Upper Byte) | Bidirectional 8-bit data path enabled by BHE = LOW; isolated from lower byte for independent access. |
| CE | Chip Enable | Active-low master select; forces automatic power-down (ISB2) when HIGH, disabling internal circuitry. |
| WE | Write Enable | Active-low write strobe; initiates write cycle only when CE and BHE/BLE are also LOW. |
| OE | Output Enable | Active-low output driver control; overrides BHE/BLE to place I/Os in high-Z when asserted HIGH. |
| BLE / BHE | Byte Low/High Enable | Independent active-low enables for lower (I/O1–I/O8) and upper (I/O9–I/O16) data bytes. |
| VCC | Power Supply | Two dedicated 3.3 V supply pins (pins 11 & 33) reduce IR drop and improve noise immunity. |
| VSS | Ground | Two ground pins (pins 12 & 34) provide low-inductance return paths for I/O and core logic. |
| NC | No Connect | Pins 1, 22, 23, 28 - unconnected on die; must be left floating or tied to GND per layout guidelines. |
Key Features
| Feature | Design Value |
|---|---|
| Pin- and function-compatible with CY7C1020V33 | Enables drop-in replacement in existing designs without PCB or firmware changes. |
| Automatic CE power-down | Reduces ICC to 5 mA without requiring external logic or sleep-mode sequencing. |
| Independent upper/lower byte write control | Eliminates need for external byte-mask logic or glue logic in 16-bit microprocessor interfaces. |
| High-speed 15 ns access with low active power | Delivers 325 mW max active power at full speed - balances performance and thermal budget in compact enclosures. |
| Pb-free and RoHS-compliant packaging option | ZC suffix denotes standard leaded TSOP II; ZXC denotes Pb-free variant for environmentally regulated applications. |
Applications
| Industrial PLC Data Buffering | Network Packet Memory |
|---|---|
Use Scenario: Storing transient I/O scan data and register values between PLC scan cycles. IC Role / Device Role / Timing Role: Asynchronous SRAM buffer interfaced directly to ARM9 or ColdFire MCU local bus with no wait states. Use Value: 15 ns tAA ensures sub-microsecond data capture latency, supporting 10 kHz scan rates without DMA overhead. | Use Scenario: Holding ingress/egress Ethernet frames in Layer 2 switch ASIC support logic. IC Role / Device Role / Timing Role: Dual-port accessible memory bank for frame header parsing and payload staging. Use Value: Independent BHE/BLE enables concurrent header (upper byte) and CRC (lower byte) writes, cutting frame processing time by 30%. |
| Medical Imaging Frame Store | Automotive ADAS Preprocessing Buffer |
Use Scenario: Temporary storage of digitized ultrasound line data before FFT processing. IC Role / Device Role / Timing Role: High-reliability, low-jitter memory for real-time analog-to-digital pipeline staging. Use Value: 5 mA ISB2 allows continuous power-down between acquisitions, reducing thermal drift in analog front-end components. | Use Scenario: Buffering raw camera sensor outputs prior to ISP pipeline ingestion in rear-view systems. IC Role / Device Role / Timing Role: Burst-access SRAM co-located with image signal processor for zero-wait-state pixel streaming. Use Value: TSOP II package enables direct placement adjacent to SoC BGA, minimizing trace length and signal integrity loss at 25 MHz bus speeds. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed parallel SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61LV51216AL-15MLI | Same 32K × 16 organization, 15 ns access, but uses single-byte enable (UB/LB) instead of BHE/BLE; 3.3 V only. | Lacks independent upper/lower byte write isolation - requires external logic for selective byte writes. | Select if BHE/BLE functionality is unused and cost sensitivity outweighs design flexibility. |
| ON Semiconductor MC68HC11E9CP | Not an SRAM - integrated MCU with on-chip 512-byte RAM; no external parallel bus interface. | Cannot replace CY7C1020CV33-15ZC in external memory expansion roles. | Exclude - incompatible device class; misidentified as memory alternative in some distributor cross-reference tables. |
Compared with IS61LV51216AL-15MLI, the CY7C1020CV33-15ZC offers native dual-byte write control and tighter tHZOE (7 ns vs. 10 ns), improving bus turnaround in burst-mode systems; the MC68HC11E9CP is not a functional substitute and must be excluded from SRAM-based designs.
Availability
CY7C1020CV33-15ZC is available at Aetrix Electronics and suitable for industrial PLC data buffering, network packet memory, and medical imaging frame store applications requiring stable component supply and long-term obsolescence management.
Supply support for CY7C1020CV33-15ZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in memory, microcontrollers, and programmable logic solutions for industrial, automotive, and communications markets.
The CY7C1020CV33 belongs to Cypress's legacy parallel SRAM product line, designed specifically for high-reliability, low-latency external memory expansion in resource-constrained embedded systems with synchronous or asynchronous bus interfaces.
FAQ
What is the maximum clock frequency supported by CY7C1020CV33-15ZC?
The CY7C1020CV33-15ZC is an asynchronous SRAM and does not use a clock signal. Its timing is governed by access parameters such as tRC (15 ns) and tAA (15 ns), allowing reliable operation with bus frequencies up to approximately 66 MHz in systems with zero wait-state controllers. No internal oscillator or clock input exists.
Can CY7C1020CV33-15ZC operate at 2.5 V?
No. The CY7C1020CV33-15ZC is specified exclusively for 3.3 V ± 10% operation (2.97 V to 3.63 V). Operation below 2.97 V violates the Absolute Maximum Ratings and may result in data corruption, increased access time, or failure to meet tAA specification. It is not backward-compatible with 2.5 V logic families.
How does the automatic power-down feature activate?
Automatic power-down activates when Chip Enable (CE) is driven HIGH while the device is deselected. This places the core array and I/O drivers into a low-current state drawing only 5 mA (ISB2), without requiring additional control signals or external circuitry. Power-up occurs within 0 ns (guaranteed by design) upon CE going LOW again.
Are NC pins on CY7C1020CV33-15ZC required to be grounded?
No. Pins 1, 22, 23, and 28 are No Connect (NC) and are not bonded to the die. Cypress recommends leaving them unconnected (floating) or optionally tying them to ground for mechanical stability - but grounding is not electrically required and provides no functional benefit.
CY7C1020CV33-15ZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Bag
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 512Kbit
- Memory Organization:
- 32K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 15 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY7C1020CV33-15ZC FAQ
1.How can I place an order for CY7C1020CV33-15ZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1020CV33-15ZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1020CV33-15ZC reliable?
The price and inventory of CY7C1020CV33-15ZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1020CV33-15ZC is usually 5 days.
3.What payment methods are accepted for CY7C1020CV33-15ZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1020CV33-15ZC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1020CV33-15ZC?
CY7C1020CV33-15ZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1020CV33-15ZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1020CV33-15ZC?
For technical support, including CY7C1020CV33-15ZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1020CV33-15ZC requirements.
6.How does Aetrix verify that CY7C1020CV33-15ZC is sourced from the original manufacturer or authorized distributors?
All CY7C1020CV33-15ZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1020CV33-15ZC meets industry standards.
7.What is the process for return or replacement of CY7C1020CV33-15ZC?
All CY7C1020CV33-15ZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1020CV33-15ZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1020CV33-15ZC part is unused and in its original packaging.
Return procedure for CY7C1020CV33-15ZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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