Infineon Technologies CY7C1020DV33-10ZSXIT
- Part No.:
- CY7C1020DV33-10ZSXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1020DV33-10ZSXIT.pdf
- Description:
- IC SRAM 512KBIT PAR 44TSOP II
- Quantity:
- Payment:

- Shipping:

Inventory:850
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1020DV33-10ZSXIT from Cypress Semiconductor is a 512 Kbit (32 K × 16) asynchronous CMOS static RAM with 10 ns access time, 3.3 V supply operation, independent byte-wide write control via BHE/BLE, and automatic CE-controlled power-down. It delivers 60 mA active current and 3 mA CMOS standby current, targeting high-speed buffering in industrial embedded controllers and real-time data acquisition systems.
For engineers reviewing the CY7C1020DV33-10ZSXIT datasheet, CY7C1020DV33-10ZSXIT pinout, CY7C1020DV33-10ZSXIT application, or CY7C1020DV33-10ZSXIT equivalent, key selection criteria include tAA = 10 ns read timing, dual-byte enable architecture, 2.0 V data retention capability, and Pb-free 44-pin TSOP II packaging for space-constrained PCB layouts.
Technical Context
The device implements a fully asynchronous SRAM core with separate upper- and lower-byte write enables (BHE/BLE), enabling partial-word writes without external logic. Its CE-driven automatic power-down reduces ISB2 to 3 mA when deselected, while maintaining full compatibility with CY7C1020CV33 for drop-in upgrades.
All timing parameters-including tACE = 10 ns, tDOE = 5 ns, and tHZOE = 5 ns-are specified under industrial conditions (–40 °C to +85 °C) at VCC = 3.3 V ±0.3 V, with input/output voltage thresholds aligned to TTL/CMOS mixed-signal interfacing (VIH = 2.0 V min, VOH = 2.4 V min).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Kbit (32,768 × 16) - supports 64 KB of word-aligned data storage |
| Access Time (tAA) | 10 ns - enables 100 MHz burst read cycles in synchronous bus interfaces |
| VCC Supply Range | 3.3 V ±0.3 V - compatible with standard 3.3 V logic rails and LDO regulators |
| Active Current (ICC) | 60 mA @ 10 ns - defines peak power draw during continuous read/write operations |
| Standby Current (ISB2) | 3 mA - achieved when CE > VCC – 0.3 V and inputs held at valid CMOS levels |
| Data Retention Voltage | 2.0 V - allows low-power hold mode during system sleep without battery backup |
| Input Capacitance | 8 pF - ensures signal integrity up to 100 MHz with minimal trace loading |
Pinout & Package
Package: 44-pin TSOP II (Pb-free), 400-mil width, JEDEC MO-141AC compliant. Pin pitch: 0.8 mm. Body dimensions: 18.4 mm × 10.16 mm × 1.2 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A14 | Address Inputs | 15-bit address bus supporting 32 K word locations |
| I/O0–I/O7 | Lower-Byte Data I/O | Bidirectional 8-bit data path enabled by BLE = LOW |
| I/O8–I/O15 | Upper-Byte Data I/O | Bidirectional 8-bit data path enabled by BHE = LOW |
| CE | Chip Enable | Active-low global select; triggers automatic power-down when HIGH |
| WE | Write Enable | Active-low write strobe; controls data latching on rising edge |
| OE | Output Enable | Active-low output driver control; disables outputs when HIGH |
| BLE | Byte Low Enable | Active-low control for lower 8 bits; enables partial-word writes |
| BHE | Byte High Enable | Active-low control for upper 8 bits; enables partial-word writes |
| VCC | Power Supply | Two dedicated 3.3 V pins (pins 31, 32) reduce IR drop and noise coupling |
| VSS | Ground | Two dedicated ground pins (pins 35, 36) improve return path integrity |
Key Features
| Feature | Design Value |
|---|---|
| Independent Byte Write Control | Enables simultaneous or selective update of upper/lower 8-bit lanes without masking logic |
| Automatic CE Power-Down | Reduces ICC from 60 mA to 3 mA within 10 ns of CE deassertion, eliminating external power gating |
| 2.0 V Data Retention | Maintains stored contents during brown-out or controlled shutdown without auxiliary power |
| Pb-Free TSOP II Packaging | RoHS-compliant 44-pin footprint with 0.8 mm pitch, optimized for reflow soldering and thermal dissipation |
| High-Z Output Control | Guaranteed 5 ns transition to high-impedance on OE/CE/BHE/BLE disable, preventing bus contention |
Applications
| Industrial PLC Data Buffering | Medical Imaging Frame Memory |
|---|---|
|
Use Scenario: Real-time acquisition of analog sensor streams in programmable logic controllers with deterministic cycle times. IC Role / Device Role / Timing Role: Asynchronous buffer between ADC interface and CPU bus, absorbing jitter via 10 ns tAA and dual-byte write isolation. Use Value: Eliminates FIFO logic overhead by enabling direct partial-word writes to match 8-bit sensor channel groupings. |
Use Scenario: Storing uncompressed grayscale frames from X-ray or ultrasound sensors prior to DSP processing. IC Role / Device Role / Timing Role: High-bandwidth frame buffer interfaced to FPGA pixel engines, leveraging 32 K × 16 organization for 64 KB line buffers. Use Value: Sustains 100 MHz read bursts (tRC = 10 ns) required for real-time video streaming without pipeline stalls. |
| Avionics Sensor Fusion Module | Test Equipment Pattern Memory |
|
Use Scenario: Aggregating inertial measurement unit (IMU), GPS, and barometric data in DO-254-certified flight control units. IC Role / Device Role / Timing Role: Radiation-tolerant SRAM node providing deterministic latency for safety-critical state updates. Use Value: 2.0 V data retention ensures memory persistence during transient power loss in redundant power domains. |
Use Scenario: Storing stimulus/response vectors in automated test equipment for semiconductor wafer probing. IC Role / Device Role / Timing Role: High-reliability pattern store accessed by ATE sequencers requiring sub-15 ns setup/hold margins. Use Value: tSD = 5 ns and tHD = 0 ns support tight timing windows for high-speed digital pattern generation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar asynchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61LV51216AL-10TLI | Same density, speed, and voltage; 44-pin TSOP II but with 5 ns tHZOE (vs. 5 ns) and 4 mA ISB2 (vs. 3 mA) | Marginally higher standby current; identical byte-enable architecture and pinout | Select if sourcing flexibility across multiple qualified suppliers is prioritized over minimal ISB2 reduction |
| ON Semiconductor MC68HC908JK3E | Not an SRAM - 8-bit MCU with 2 KB on-chip RAM; no external bus interface or byte-enable pins | Embedded controller with integrated peripherals, not a memory replacement | Only consider for redesigns where external SRAM can be eliminated via on-die memory expansion |
Compared with IS61LV51216AL-10TLI, CY7C1020DV33-10ZSXIT offers 1 mA lower CMOS standby current and tighter tLZOE (0 ns vs. 1 ns), improving power efficiency in duty-cycled systems; MC68HC908JK3E is functionally incompatible as a microcontroller, not a memory substitute.
Availability
CY7C1020DV33-10ZSXIT is available at Aetrix Electronics and suitable for industrial PLC data buffering, medical imaging frame memory, and avionics sensor fusion modules requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CY7C1020DV33-10ZSXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and microcontroller solutions for industrial, automotive, and communications markets, with headquarters in San Jose, CA.
CY7C1020DV33 belongs to Cypress's Fast Asynchronous SRAM family, engineered for low-latency, byte-selectable data storage in real-time embedded systems where deterministic timing and power efficiency are critical.
FAQ
Is CY7C1020DV33-10ZSXIT pin-compatible with CY7C1020CV33?
Yes, CY7C1020DV33-10ZSXIT is pin-and function-compatible with CY7C1020CV33 per the datasheet Feature section. Both share identical 44-pin TSOP II pinout, address/data/control signal assignments, and truth table behavior-enabling direct replacement without PCB revision.
What is the maximum operating frequency supported by this SRAM?
The device does not operate synchronously, so it has no clock input or maximum frequency rating. Its performance is defined by timing parameters: tRC = 10 ns sets the minimum read/write cycle interval, supporting effective burst rates up to 100 MHz when interfaced with appropriately timed control logic.
Can BHE and BLE be asserted simultaneously for full 16-bit writes?
Yes-asserting both BHE and BLE LOW while CE and WE are LOW enables concurrent writing to I/O0–I/O7 and I/O8–I/O15, performing a full 16-bit write. The truth table explicitly lists "Write-All bits" mode under CE = L, WE = L, BLE = L, BHE = L.
Does this part support hot insertion or live swapping?
No-CY7C1020DV33-10ZSXIT lacks hot-swap protection circuitry. Its absolute maximum ratings specify only –0.5 V to VCC + 0.5 V for DC input voltage, and applying signals before VCC stabilization risks latch-up or damage per the 200 mA latch-up current rating.
CY7C1020DV33-10ZSXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 512Kbit
- Memory Organization:
- 32K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY7C1020DV33-10ZSXIT FAQ
1.How can I place an order for CY7C1020DV33-10ZSXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1020DV33-10ZSXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1020DV33-10ZSXIT reliable?
The price and inventory of CY7C1020DV33-10ZSXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1020DV33-10ZSXIT is usually 5 days.
3.What payment methods are accepted for CY7C1020DV33-10ZSXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1020DV33-10ZSXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1020DV33-10ZSXIT?
CY7C1020DV33-10ZSXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1020DV33-10ZSXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1020DV33-10ZSXIT?
For technical support, including CY7C1020DV33-10ZSXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1020DV33-10ZSXIT requirements.
6.How does Aetrix verify that CY7C1020DV33-10ZSXIT is sourced from the original manufacturer or authorized distributors?
All CY7C1020DV33-10ZSXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1020DV33-10ZSXIT meets industry standards.
7.What is the process for return or replacement of CY7C1020DV33-10ZSXIT?
All CY7C1020DV33-10ZSXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1020DV33-10ZSXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1020DV33-10ZSXIT part is unused and in its original packaging.
Return procedure for CY7C1020DV33-10ZSXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1020DV33-10ZSXIT Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

