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Infineon Technologies CY7C10211BN-10ZXC
- Part No.:
- CY7C10211BN-10ZXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C10211BN-10ZXC.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:
- Shipping:
Inventory:1,525
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Product details
Overview
CY7C10211BN-10ZXC from Cypress Semiconductor is a 1-Mbit (64K × 16) high-speed CMOS static RAM with 10 ns access time, 5 V supply, and automatic CE-controlled power-down. It supports independent byte-wide write enable via BHE/ BLE pins and operates across commercial temperature range (0°C to +70°C). Used in legacy industrial controllers for real-time data buffering where deterministic timing and low standby current are critical.
For engineers reviewing the CY7C10211BN-10ZXC datasheet, CY7C10211BN-10ZXC pinout, CY7C10211BN-10ZXC application, or CY7C10211BN-10ZXC equivalent, key selection criteria include tAA ≤ 10 ns, dual-byte write control, TSOP II package compatibility, and 44-pin SOJ footprint interchangeability in memory expansion slots.
Technical Context
This SRAM implements a synchronous, non-volatile-independent 64K × 16-bit array with fully decoded address inputs (A0–A15), bidirectional I/O1–I/O16, and TTL/CMOS-compatible control logic. Its read/write cycle relies on precise timing coordination among CE, OE, WE, BHE, and BLE - all active-low - enabling selective upper/lower byte access without external gating.
The device uses automatic CE-driven power-down to reduce ICC to 10 mA (max) during deselect, while maintaining full CMOS-level input thresholds (VIH = 2.2 V min, VIL = 0.8 V max) and output drive capability (IOH = –4 mA, IOL = 8 mA). Thermal resistance is specified at ΘJA = 76.89 °C/W for the 44-pin TSOP II package.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 64K × 16-bit (1,048,576 bits); supports 16-bit parallel bus interface without external data multiplexing |
| Access Time (tAA) | 10 ns max at 5 V / 0°C–70°C; guarantees deterministic read latency for 100 MHz bus timing budgets |
| Supply Voltage | 5 V ±10%; compatible with legacy 5 V TTL/CMOS system rails and eliminates level-shifting requirements |
| Active Current (ICC) | 150 mA max; defines worst-case power delivery and PCB trace sizing for continuous operation |
| Standby Current (ISB2) | 10 mA max (CMOS inputs); enables low-power hold mode during CPU idle cycles in embedded controllers |
| Byte Enable Logic | BHE/BLE active-low controls I/O9–I/O16 and I/O1–I/O8 independently; allows partial-word writes without read-modify-write overhead |
| Package Type | 44-pin TSOP Type II (JEDEC MO-141BA); surface-mount compatible with standard reflow profiles and 0.8 mm pitch routing |
Pinout & Package
44-pin TSOP Type II (JEDEC MO-141BA), 400-mil body width, lead-free (RoHS-compliant), 0.8 mm pin pitch, 1.2 mm height. Pin 1 index marked by notch or dot; top-side marking includes "CY7C10211BN-10ZXC" and date code.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A15 | Address Input | 16-bit address bus; selects one of 65,536 memory locations; no internal latching - requires stable address during CE LOW |
| I/O1–I/O8 | Bidirectional Data (Lower Byte) | Driven by BLE LOW during write; outputs valid data when BLE LOW and OE LOW; tri-stated otherwise |
| I/O9–I/O16 | Bidirectional Data (Upper Byte) | Driven by BHE LOW during write; outputs valid data when BHE LOW and OE LOW; tri-stated otherwise |
| CE | Chip Enable (active LOW) | Primary chip select; initiates power-down when HIGH; must be LOW before WE/OE transitions to avoid bus contention |
| WE | Write Enable (active LOW) | Controls write initiation; must be LOW with CE LOW and BHE/BLE LOW to store data; HIGH enables read mode |
| OE | Output Enable (active LOW) | Enables I/O drivers during read; HIGH forces all I/Os into high-Z regardless of CE/WE state |
| BHE, BLE | Byte Write Enable (active LOW) | Independent control of upper/lower 8-bit lanes; permits 8-bit microprocessor interfacing without data masking logic |
| VCC | Power Supply | 5 V ±10% main supply; two dedicated pins (11, 33) reduce IR drop and improve noise immunity |
| VSS | Ground | System ground reference; two dedicated pins (12, 34) provide low-inductance return path for switching currents |
Key Features
| Feature | Design Value |
|---|---|
| 10 ns access time at 5 V | Meets timing closure for 8051- and Z80-based systems running at ≥10 MHz with zero wait states |
| Dual independent byte write control | Eliminates need for external byte-lane gating logic in 8-bit processor upgrades or FPGA memory interfaces |
| Automatic CE-driven power-down | Reduces standby current to 10 mA without requiring external control signals or firmware intervention |
| TSOP II and SOJ package options | Enables drop-in replacement between board designs using either 44-pin surface-mount footprint |
| Pb-free (RoHS-compliant) variant | ZXC suffix denotes lead-free finish; qualified per JEDEC J-STD-020C for reflow soldering up to 260°C peak |
Applications
| Industrial PLC Data Buffer | Legacy Medical Instrument Memory |
|---|---|
|
Use Scenario: Real-time I/O scan buffer in programmable logic controller rack modules handling analog sensor inputs and digital actuator outputs. IC Role / Device Role / Timing Role: High-reliability, non-refreshed data storage for cyclic process data exchange between CPU and fieldbus interface ASICs. Use Value: 10 ns tAA ensures sub-microsecond response to interrupt-driven I/O updates; dual-byte writes align with Modbus RTU register boundaries. |
Use Scenario: Temporary waveform capture buffer in portable ECG analyzers performing real-time signal averaging prior to DSP processing. IC Role / Device Role / Timing Role: Low-latency, deterministic-access scratchpad memory for transient acquisition windows under battery-constrained conditions. Use Value: Automatic CE power-down reduces average current draw during inter-acquisition idle periods, extending battery life without software overhead. |
| Avionics Display Controller Frame Buffer | Test Equipment Pattern Generator |
|
Use Scenario: Pixel line buffer in ruggedized cockpit display units rendering synthetic vision data at 60 Hz refresh rate. IC Role / Device Role / Timing Role: Synchronous frame-aligned memory staging area between graphics engine and LVDS serializer. Use Value: 44-pin TSOP II package provides mechanical robustness against vibration; 0°C to +70°C rating matches avionics environmental envelope. |
Use Scenario: Vector pattern storage in automated test equipment generating stimulus sequences for ASIC functional validation. IC Role / Device Role / Timing Role: High-speed deterministic readback source for multi-channel digital I/O drivers synchronized to system clock. Use Value: Dual-byte write enables rapid loading of 16-bit instruction words from host controller; tHZOE = 5 ns ensures clean bus release before next vector fetch. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed parallel SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61LV102416-10TQLI | 10 ns tAA, 3.3 V supply only; LVCMOS I/O levels; no BHE/BLE support - uses UB/LB instead | Requires level translation in 5 V systems; lacks independent byte write flexibility for mixed-bus architectures | Select only if migrating to 3.3 V platform and redesigning address/data bus interface |
| AS6C1008-10PCN | 10 ns tAA, 5 V supply, but no automatic CE power-down; ISB = 30 mA (vs. 10 mA) | Higher standby current increases thermal load in sealed enclosures; no native low-power hold mode | Prefer only when cost sensitivity outweighs power budget constraints and CE-controlled sleep is not required |
Compared with IS61LV102416-10TQLI and AS6C1008-10PCN, CY7C10211BN-10ZXC uniquely delivers 5 V compatibility, true dual-byte write control, and sub-10 mA standby - making it irreplaceable in legacy 5 V industrial and medical systems requiring deterministic timing and minimal firmware changes.
Availability
CY7C10211BN-10ZXC is available at Aetrix Electronics and suitable for industrial PLC data buffering, legacy medical instrument memory, avionics display controller frame buffers, and test equipment pattern generation requiring stable component supply and long-term obsolescence management.
Supply support for CY7C10211BN-10ZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in memory, microcontrollers, and programmable logic devices for industrial, automotive, and communications markets.
CY7C10211BN belongs to Cypress's legacy parallel SRAM product line, designed specifically for drop-in replacement of aging 5 V memory in mission-critical embedded systems where reliability, timing predictability, and long-lifecycle support are mandatory.
FAQ
Is CY7C10211BN-10ZXC pin-compatible with CY7C1021BN-12ZXC?
Yes - both use identical 44-pin TSOP II footprints and share identical pin functions, including A0–A15, I/O1–I/O16, CE, OE, WE, BHE, BLE, VCC, and VSS. The only difference is guaranteed access time: 10 ns vs. 12 ns. System timing margins must be verified when substituting.
Does CY7C10211BN-10ZXC support 3.3 V operation?
No - this device is strictly rated for 5 V ±10% (4.5 V to 5.5 V). Operation below 4.5 V violates absolute maximum ratings and may cause data corruption or failure to meet tAA specification. It is not 3.3 V tolerant.
What is the function of NC pins 22, 23, and 28?
Pins 22, 23, and 28 are No Connects - physically present but unconnected to the silicon die. They must remain unconnected on PCB layout; routing traces or applying voltage to these pins risks latch-up or ESD damage per datasheet maximum ratings.
Can CY7C10211BN-10ZXC be used in automotive applications?
No - the -10ZXC suffix denotes Commercial temperature grade (0°C to +70°C) and TSOP II packaging. Automotive variants require different suffixes (e.g., -15ZSXE) and are qualified to –40°C to +125°C with extended reliability testing per AEC-Q100.
CY7C10211BN-10ZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 64K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY7C10211BN-10ZXC FAQ
1.How can I place an order for CY7C10211BN-10ZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C10211BN-10ZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C10211BN-10ZXC reliable?
The price and inventory of CY7C10211BN-10ZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C10211BN-10ZXC is usually 5 days.
3.What payment methods are accepted for CY7C10211BN-10ZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C10211BN-10ZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C10211BN-10ZXC?
CY7C10211BN-10ZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C10211BN-10ZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C10211BN-10ZXC?
For technical support, including CY7C10211BN-10ZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C10211BN-10ZXC requirements.
6.How does Aetrix verify that CY7C10211BN-10ZXC is sourced from the original manufacturer or authorized distributors?
All CY7C10211BN-10ZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C10211BN-10ZXC meets industry standards.
7.What is the process for return or replacement of CY7C10211BN-10ZXC?
All CY7C10211BN-10ZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C10211BN-10ZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C10211BN-10ZXC part is unused and in its original packaging.
Return procedure for CY7C10211BN-10ZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C10211BN-10ZXC Tags
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