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Infineon Technologies CY7C1021B-15ZXI

Part No.:
CY7C1021B-15ZXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
44-TSOP (0.400", 10.16mm Width)
Datasheet:
AetrixCY7C1021B-15ZXI.pdf
Description:
IC SRAM 1MBIT PARALLEL 44TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,620

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Product details

Overview

CY7C1021B-15ZXI from Cypress Semiconductor is a 1-Mbit (64K × 16) high-speed CMOS static RAM with 15 ns maximum access time, 5 V ±10% supply, industrial temperature range (–40°C to +85°C), and Pb-free 44-pin TSOP II packaging. It supports independent byte-wide write control via BHE/ BLE, automatic CE-based power-down (ISB2 = 10 mA), and operates in read/write modes with TTL/CMOS-compatible inputs.

For engineers reviewing the CY7C1021B-15ZXI datasheet, CY7C1021B-15ZXI pinout, CY7C1021B-15ZXI application, or CY7C1021B-15ZXI equivalent, key selection considerations include tAA = 15 ns timing compliance, dual-byte enable architecture for partial-word writes, industrial-grade thermal resistance (ΘJA = 76.89°C/W), and compatibility with legacy 5 V memory bus systems requiring low standby current and deterministic tri-state behavior.

Technical Context

The CY7C1021B-15ZXI implements a synchronous, address-decoded SRAM array with row/column decoding across 512 × 2048 cells. Its read path uses sense amplifiers with tDOE = 7 ns and tHZOE = 7 ns (5 pF load), while write operations require overlapping CE LOW, WE LOW, and active BHE/BLE to latch data on I/O9–I/O16 or I/O1–I/O8 respectively.

Power management relies on CE-driven automatic power-down: ISB2 = 10 mA at CMOS input conditions (VIN > VCC – 0.3 V or < 0.3 V), with full ICC = 130 mA during active operation at fMAX = 1/tRC. Input/output pins enter high-impedance state under four conditions: CE HIGH, OE HIGH, BHE/BLE HIGH, or during write cycles.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 64K × 16-bit (1 Mbit total); enables 16-bit parallel data bus interfacing without external multiplexing.
Access Time (tAA) 15 ns max (industrial temp); guarantees data validity within 15 ns after stable address and CE/OE assertion.
VCC Supply 5 V ±10%; compatible with standard 5 V logic families and legacy microprocessor buses.
Standby Current (ISB2) 10 mA max (CMOS inputs); ensures ultra-low power retention when deselected in battery-backed or low-power systems.
Operating Temperature –40°C to +85°C; qualified for industrial environments including factory automation and motor control cabinets.
Package 44-pin TSOP Type II (Pb-free); surface-mount compatible with standard reflow profiles and IPC-7351B land patterns.
Byte Enable Logic BHE and BLE active-Low; allows independent 8-bit writes to upper/lower data bytes without affecting adjacent bytes.

Pinout & Package

Package: 44-pin TSOP Type II (0.400-inch width), Pb-free, JEDEC MO-143AC compliant. Body dimensions: 11.20–11.30 mm × 10.16–10.26 mm × 1.0 mm max height.

Pin/Terminal Circuit Role Design Meaning
A0–A15 Address Inputs 16-bit address bus; selects one of 65,536 memory locations; TTL/CMOS compatible.
I/O1–I/O8 Data I/O (Lower Byte) Bidirectional 8-bit data path enabled by BLE LOW; tri-stated when BLE HIGH or CE HIGH.
I/O9–I/O16 Data I/O (Upper Byte) Bidirectional 8-bit data path enabled by BHE LOW; isolated from lower byte during partial writes.
CE Chip Enable Active-Low global select; initiates power-down mode and enables internal logic when asserted.
WE Write Enable Active-Low write strobe; combined with CE and BHE/BLE to define write cycle boundaries per truth table.
OE Output Enable Active-Low output control; places I/O pins in high-Z when deasserted, enabling bus sharing.
BHE, BLE Byte Write Enables Independent active-Low controls for upper/lower data bytes; enables 8-bit granularity writes.
VCC (Pins 11, 33) Power Supply +5 V ±10% main supply; dual-pin configuration reduces IR drop and improves noise immunity.
VSS (Pins 12, 34) Ground System ground reference; dual-pin layout minimizes ground bounce in high-speed access cycles.

Key Features

Feature Design Value
Automatic CE Power-Down Reduces ICC to 10 mA (ISB2) when CE is deasserted, eliminating need for external power gating in idle states.
Dual Independent Byte Control Enables concurrent or selective 8-bit writes to upper/lower data words without read-modify-write overhead.
Tri-State Output Management I/O pins enter high-Z on CE HIGH, OE HIGH, BHE/BLE HIGH, or during write - ensuring clean bus arbitration.
Industrial Temperature Support Guaranteed 15 ns access and full functionality from –40°C to +85°C, validated per JEDEC JESD22-A108.
Pb-Free TSOP II Packaging RoHS-compliant 44-pin TSOP II footprint; matches legacy SOJ layouts while supporting modern reflow processes.

Applications

Industrial PLC Memory Buffer Legacy 16-Bit Microprocessor Cache

Use Scenario: Real-time I/O data buffering in programmable logic controllers where deterministic latency and data integrity are critical across temperature swings.

IC Role / Device Role / Timing Role: Non-volatile shadow RAM holding register-mapped process variables; accessed synchronously with 15 ns tAA timing.

Use Value: Eliminates wait states in 80C188/80C186-based control loops due to guaranteed 15 ns access and robust CE-driven power-down during scan idle periods.

Use Scenario: Instruction/data cache extension for 16-bit embedded CPUs lacking on-chip SRAM, operating in fixed-bus-width configurations.

IC Role / Device Role / Timing Role: External memory mapped at 0x0000–0xFFFF; serves as zero-wait-state code/data store with byte-select capability.

Use Value: Enables direct 16-bit bus coupling without glue logic; BHE/BLE support allows efficient stack pointer manipulation and peripheral register updates.

Automotive Instrument Cluster Display Buffer Medical Diagnostic Equipment Frame Store

Use Scenario: Temporary storage of rendered GUI frames in automotive digital dashboards requiring reliable operation up to +85°C ambient.

IC Role / Device Role / Timing Role: Dual-port accessible frame buffer; upper/lower bytes updated independently during pixel line rendering.

Use Value: Reduces CPU bandwidth demand by enabling partial-frame writes; ISB2 = 10 mA extends battery runtime during vehicle sleep mode.

Use Scenario: High-fidelity waveform capture buffer in portable ultrasound or ECG devices where data coherency must survive power interruptions.

IC Role / Device Role / Timing Role: Battery-backed SRAM storing real-time analog-to-digital samples prior to DSP processing or flash transfer.

Use Value: 15 ns tAA ensures no sample loss during burst acquisition; industrial temp rating validates performance inside sealed medical enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed parallel SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISSI IS61LV1024-15K Same 64K × 16 organization, 15 ns access, 5 V supply, but uses 44-pin SOJ (not TSOP II); ISB2 = 12 mA. SOJ package requires different PCB footprint and reflow profile; lacks Pb-free option in -15K speed grade. Select if SOJ mounting is preferred and Pb-free compliance is not required.
ON Semiconductor MC68HC11F1M15 Not a drop-in replacement: integrated MCU with 1 KB on-chip RAM; no external 16-bit bus interface or BHE/BLE logic. Only suitable for new designs where firmware integration replaces discrete memory expansion. Reject for pin- and function-compatible replacement; use only in greenfield MCU-based architectures.

Compared with IS61LV1024-15K, CY7C1021B-15ZXI offers Pb-free TSOP II packaging and lower ISB2 (10 mA vs. 12 mA), making it preferable for industrial surface-mount production; versus MC68HC11F1M15, it provides true external parallel SRAM functionality with deterministic timing and byte-select control absent in microcontroller-integrated RAM.

Availability

CY7C1021B-15ZXI is available at Aetrix Electronics and suitable for industrial PLCs, legacy 16-bit microprocessor systems, and automotive instrument clusters requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant manufacturing.

Supply support for CY7C1021B-15ZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company founded in 1982, specializing in memory, microcontrollers, and programmable system-on-chip solutions.

The CY7C1021B belongs to Cypress's parallel SRAM product line, designed specifically for high-reliability, low-latency memory expansion in industrial, automotive, and communications equipment requiring deterministic timing and industrial temperature operation.

FAQ

Is CY7C1021B-15ZXI compatible with 3.3 V systems?

No. The CY7C1021B-15ZXI is specified exclusively for 5 V ±10% operation (4.5 V to 5.5 V). Its VIH minimum is 2.2 V and VIL maximum is 0.8 V, but internal circuitry, timing parameters, and power consumption are characterized only at 5 V. Interfacing with 3.3 V logic requires level-shifting circuitry and invalidates guaranteed tAA = 15 ns performance.

What is the meaning of "ZXI" in the part number CY7C1021B-15ZXI?

"Z" denotes TSOP II package, "X" indicates Pb-free construction, and "I" specifies industrial temperature range (–40°C to +85°C). This suffix uniquely identifies the device as a RoHS-compliant, industrial-grade 44-pin TSOP II variant with 15 ns access speed - distinct from commercial (C), automotive (E), or Pb-containing (no X) versions.

Does CY7C1021B-15ZXI support asynchronous burst reads?

No. The CY7C1021B-15ZXI is a static RAM with purely asynchronous operation: each read or write requires explicit CE, OE (for reads), WE (for writes), and BHE/BLE assertion per cycle. It lacks burst address generation, clock input, or sequential access modes - all timing is referenced to address and control signal edges per the truth table and switching waveforms.

Can BLE and BHE be asserted simultaneously for full 16-bit writes?

Yes. When both BLE and BHE are LOW while CE and WE are LOW, the device performs a full 16-bit write: data on I/O1–I/O8 is written to the lower byte and data on I/O9–I/O16 is written to the upper byte of the addressed location. This is explicitly defined in the truth table and functional description as "Write – All bits" mode.

CY7C1021B-15ZXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
44-TSOP (0.400", 10.16mm Width)
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
1Mbit
Memory Organization:
64K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
15ns
Access Time:
15 ns
Voltage - Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
44-TSOP II

CY7C1021B-15ZXI FAQ

1.How can I place an order for CY7C1021B-15ZXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1021B-15ZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1021B-15ZXI reliable?

The price and inventory of CY7C1021B-15ZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1021B-15ZXI is usually 5 days.

3.What payment methods are accepted for CY7C1021B-15ZXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1021B-15ZXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1021B-15ZXI?

CY7C1021B-15ZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1021B-15ZXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1021B-15ZXI?

For technical support, including CY7C1021B-15ZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1021B-15ZXI requirements.

6.How does Aetrix verify that CY7C1021B-15ZXI is sourced from the original manufacturer or authorized distributors?

All CY7C1021B-15ZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1021B-15ZXI meets industry standards.

7.What is the process for return or replacement of CY7C1021B-15ZXI?

All CY7C1021B-15ZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1021B-15ZXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1021B-15ZXI part is unused and in its original packaging.

Return procedure for CY7C1021B-15ZXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1021B-15ZXI Tags

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