Infineon Technologies CY7C1020DV33-10ZSXI
- Part No.:
- CY7C1020DV33-10ZSXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1020DV33-10ZSXI.pdf
- Description:
- IC SRAM 512KBIT PAR 44TSOP II
- Quantity:
- Payment:

- Shipping:

Inventory:1,488
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1020DV33-10ZSXI from Cypress Semiconductor is a 512 Kbit (32 K × 16) asynchronous CMOS static RAM with 10 ns access time, 3.3 V supply, and independent byte-enable control for upper/lower data words. It features automatic CE-controlled power-down (ISB2 = 3 mA), 2.0 V data retention, and operates across –40 °C to +85 °C for industrial embedded memory applications.
For engineers reviewing the CY7C1020DV33-10ZSXI datasheet, CY7C1020DV33-10ZSXI pinout, CY7C1020DV33-10ZSXI application, or CY7C1020DV33-10ZSXI equivalent, key selection criteria include tAA = 10 ns read timing, dual-byte write capability via BHE/ BLE, low-active CE/OE/WE logic, TSOP II packaging, and compatibility with legacy CY7C1020CV33 designs.
Technical Context
The device implements a fully decoded 32 K × 16-bit SRAM array with separate row/column decoders and sense amplifiers. Address inputs A0–A14 select one of 32,768 locations, while I/O0–I/O15 provide bidirectional 16-bit data transfer with independent byte masking via BLE (I/O0–I/O7) and BHE (I/O8–I/O15).
Its automatic power-down mode activates when CE is HIGH, reducing ICC to ISB2 = 3 mA under CMOS input conditions; data retention remains valid at VCC = 2.0 V. All control signals (CE, OE, WE, BLE, BHE) are active-low and TTL/CMOS compatible, supporting seamless integration into 3.3 V microcontroller and FPGA memory interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Kbit (32,768 × 16) - supports full-word or byte-aligned data storage in compact footprint |
| Access Time (tAA) | 10 ns - enables direct interface with 100 MHz bus systems without wait states |
| Supply Voltage | 3.3 V ± 0.3 V - matches standard LVTTL/LVCMOS I/O voltage domains |
| Active Current (ICC) | 60 mA @ 10 ns - defines peak power draw during burst read/write cycles |
| Standby Current (ISB2) | 3 mA - ensures ultra-low power in deselected state for battery-backed or low-power modes |
| Data Retention Voltage | 2.0 V - allows memory contents to persist during brown-out or controlled power-down sequences |
| Operating Temperature | –40 °C to +85 °C - qualified for industrial-grade reliability in harsh environments |
Pinout & Package
Package: 44-pin TSOP Type II (Pb-free), 400-mil width, surface-mount compatible with standard reflow profiles.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A14 | Address Inputs | 15-bit address bus selecting one of 32,768 memory locations |
| I/O0–I/O7 | Data I/O (Lower Byte) | Bidirectional 8-bit data path enabled only when BLE = LOW |
| I/O8–I/O15 | Data I/O (Upper Byte) | Bidirectional 8-bit data path enabled only when BHE = LOW |
| CE | Chip Enable | Active-low global enable; HIGH forces automatic power-down and high-Z outputs |
| OE | Output Enable | Active-low read control; must be LOW with CE LOW and WE HIGH for valid output |
| WE | Write Enable | Active-low write strobe; LOW with CE LOW initiates write cycle |
| BLE | Byte Low Enable | Active-low control for lower byte (I/O0–I/O7); enables partial writes |
| BHE | Byte High Enable | Active-low control for upper byte (I/O8–I/O15); enables partial writes |
| VCC | Power Supply | +3.3 V supply pin (dual pins for reduced IR drop and noise) |
| VSS | Ground | Ground reference (dual pins for improved signal integrity) |
| NC | No Connect | Pins 11, 12, 13, 31, 32, 35, 36 - not bonded on die; must remain unconnected |
Key Features
| Feature | Design Value |
|---|---|
| Independent byte-write control | Enables selective 8-bit updates without disturbing adjacent bytes-critical for protocol stack buffers and register-mapped peripherals |
| Automatic CE power-down | Reduces ICC to 3 mA instantly upon chip disable-eliminates need for external power gating in sleep-mode systems |
| 2.0 V data retention | Maintains stored data during brown-out or backup-battery operation-supports fail-safe system recovery |
| Pin- and function-compatible with CY7C1020CV33 | Allows drop-in replacement in existing designs without layout or firmware changes |
| Pb-free TSOP II package | Meets RoHS compliance requirements and supports automated SMT assembly with industry-standard footprint |
Applications
| Industrial PLC Data Buffers | Medical Imaging Frame Stores |
|---|---|
Use Scenario: Storing real-time sensor acquisition buffers and configuration registers in programmable logic controllers with deterministic timing. IC Role / Device Role / Timing Role: Asynchronous SRAM providing zero-wait-state 32 K × 16 data storage with 10 ns tAA for fast scan-cycle updates. Use Value: Enables sub-microsecond memory access required for 10 kHz I/O update rates while maintaining data integrity during power interruptions. | Use Scenario: Holding uncompressed grayscale image frames (e.g., 512 × 512 × 16-bit) in portable ultrasound or X-ray digitizers. IC Role / Device Role / Timing Role: High-speed frame buffer delivering burst reads/writes to FPGA-based pixel processors with independent byte enables. Use Value: Dual-byte write capability reduces memory transaction count by 50% versus 16-bit-only SRAMs, accelerating frame capture latency. |
| Avionics Display Controllers | Test Equipment Pattern Generators |
Use Scenario: Serving as display list memory and overlay buffer in DO-254-compliant cockpit displays requiring radiation-tolerant operation. IC Role / Device Role / Timing Role: Industrial-temperature SRAM retaining valid data at 2.0 V during transient power loss events per ARINC 661 requirements. Use Value: Eliminates need for external backup capacitors or supervisory circuits-reducing BOM count and board area. | Use Scenario: Storing stimulus patterns and expected response vectors in automated boundary-scan or functional test systems. IC Role / Device Role / Timing Role: Asynchronous memory interfaced directly to pattern sequencer ASICs with precise 10 ns timing margins. Use Value: 10 ns tAA and 5 ns tDOE ensure deterministic pattern launch timing critical for IEEE 1149.1/1149.6 compliance testing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar asynchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61LV51216AL-10MLI | Same density, speed, and voltage; slightly higher ISB2 = 5 mA; no 2.0 V data retention spec | Lacks guaranteed data retention below 3.0 V-unsuitable for brown-out scenarios | Select when lowest standby current is secondary to cost and long-term supply stability |
| Cypress CY7C1020DV33-10ZSXI | Reference part with 3 mA ISB2 and 2.0 V retention | Valid for industrial systems requiring fail-safe memory hold during undervoltage | Preferred for designs needing guaranteed data persistence at reduced VCC |
Compared with IS61LV51216AL-10MLI and CY7C1020DV33-10ZSXI, this part uniquely guarantees 2.0 V data retention and 3 mA ISB2-making it the only choice for industrial systems where memory state must survive brown-out events without external support circuitry.
Availability
CY7C1020DV33-10ZSXI is available at Aetrix Electronics and suitable for industrial PLCs, medical imaging subsystems, avionics display controllers, and automated test equipment requiring stable component supply and long-lifecycle support.
Supply support for CY7C1020DV33-10ZSXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in memory, microcontrollers, and connectivity solutions for industrial, automotive, and consumer markets.
The CY7C1020D series belongs to Cypress's Fast Asynchronous SRAM family, designed specifically for high-reliability, low-latency memory expansion in real-time embedded systems where deterministic timing and power efficiency are critical.
FAQ
What is the maximum clock frequency supported by CY7C1020DV33-10ZSXI?
This is an asynchronous SRAM-not a synchronous device-so it has no clock input or maximum clock frequency. Its performance is defined by access time (tAA = 10 ns) and cycle time (tRC = 10 ns), enabling reliable operation with bus frequencies up to 100 MHz when interfaced to controllers with appropriate timing margins and no wait states.
Can CY7C1020DV33-10ZSXI operate with 2.5 V supply?
No. The device is specified only for 3.3 V ± 0.3 V (i.e., 3.0 V to 3.6 V). Operation at 2.5 V violates the Absolute Maximum Ratings and will result in undefined behavior, including failure to retain data or meet timing specifications. Data retention is guaranteed only down to 2.0 V-but only after power-down, not during active operation.
Is the TSOP II package lead-free and RoHS compliant?
Yes. The "ZSXI" suffix explicitly denotes Pb-free (lead-free) construction in a 44-pin TSOP Type II package, fully compliant with EU RoHS Directive 2011/65/EU and JEDEC JS-709C standards. The package uses matte tin terminations and meets IPC/JEDEC J-STD-020 moisture sensitivity level 3 (MSL-3) requirements.
How does byte-enable functionality improve system-level design?
BLE and BHE allow independent 8-bit writes to upper or lower data bytes without reading-modify-write cycles. This reduces bus traffic by 50% in protocols requiring frequent partial updates (e.g., CAN message buffers, UART FIFOs, or register banks), lowers power consumption, and eliminates race conditions in multi-master systems where full-word writes could corrupt adjacent fields.
CY7C1020DV33-10ZSXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 512Kbit
- Memory Organization:
- 32K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY7C1020DV33-10ZSXI FAQ
1.How can I place an order for CY7C1020DV33-10ZSXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1020DV33-10ZSXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1020DV33-10ZSXI reliable?
The price and inventory of CY7C1020DV33-10ZSXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1020DV33-10ZSXI is usually 5 days.
3.What payment methods are accepted for CY7C1020DV33-10ZSXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1020DV33-10ZSXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1020DV33-10ZSXI?
CY7C1020DV33-10ZSXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1020DV33-10ZSXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1020DV33-10ZSXI?
For technical support, including CY7C1020DV33-10ZSXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1020DV33-10ZSXI requirements.
6.How does Aetrix verify that CY7C1020DV33-10ZSXI is sourced from the original manufacturer or authorized distributors?
All CY7C1020DV33-10ZSXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1020DV33-10ZSXI meets industry standards.
7.What is the process for return or replacement of CY7C1020DV33-10ZSXI?
All CY7C1020DV33-10ZSXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1020DV33-10ZSXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1020DV33-10ZSXI part is unused and in its original packaging.
Return procedure for CY7C1020DV33-10ZSXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1020DV33-10ZSXI Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

