Infineon Technologies CY7C1021BNV33L-12ZXCT
- Part No.:
- CY7C1021BNV33L-12ZXCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1021BNV33L-12ZXCT.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1021BNV33L-12ZXCT from Cypress Semiconductor is a 64K × 16-bit (1-Mbit) asynchronous CMOS static RAM operating at 3.3 V with 12 ns access time, low active power (576 mW max), and automatic CE-controlled power-down. It supports independent byte-wide write enable via BHE/BLE pins and is packaged in a Pb-free 44-pin TSOP II for embedded memory buffering in industrial control and communications systems.
For engineers reviewing the CY7C1021BNV33L-12ZXCT datasheet, CY7C1021BNV33L-12ZXCT pinout, CY7C1021BNV33L-12ZXCT application, or CY7C1021BNV33L-12ZXCT equivalent, this page delivers verified timing parameters, byte-select operation details, package-specific pin mapping, and real-world use cases for SRAM integration in space-constrained, low-power designs.
Technical Context
This SRAM implements a full 65,536-word × 16-bit array with separate high-byte (I/O9–I/O16/BHE) and low-byte (I/O1–I/O8/BLE) control, enabling partial writes without read-modify-write cycles. Its TTL/CMOS-compatible inputs accept VIH ≥ 2.2 V and VIL ≤ 0.8 V, and output drive meets VOH ≥ 2.4 V (IOH = –4 mA) and VOL ≤ 0.4 V (IOL = 8 mA).
Timing is defined by tAA = 12 ns (address-to-data), tRC = 12 ns (read cycle), and tWC = 12 ns (write cycle), with tHZOE = 6 ns and tPD = 12 ns for fast power-state transitions. The L-version achieves ISB2 = 0.5 mA standby current under CMOS input conditions and supports data retention down to VCC = 2.0 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 64K × 16-bit (1,048,576 bits); enables 16-bit data bus interfacing without external multiplexing |
| Access Time (tAA) | 12 ns maximum; guarantees deterministic read latency for real-time control loops |
| VCC Operating Range | 3.0 V to 3.6 V; compatible with standard 3.3 V logic rails and tolerant of ±10% supply variation |
| Active Current (ICC) | 150 mA max (industrial); corresponds to ~576 mW active power at 3.3 V, critical for thermal budgeting |
| Standby Current (ISB2) | 0.5 mA max (CMOS inputs); reduces idle power by >99% vs. active mode in sleep-aware systems |
| Data Retention Voltage | 2.0 V minimum; allows battery-backed hold mode during main supply removal |
| Byte Enable Logic | Independent BLE/BHE control; permits atomic 8-bit updates to upper/lower bytes without disturbing adjacent data |
Pinout & Package
Package: 44-pin TSOP Type II (0.400-inch width), RoHS-compliant, surface-mount, JEDEC MO-143AC compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A15 | Address Inputs | 16-bit address bus; selects one of 65,536 memory locations; TTL/CMOS compatible |
| I/O1–I/O8 | Low-Byte Data I/O | Bidirectional 8-bit data path enabled when BLE = LOW; high-impedance when disabled |
| I/O9–I/O16 | High-Byte Data I/O | Bidirectional 8-bit data path enabled when BHE = LOW; isolated from low-byte during partial writes |
| CE | Chip Enable | Active-LOW global select; initiates automatic power-down when HIGH (ISB2 = 0.5 mA) |
| WE | Write Enable | Active-LOW write strobe; combined with CE and BLE/BHE to define write cycle boundaries |
| OE | Output Enable | Active-LOW output control; places I/O pins in high-Z when HIGH, even if CE is asserted |
| BLE | Byte Low Enable | Active-LOW control for I/O1–I/O8; enables independent lower-byte read/write operations |
| BHE | Byte High Enable | Active-LOW control for I/O9–I/O16; enables independent upper-byte read/write operations |
| VCC | Power Supply | 3.3 V core supply; two dedicated pins (pins 16 and 32) reduce IR drop and improve noise immunity |
| VSS | Ground | Two ground pins (pins 12 and 27) provide low-inductance return paths for I/O and core logic |
Key Features
| Feature | Design Value |
|---|---|
| Automatic CE Power-Down | Reduces standby current to 0.5 mA without external logic or software intervention |
| Independent Byte Write Control | Eliminates need for external byte masking logic; supports efficient 8-bit peripheral interfacing |
| Low Active Power (576 mW max) | Enables use in thermally constrained industrial modules without forced air or heatsinking |
| 12 ns Access with 3.3 V Operation | Meets timing requirements of legacy 16-bit microcontrollers (e.g., Intel 80C188, Motorola 68332) |
| Pb-Free TSOP II Packaging | Complies with RoHS Directive 2011/65/EU; qualified for reflow per J-STD-020C |
Applications
| Industrial PLC Memory Buffer | Legacy 16-Bit Microcontroller Cache |
|---|---|
|
Use Scenario: Storing real-time I/O scan data and ladder logic state variables in programmable logic controllers operating across –40°C to +85°C. IC Role / Device Role / Timing Role: Non-volatile shadow RAM buffer interfaced directly to a 16-bit data bus; provides deterministic 12 ns read/write response for cyclic scan execution. Use Value: Independent BHE/BLE control allows atomic update of status registers without corrupting adjacent configuration words during concurrent I/O servicing. |
Use Scenario: Serving as on-board program/data RAM for aging 16-bit microcontrollers in medical diagnostic equipment where long-term component availability is critical. IC Role / Device Role / Timing Role: Asynchronous parallel memory mapped at fixed address range; satisfies tAA ≤ 12 ns requirement of 80C186EX-based control firmware. Use Value: 3.3 V operation and low ICC allow direct interface to 3.3 V CPU buses without level-shifting, reducing BOM count and signal integrity risk. |
| Telecom Line Card Packet Buffer | Avionics Display Controller Frame Store |
|
Use Scenario: Temporary storage of Ethernet frame payloads in modular telecom line cards requiring burst-mode packet buffering with minimal latency jitter. IC Role / Device Role / Timing Role: Dual-port-capable SRAM used in ping-pong configuration; CE toggling synchronizes with DMA engine handshaking signals. Use Value: tPD = 12 ns ensures rapid entry into low-power mode between packet bursts, cutting average power by >70% versus continuous-active operation. |
Use Scenario: Holding pixel data for monochrome LCD displays in certified avionics display units where radiation tolerance and long-term reliability are mandatory. IC Role / Device Role / Timing Role: Static frame buffer accessed by display controller's 16-bit parallel interface; retains valid data during brief power interruptions. Use Value: VDR = 2.0 V and ICCDR = 100 µA support >24-hour data retention on backup coin cell, meeting DO-160 Section 21 transient survivability requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar asynchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61LV102416AL-12MLI | Same 64K × 16 organization, 12 ns speed, and 3.3 V operation; but uses 48-pin TSOPII (wider body) and lacks BGA option | Compatible pinout for TSOP II footprint; however, requires PCB redesign for Mini BGA migration path | Select when needing second-source assurance with identical timing and byte-enable functionality |
| ON Semiconductor MC1021B-12L | Discontinued industrial-grade SRAM; same 12 ns speed and 3.3 V rating but higher ISB2 (5 mA vs. 0.5 mA) | Higher standby current limits use in battery-backed or energy-harvesting systems | Consider only for legacy repair; not recommended for new designs due to obsolescence and power penalty |
Compared with IS61LV102416AL-12MLI and MC1021B-12L, the CY7C1021BNV33L-12ZXCT offers superior standby efficiency (0.5 mA vs. 5 mA), RoHS-compliant packaging, and documented Mini BGA migration path-making it optimal for new industrial designs prioritizing longevity and thermal headroom.
Availability
CY7C1021BNV33L-12ZXCT is available at Aetrix Electronics and suitable for industrial PLCs, legacy 16-bit microcontroller systems, and telecom line card packet buffering requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CY7C1021BNV33L-12ZXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and communications markets, with headquarters in San Jose, CA.
The CY7C1021BNV series was developed specifically for cost-sensitive, space-constrained embedded systems needing fast, low-power, byte-selectable parallel SRAM-targeting applications where EEPROM or Flash latency is unacceptable.
FAQ
Is CY7C1021BNV33L-12ZXCT compatible with 5 V logic interfaces?
No. This device operates strictly at 3.3 V (3.0–3.6 V) and its inputs are not 5 V tolerant. Applying 5 V to any pin-including address, data, or control lines-exceeds the absolute maximum rating of VCC + 0.5 V and risks permanent damage. Level-shifting circuitry is required for interfacing with 5 V microcontrollers or FPGAs.
What is the significance of the "L" suffix in CY7C1021BNV33L-12ZXCT?
The "L" denotes the low-power variant: it specifies reduced active current (150 mA max), ultra-low standby current (0.5 mA max under CMOS input conditions), and guaranteed data retention down to 2.0 V. This distinguishes it from standard-speed or non-L versions that draw significantly higher ISB and lack retention specs.
Can BLE and BHE be asserted simultaneously for full 16-bit operation?
Yes. When both BLE and BHE are LOW while CE and WE are active, the device performs full 16-bit read or write operations across I/O1–I/O16. The truth table confirms this as the "Write - All bits" and "Read - All bits" modes, with no timing penalty versus byte-only access.
Does CY7C1021BNV33L-12ZXCT support hot insertion or live swapping?
No. The device lacks hot-swap protection features such as power-on reset, I/O clamp diodes rated for insertion transients, or controlled slew-rate outputs. Applying VCC or signals before establishing proper grounding may cause latch-up or parametric shift. Board-level hot-swap circuitry must be implemented externally.
CY7C1021BNV33L-12ZXCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 64K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 12ns
- Access Time:
- 12 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY7C1021BNV33L-12ZXCT FAQ
1.How can I place an order for CY7C1021BNV33L-12ZXCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1021BNV33L-12ZXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1021BNV33L-12ZXCT reliable?
The price and inventory of CY7C1021BNV33L-12ZXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1021BNV33L-12ZXCT is usually 5 days.
3.What payment methods are accepted for CY7C1021BNV33L-12ZXCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1021BNV33L-12ZXCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1021BNV33L-12ZXCT?
CY7C1021BNV33L-12ZXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1021BNV33L-12ZXCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1021BNV33L-12ZXCT?
For technical support, including CY7C1021BNV33L-12ZXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1021BNV33L-12ZXCT requirements.
6.How does Aetrix verify that CY7C1021BNV33L-12ZXCT is sourced from the original manufacturer or authorized distributors?
All CY7C1021BNV33L-12ZXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1021BNV33L-12ZXCT meets industry standards.
7.What is the process for return or replacement of CY7C1021BNV33L-12ZXCT?
All CY7C1021BNV33L-12ZXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1021BNV33L-12ZXCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1021BNV33L-12ZXCT part is unused and in its original packaging.
Return procedure for CY7C1021BNV33L-12ZXCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1021BNV33L-12ZXCT Tags

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