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Infineon Technologies CY7C1021BNV33L-15ZXC

Part No.:
CY7C1021BNV33L-15ZXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
44-TSOP (0.400", 10.16mm Width)
Datasheet:
AetrixCY7C1021BNV33L-15ZXC.pdf
Description:
IC SRAM 1MBIT PARALLEL 44TSOP II
Quantity:
Payment:
Payment
Shipping:
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Inventory:1,181

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Product details

Overview

CY7C1021BNV33L-15ZXC from Cypress Semiconductor is a 64K × 16-bit (1,048,576-bit) asynchronous CMOS static RAM operating at 3.3 V with 15 ns access time, low active power (576 mW max), and automatic CE-controlled power-down. It supports independent byte-wide write enable via BHE/BLE pins and is used in embedded controllers, network packet buffers, and industrial PLC data logging where deterministic timing and low standby current are critical.

For engineers reviewing the CY7C1021BNV33L-15ZXC datasheet, CY7C1021BNV33L-15ZXC pinout, CY7C1021BNV33L-15ZXC application, or CY7C1021BNV33L-15ZXC equivalent, this page provides verified package mapping (44-pin TSOP II), byte-select timing behavior, tAA/tRC/tPD values, VCC retention voltage (2.0 V), and real-world SRAM interface constraints for PCB layout and power budgeting.

Technical Context

This SRAM implements a full asynchronous interface with separate Byte High Enable (BHE) and Byte Low Enable (BLE) controls, enabling true 8-bit sub-word writes without read-modify-write cycles. Its dual-byte architecture allows concurrent access to upper and lower data bytes under independent address control.

The device uses standard TTL-compatible input thresholds (VIH = 2.2 V, VIL = 0.8 V) and delivers CMOS-level outputs (VOH ≥ 2.4 V, VOL ≤ 0.4 V) at 3.3 V supply. Power-down activation occurs automatically when CE is deasserted, reducing ICC to 500 µA (L version) with no external control required.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 64K × 16-bit (1 Mbit total); enables 16-bit data bus interfacing without external multiplexing
Access Time (tAA) 15 ns max; guarantees deterministic read latency for real-time firmware execution
VCC Operating Range 3.0 V to 3.6 V; compatible with standard 3.3 V LDOs and immune to 10% rail variation
Active Current (ICC) 140 mA max (commercial); defines peak power draw during burst reads/writes
Standby Current (ISB) 500 µA max (L version); enables >10-year battery-backed data retention in low-power modes
Data Retention Voltage 2.0 V min; allows operation down to brown-out threshold while preserving memory contents
Output Drive Strength IOH = –4 mA, IOL = 8 mA; sufficient to drive 10 cm of 50 Ω trace + 30 pF load without termination

Pinout & Package

Package: 44-pin TSOP Type II (10.16 mm × 18.42 mm, 0.8 mm pitch), RoHS-compliant, surface-mount.

Pin/Terminal Circuit Role Design Meaning
A0–A15 Address Inputs 16-bit address bus; selects one of 65,536 memory locations; no internal latching
I/O1–I/O8 Lower Data Bus Bi-directional 8-bit data path enabled only when BLE = LOW during read/write
I/O9–I/O16 Upper Data Bus Bi-directional 8-bit data path enabled only when BHE = LOW during read/write
CE Chip Enable Active-low global select; forces automatic power-down when HIGH (ISB = 500 µA)
OE Output Enable Active-low output gate; high-impedance state when HIGH, regardless of CE/WE state
WE Write Enable Active-low write strobe; initiates write cycle only when CE and WE both LOW
BLE / BHE Byte Enable Controls Independent active-low enables for lower/upper bytes; support partial-word writes without RMW
VCC / VSS Power / Ground Dual VCC (pins 16, 31) and dual VSS (pins 12, 29) reduce simultaneous switching noise

Key Features

Feature Design Value
Low-Power L-Version Architecture Reduces active power to 576 mW max and standby to 1.80 mW max-critical for thermally constrained enclosures
Independent Byte Write Control Eliminates need for external logic or firmware RMW sequences when updating 8-bit fields in 16-bit registers
Automatic CE Power-Down Zero-software-overhead transition to 500 µA standby on chip deselect-no mode register or command required
TSOP II & Mini BGA Packaging Options Enables migration between space-constrained (BGA) and serviceable (TSOP) board layouts using identical logic
Industrial Temperature Support Validated operation from –40°C to +85°C with no derating-suitable for outdoor telecom and factory automation

Applications

Industrial PLC Data Buffer Network Switch Packet Memory

Use Scenario: Storing transient sensor readings and control setpoints in programmable logic controllers deployed in manufacturing cells.

IC Role / Device Role / Timing Role: Asynchronous data buffer interfaced directly to microcontroller's external memory bus with no wait states.

Use Value: 15 ns tAA ensures deterministic response to interrupt-driven I/O updates; dual-byte write avoids corruption during partial register writes.

Use Scenario: Holding ingress/egress packet headers in Layer 2 Ethernet switches before forwarding decisions.

IC Role / Device Role / Timing Role: Standalone SRAM acting as first-in-first-out (FIFO) buffer between MAC and switch fabric interfaces.

Use Value: 500 µA ISB enables energy-efficient buffering during traffic lulls; 3.3 V compatibility matches PHY voltage domains.

Medical Imaging Frame Store Avionics Display Controller Cache

Use Scenario: Temporary storage of grayscale image frames captured by ultrasound transducers prior to DSP processing.

IC Role / Device Role / Timing Role: Burst-access memory mapped into ARM Cortex-M7's FSMC interface with synchronous read enable.

Use Value: Dual VCC/VSS pins suppress ground bounce during high-speed pixel transfers; tHZOE = 7 ns minimizes bus turnaround delay.

Use Scenario: Caching navigation map tiles and flight parameter overlays in certified cockpit display units.

IC Role / Device Role / Timing Role: Non-volatile cache holding safety-critical UI assets accessible within fixed timing windows.

Use Value: Data retention at 2.0 V VCC supports safe shutdown during power fault events; industrial temp rating meets DO-160E Section 22 requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar asynchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISSI IS61LV1024-15KLI Same 64K × 16 organization, 15 ns speed, but higher ISB (2 mA vs. 0.5 mA) and no BHE/BLE separation Lacks independent byte write control; requires external gating or RMW for partial writes Select when cost sensitivity outweighs byte-select flexibility and ultra-low standby is non-critical
ON Semiconductor MC1021V33L-15Z Pin-compatible TSOP II footprint, same 3.3 V/15 ns spec, but higher ICC (160 mA vs. 140 mA) and no data retention mode No VDR = 2.0 V specification; unsuitable for battery-backed retention use cases Select when legacy ON Semi supply chain alignment is required and retention is not needed

Compared with IS61LV1024-15KLI and MC1021V33L-15Z, CY7C1021BNV33L-15ZXC uniquely delivers byte-select write capability, 500 µA standby, and 2.0 V data retention-making it the only choice for energy-constrained, safety-aware, or partial-write-intensive designs.

Availability

CY7C1021BNV33L-15ZXC is available at Aetrix Electronics and suitable for industrial PLC data buffering, network packet memory, medical imaging frame stores, and avionics display controller caches requiring stable component supply across extended product lifecycles.

Supply support for CY7C1021BNV33L-15ZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable logic solutions for industrial, automotive, and communications systems.

The CY7C1021BNV series targets deterministic, low-power embedded memory applications requiring asynchronous access, byte granularity, and robust data retention-especially where firmware simplicity and thermal efficiency are prioritized over density scaling.

FAQ

What is the minimum VCC required to retain data in CY7C1021BNV33L-15ZXC?

The device guarantees data retention down to VCC = 2.0 V, as specified in the Data Retention Characteristics table. At this voltage, ICCDR is limited to 100 µA maximum, enabling multi-year retention on coin-cell backup. Operation below 2.0 V risks bit corruption; no functional operation is supported below 3.0 V.

Can CY7C1021BNV33L-15ZXC perform a write to only the upper byte without affecting the lower byte?

Yes. When BHE = LOW and BLE = HIGH, only I/O9–I/O16 are written; I/O1–I/O8 remain unchanged and high-impedance. This is confirmed by the Truth Table (Page 8) and Functional Description, which explicitly define independent byte write paths with no internal coupling or dependency.

Does the 15 ns access time apply to both read and write cycles?

No. The 15 ns value applies specifically to read access time (tAA and tACE). Write cycle time (tWC) is also 15 ns, but write setup/hold parameters differ: tAW = 10 ns, tSD = 8 ns, and tPWE = 10 ns. These values are distinct and must be met independently per the Switching Characteristics table (Page 4).

Is the 44-pin TSOP II package of CY7C1021BNV33L-15ZXC RoHS-compliant?

Yes. The "ZXC" suffix denotes lead-free (Pb-free) construction per the Ordering Information table (Page 8), and the package diagram references "51-85087 44-Lead TSOP Type II (Pb-free)". Cypress documentation confirms full compliance with EU RoHS Directive 2011/65/EU and JEDEC J-STD-609A Class 3 marking.

CY7C1021BNV33L-15ZXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
44-TSOP (0.400", 10.16mm Width)
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
1Mbit
Memory Organization:
64K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
15ns
Access Time:
15 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
44-TSOP II

CY7C1021BNV33L-15ZXC FAQ

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Please submit a Request for Quotation (RFQ) for CY7C1021BNV33L-15ZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1021BNV33L-15ZXC reliable?

The price and inventory of CY7C1021BNV33L-15ZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1021BNV33L-15ZXC is usually 5 days.

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CY7C1021BNV33L-15ZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1021BNV33L-15ZXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1021BNV33L-15ZXC?

For technical support, including CY7C1021BNV33L-15ZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1021BNV33L-15ZXC requirements.

6.How does Aetrix verify that CY7C1021BNV33L-15ZXC is sourced from the original manufacturer or authorized distributors?

All CY7C1021BNV33L-15ZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1021BNV33L-15ZXC meets industry standards.

7.What is the process for return or replacement of CY7C1021BNV33L-15ZXC?

All CY7C1021BNV33L-15ZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1021BNV33L-15ZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1021BNV33L-15ZXC part is unused and in its original packaging.

Return procedure for CY7C1021BNV33L-15ZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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