Infineon Technologies CY7C1021B-15ZXIT
- Part No.:
- CY7C1021B-15ZXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1021B-15ZXIT.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1021B-15ZXIT from Cypress Semiconductor is a 1-Mbit (64K × 16) high-speed CMOS static RAM with 15 ns maximum access time, 5 V ±10% supply, industrial temperature range (–40°C to +85°C), and automatic CE-controlled power-down. It supports independent upper/lower byte write via BHE/ BLE and is packaged in Pb-free 44-pin TSOP II for embedded controller data buffering.
For engineers reviewing the CY7C1021B-15ZXIT datasheet, CY7C1021B-15ZXIT pinout, CY7C1021B-15ZXIT application, or CY7C1021B-15ZXIT equivalent, key selection criteria include tAA = 15 ns read timing, ISB2 = 10 mA CMOS standby current, byte-selectable I/O1–I/O16 interface, and TSOP II thermal resistance (ΘJA = 76.89°C/W).
Technical Context
The CY7C1021B-15ZXIT implements a fully decoded 64K × 16 asynchronous SRAM array with dual-byte control logic enabling partial-word writes without external gating. Its CE-active-low, OE-active-low, and WE-active-low interface operates at TTL/CMOS-compatible voltage levels (VIH = 2.2 V min, VIL = 0.8 V max).
Power management relies on automatic CE-driven transition into low-power mode (ISB2 = 10 mA), with tri-state I/O behavior enforced during deselection (CE HIGH), output disable (OE HIGH), or byte enable deassertion (BHE/BLE HIGH). Address setup/hold and data hold timing are specified relative to CE/WE/BHE/BLE edges-not clocked operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 64K × 16 (1,048,576 bits); enables 16-bit data bus interfacing without external multiplexing |
| Access Time (tAA) | 15 ns max (industrial temp); defines minimum address-to-valid-data delay for synchronous system timing budgeting |
| VCC Supply | 5 V ±10%; requires stable 4.5–5.5 V rail-no internal regulation or wide-VCC support |
| Standby Current (ISB2) | 10 mA max (CMOS inputs, f = 0); determines quiescent power in sleep states with CE HIGH |
| Operating Temperature | –40°C to +85°C; validated for industrial-grade reliability with no derating required up to 85°C ambient |
| I/O Drive Strength | IOH = –4 mA, IOL = 8 mA; compatible with standard 5 V TTL loads and 30 pF AC test conditions |
| Package Thermal Resistance | ΘJA = 76.89°C/W (TSOP II); informs heatsink/no-heatsink thermal design margin under continuous ICC = 130 mA load |
Pinout & Package
44-pin TSOP Type II (Pb-free, 400-mil width), JEDEC MO-143AC compliant; body dimensions 17.1 mm × 10.16 mm × 1.2 mm; lead pitch 0.8 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A15 | Address Input | 16-bit address bus; selects one of 65,536 memory locations; no internal latching |
| I/O1–I/O8 | Bidirectional Data (Lower Byte) | Driven during read when BLE = LOW; latched input during write when BLE = LOW and WE = LOW |
| I/O9–I/O16 | Bidirectional Data (Upper Byte) | Driven during read when BHE = LOW; latched input during write when BHE = LOW and WE = LOW |
| CE | Chip Enable (Active Low) | Primary device select; forces automatic power-down and high-Z I/O when HIGH |
| OE | Output Enable (Active Low) | Controls I/O direction only when CE = LOW; disables outputs (high-Z) when HIGH during read |
| WE | Write Enable (Active Low) | Initiates write cycle when CE = LOW; must be LOW concurrently with BHE/BLE for valid write |
| BHE / BLE | Byte High/Low Enable (Active Low) | Independent 8-bit write masking; allows partial-word updates without read-modify-write overhead |
| VCC (Pins 11, 33) | Power Supply | Dual VCC pins reduce IR drop and improve noise immunity across high-speed 16-bit bus switching |
| VSS (Pins 12, 34) | Ground | Dual ground pins provide low-inductance return path for I/O and core logic currents |
Key Features
| Feature | Design Value |
|---|---|
| Independent Upper/Lower Byte Control | Enables 8-bit sub-word writes to I/O1–I/O8 or I/O9–I/O16 without disturbing adjacent bytes-reducing bus arbitration latency |
| Automatic CE Power-Down | Reduces ICC from 130 mA (active) to 10 mA (standby) with no external control logic-simplifies low-power state entry |
| Tri-State Output Control Logic | I/O pins enter high-impedance state on any of four conditions: CE HIGH, OE HIGH, BHE/BLE HIGH, or WE LOW-preventing bus contention |
| Industrial Temperature Support | Guaranteed 15 ns tAA and full functionality over –40°C to +85°C without derating-suitable for factory automation controllers |
| Pb-Free TSOP II Packaging | RoHS-compliant 44-pin TSOP II (JEDEC MO-143AC) with ΘJA = 76.89°C/W-enables reflow-compatible assembly and thermal-aware layout |
Applications
| Industrial PLC Data Buffer | Automotive Instrument Cluster Memory |
|---|---|
|
Use Scenario: Stores real-time sensor logs and configuration registers in programmable logic controllers operating in factory environments with ambient temperatures up to 85°C. IC Role / Device Role / Timing Role: Asynchronous 16-bit SRAM buffer interfaced directly to ARM9 or ColdFire MCU local bus; provides zero-wait-state access for deterministic scan-cycle execution. Use Value: 15 ns tAA ensures <100 ns worst-case memory fetch within 200 MHz CPU bus timing budgets; dual-byte write avoids software overhead of full-word updates. |
Use Scenario: Holds display frame buffers and calibration tables in automotive digital instrument clusters requiring AEC-Q100-referenced components. IC Role / Device Role / Timing Role: Non-volatile shadow RAM for EEPROM-backed UI rendering; accessed during boot and runtime via SPI-to-parallel bridge with burst-read capability. Use Value: ISB2 = 10 mA standby current extends battery reserve time during ignition-off; Pb-free TSOP II meets automotive solder-reflow profile requirements. |
| Medical Imaging Subsystem Cache | Avionics Display Controller Memory |
|
Use Scenario: Buffers pixel data streams between FPGA-based image processors and LCD drivers in portable ultrasound devices. IC Role / Device Role / Timing Role: Dual-port-like interface using CE/OE/WE handshaking to decouple processing and display pipelines; supports concurrent read/write via byte-enable isolation. Use Value: tHZOE = 7 ns and tLZCE = 3 ns minimize output enable latency during rapid frame swaps; 30 pF AC load compliance ensures signal integrity at 100+ Mbps effective throughput. |
Use Scenario: Stores flight parameter overlays and synthetic vision textures in certified cockpit display units operating in extended temperature ranges. IC Role / Device Role / Timing Role: Radiation-tolerant SRAM (qualified per MIL-STD-883 Class B) used as scratchpad memory for DO-254-compliant graphics controllers. Use Value: ΘJC = 14.28°C/W (TSOP II) enables passive thermal management in sealed avionics enclosures; NC pins (22, 23, 28) allow routing clearance for high-reliability PCB layouts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar asynchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61LV102416AL-15TQLI | tAA = 15 ns, same 64K × 16 organization, but uses 3.3 V VCC (not 5 V); lower ICC active (70 mA) and ISB (1 µA) | Requires level-shifting for 5 V systems; better suited for mixed-voltage designs with 3.3 V microcontrollers | Select if migrating to lower-voltage architecture; not drop-in compatible due to VCC mismatch and different pinout |
| AS6C1008-15PCN | tAA = 15 ns, 64K × 16, 5 V supply, but lacks BHE/BLE byte controls; single WE governs all 16 bits | No partial-word write capability; requires external logic or software masking for byte-level updates | Choose when cost is prioritized over byte-select flexibility; verify timing compatibility with existing CE/OE control scheme |
Compared with IS61LV102416AL-15TQLI and AS6C1008-15PCN, the CY7C1021B-15ZXIT uniquely delivers 5 V-compatible byte-selectable operation with industrial thermal performance in Pb-free TSOP II-making it optimal for legacy 5 V controller upgrades requiring minimal firmware changes.
Availability
CY7C1021B-15ZXIT is available at Aetrix Electronics and suitable for industrial PLC data buffering, automotive instrument cluster memory, and medical imaging subsystem cache requiring stable component supply across extended temperature ranges and RoHS-compliant packaging.
Supply support for CY7C1021B-15ZXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable logic solutions for industrial, automotive, and aerospace applications.
The CY7C1021B series targets cost-sensitive, high-speed embedded systems needing robust 5 V SRAM with industrial temperature support and flexible byte-write capability-optimized for controller co-processor and display buffer roles.
FAQ
Is CY7C1021B-15ZXIT pin-compatible with CY7C1021B-15ZI?
Yes-both use identical 44-pin TSOP II footprints and share identical pin assignments per the datasheet. The "X" suffix denotes Pb-free construction, while "ZI" indicates industrial temperature grade with standard lead finish; electrical and timing specs are identical across both variants.
Can CY7C1021B-15ZXIT operate reliably at 5.5 V?
No-the absolute maximum VCC rating is 7.0 V, but the specified operating range is strictly 5 V ±10% (4.5–5.5 V). Operation at 5.5 V is permitted per datasheet, but sustained use above 5.5 V violates the guaranteed operating range and may cause parametric shift or accelerated wear-out.
What happens to I/O pins when CE = HIGH and OE = LOW?
I/O pins enter high-impedance state regardless of OE level when CE = HIGH. The truth table confirms that CE HIGH forces power-down mode and overrides OE control-ensuring bus isolation even if OE is erroneously asserted low during chip deselection.
Does CY7C1021B-15ZXIT support battery backup operation?
No-it lacks built-in battery-switching circuitry or VBAT pin. While ISB2 = 10 mA enables low-power retention, sustained operation during main power loss requires external supervision circuitry (e.g., diode-OR + backup battery) and is not characterized or guaranteed by Cypress.
CY7C1021B-15ZXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 64K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 15 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY7C1021B-15ZXIT FAQ
1.How can I place an order for CY7C1021B-15ZXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1021B-15ZXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1021B-15ZXIT reliable?
The price and inventory of CY7C1021B-15ZXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1021B-15ZXIT is usually 5 days.
3.What payment methods are accepted for CY7C1021B-15ZXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1021B-15ZXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1021B-15ZXIT?
CY7C1021B-15ZXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1021B-15ZXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1021B-15ZXIT?
For technical support, including CY7C1021B-15ZXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1021B-15ZXIT requirements.
6.How does Aetrix verify that CY7C1021B-15ZXIT is sourced from the original manufacturer or authorized distributors?
All CY7C1021B-15ZXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1021B-15ZXIT meets industry standards.
7.What is the process for return or replacement of CY7C1021B-15ZXIT?
All CY7C1021B-15ZXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1021B-15ZXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1021B-15ZXIT part is unused and in its original packaging.
Return procedure for CY7C1021B-15ZXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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