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Infineon Technologies CY7C1021BNV33L-12ZXCT

Part No.:
CY7C1021BNV33L-12ZXCT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
44-TSOP (0.400", 10.16mm Width)
Datasheet:
AetrixCY7C1021BNV33L-12ZXCT.pdf
Description:
IC SRAM 1MBIT PARALLEL 44TSOP II
Quantity:
Payment:
Payment
Shipping:
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Inventory:2,664

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Product details

Overview

CY7C1021BNV33L-12ZXCT from Cypress Semiconductor is a 64K × 16-bit (1-Mbit) asynchronous CMOS static RAM operating at 3.3 V with 12 ns access time, low active power (576 mW max), and automatic CE-controlled power-down. It supports independent byte-wide write enable via BHE/BLE pins and is packaged in a Pb-free 44-pin TSOP II for embedded memory buffering in industrial control and communications systems.

For engineers reviewing the CY7C1021BNV33L-12ZXCT datasheet, CY7C1021BNV33L-12ZXCT pinout, CY7C1021BNV33L-12ZXCT application, or CY7C1021BNV33L-12ZXCT equivalent, this page delivers verified timing parameters, byte-select operation details, package-specific pin mapping, and real-world use cases for SRAM integration in space-constrained, low-power designs.

Technical Context

This SRAM implements a full 65,536-word × 16-bit array with separate high-byte (I/O9–I/O16/BHE) and low-byte (I/O1–I/O8/BLE) control, enabling partial writes without read-modify-write cycles. Its TTL/CMOS-compatible inputs accept VIH ≥ 2.2 V and VIL ≤ 0.8 V, and output drive meets VOH ≥ 2.4 V (IOH = –4 mA) and VOL ≤ 0.4 V (IOL = 8 mA).

Timing is defined by tAA = 12 ns (address-to-data), tRC = 12 ns (read cycle), and tWC = 12 ns (write cycle), with tHZOE = 6 ns and tPD = 12 ns for fast power-state transitions. The L-version achieves ISB2 = 0.5 mA standby current under CMOS input conditions and supports data retention down to VCC = 2.0 V.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 64K × 16-bit (1,048,576 bits); enables 16-bit data bus interfacing without external multiplexing
Access Time (tAA) 12 ns maximum; guarantees deterministic read latency for real-time control loops
VCC Operating Range 3.0 V to 3.6 V; compatible with standard 3.3 V logic rails and tolerant of ±10% supply variation
Active Current (ICC) 150 mA max (industrial); corresponds to ~576 mW active power at 3.3 V, critical for thermal budgeting
Standby Current (ISB2) 0.5 mA max (CMOS inputs); reduces idle power by >99% vs. active mode in sleep-aware systems
Data Retention Voltage 2.0 V minimum; allows battery-backed hold mode during main supply removal
Byte Enable Logic Independent BLE/BHE control; permits atomic 8-bit updates to upper/lower bytes without disturbing adjacent data

Pinout & Package

Package: 44-pin TSOP Type II (0.400-inch width), RoHS-compliant, surface-mount, JEDEC MO-143AC compliant.

Pin/Terminal Circuit Role Design Meaning
A0–A15 Address Inputs 16-bit address bus; selects one of 65,536 memory locations; TTL/CMOS compatible
I/O1–I/O8 Low-Byte Data I/O Bidirectional 8-bit data path enabled when BLE = LOW; high-impedance when disabled
I/O9–I/O16 High-Byte Data I/O Bidirectional 8-bit data path enabled when BHE = LOW; isolated from low-byte during partial writes
CE Chip Enable Active-LOW global select; initiates automatic power-down when HIGH (ISB2 = 0.5 mA)
WE Write Enable Active-LOW write strobe; combined with CE and BLE/BHE to define write cycle boundaries
OE Output Enable Active-LOW output control; places I/O pins in high-Z when HIGH, even if CE is asserted
BLE Byte Low Enable Active-LOW control for I/O1–I/O8; enables independent lower-byte read/write operations
BHE Byte High Enable Active-LOW control for I/O9–I/O16; enables independent upper-byte read/write operations
VCC Power Supply 3.3 V core supply; two dedicated pins (pins 16 and 32) reduce IR drop and improve noise immunity
VSS Ground Two ground pins (pins 12 and 27) provide low-inductance return paths for I/O and core logic

Key Features

Feature Design Value
Automatic CE Power-Down Reduces standby current to 0.5 mA without external logic or software intervention
Independent Byte Write Control Eliminates need for external byte masking logic; supports efficient 8-bit peripheral interfacing
Low Active Power (576 mW max) Enables use in thermally constrained industrial modules without forced air or heatsinking
12 ns Access with 3.3 V Operation Meets timing requirements of legacy 16-bit microcontrollers (e.g., Intel 80C188, Motorola 68332)
Pb-Free TSOP II Packaging Complies with RoHS Directive 2011/65/EU; qualified for reflow per J-STD-020C

Applications

Industrial PLC Memory Buffer Legacy 16-Bit Microcontroller Cache

Use Scenario: Storing real-time I/O scan data and ladder logic state variables in programmable logic controllers operating across –40°C to +85°C.

IC Role / Device Role / Timing Role: Non-volatile shadow RAM buffer interfaced directly to a 16-bit data bus; provides deterministic 12 ns read/write response for cyclic scan execution.

Use Value: Independent BHE/BLE control allows atomic update of status registers without corrupting adjacent configuration words during concurrent I/O servicing.

Use Scenario: Serving as on-board program/data RAM for aging 16-bit microcontrollers in medical diagnostic equipment where long-term component availability is critical.

IC Role / Device Role / Timing Role: Asynchronous parallel memory mapped at fixed address range; satisfies tAA ≤ 12 ns requirement of 80C186EX-based control firmware.

Use Value: 3.3 V operation and low ICC allow direct interface to 3.3 V CPU buses without level-shifting, reducing BOM count and signal integrity risk.

Telecom Line Card Packet Buffer Avionics Display Controller Frame Store

Use Scenario: Temporary storage of Ethernet frame payloads in modular telecom line cards requiring burst-mode packet buffering with minimal latency jitter.

IC Role / Device Role / Timing Role: Dual-port-capable SRAM used in ping-pong configuration; CE toggling synchronizes with DMA engine handshaking signals.

Use Value: tPD = 12 ns ensures rapid entry into low-power mode between packet bursts, cutting average power by >70% versus continuous-active operation.

Use Scenario: Holding pixel data for monochrome LCD displays in certified avionics display units where radiation tolerance and long-term reliability are mandatory.

IC Role / Device Role / Timing Role: Static frame buffer accessed by display controller's 16-bit parallel interface; retains valid data during brief power interruptions.

Use Value: VDR = 2.0 V and ICCDR = 100 µA support >24-hour data retention on backup coin cell, meeting DO-160 Section 21 transient survivability requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar asynchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISSI IS61LV102416AL-12MLI Same 64K × 16 organization, 12 ns speed, and 3.3 V operation; but uses 48-pin TSOPII (wider body) and lacks BGA option Compatible pinout for TSOP II footprint; however, requires PCB redesign for Mini BGA migration path Select when needing second-source assurance with identical timing and byte-enable functionality
ON Semiconductor MC1021B-12L Discontinued industrial-grade SRAM; same 12 ns speed and 3.3 V rating but higher ISB2 (5 mA vs. 0.5 mA) Higher standby current limits use in battery-backed or energy-harvesting systems Consider only for legacy repair; not recommended for new designs due to obsolescence and power penalty

Compared with IS61LV102416AL-12MLI and MC1021B-12L, the CY7C1021BNV33L-12ZXCT offers superior standby efficiency (0.5 mA vs. 5 mA), RoHS-compliant packaging, and documented Mini BGA migration path-making it optimal for new industrial designs prioritizing longevity and thermal headroom.

Availability

CY7C1021BNV33L-12ZXCT is available at Aetrix Electronics and suitable for industrial PLCs, legacy 16-bit microcontroller systems, and telecom line card packet buffering requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for CY7C1021BNV33L-12ZXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and communications markets, with headquarters in San Jose, CA.

The CY7C1021BNV series was developed specifically for cost-sensitive, space-constrained embedded systems needing fast, low-power, byte-selectable parallel SRAM-targeting applications where EEPROM or Flash latency is unacceptable.

FAQ

Is CY7C1021BNV33L-12ZXCT compatible with 5 V logic interfaces?

No. This device operates strictly at 3.3 V (3.0–3.6 V) and its inputs are not 5 V tolerant. Applying 5 V to any pin-including address, data, or control lines-exceeds the absolute maximum rating of VCC + 0.5 V and risks permanent damage. Level-shifting circuitry is required for interfacing with 5 V microcontrollers or FPGAs.

What is the significance of the "L" suffix in CY7C1021BNV33L-12ZXCT?

The "L" denotes the low-power variant: it specifies reduced active current (150 mA max), ultra-low standby current (0.5 mA max under CMOS input conditions), and guaranteed data retention down to 2.0 V. This distinguishes it from standard-speed or non-L versions that draw significantly higher ISB and lack retention specs.

Can BLE and BHE be asserted simultaneously for full 16-bit operation?

Yes. When both BLE and BHE are LOW while CE and WE are active, the device performs full 16-bit read or write operations across I/O1–I/O16. The truth table confirms this as the "Write - All bits" and "Read - All bits" modes, with no timing penalty versus byte-only access.

Does CY7C1021BNV33L-12ZXCT support hot insertion or live swapping?

No. The device lacks hot-swap protection features such as power-on reset, I/O clamp diodes rated for insertion transients, or controlled slew-rate outputs. Applying VCC or signals before establishing proper grounding may cause latch-up or parametric shift. Board-level hot-swap circuitry must be implemented externally.

CY7C1021BNV33L-12ZXCT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
44-TSOP (0.400", 10.16mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
1Mbit
Memory Organization:
64K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
12ns
Access Time:
12 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
44-TSOP II

CY7C1021BNV33L-12ZXCT FAQ

1.How can I place an order for CY7C1021BNV33L-12ZXCT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1021BNV33L-12ZXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1021BNV33L-12ZXCT reliable?

The price and inventory of CY7C1021BNV33L-12ZXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1021BNV33L-12ZXCT is usually 5 days.

3.What payment methods are accepted for CY7C1021BNV33L-12ZXCT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1021BNV33L-12ZXCT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1021BNV33L-12ZXCT?

CY7C1021BNV33L-12ZXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1021BNV33L-12ZXCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1021BNV33L-12ZXCT?

For technical support, including CY7C1021BNV33L-12ZXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1021BNV33L-12ZXCT requirements.

6.How does Aetrix verify that CY7C1021BNV33L-12ZXCT is sourced from the original manufacturer or authorized distributors?

All CY7C1021BNV33L-12ZXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1021BNV33L-12ZXCT meets industry standards.

7.What is the process for return or replacement of CY7C1021BNV33L-12ZXCT?

All CY7C1021BNV33L-12ZXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1021BNV33L-12ZXCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1021BNV33L-12ZXCT part is unused and in its original packaging.

Return procedure for CY7C1021BNV33L-12ZXCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1021BNV33L-12ZXCT Tags

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