Infineon Technologies CY7C1021BNV33L-15ZXC
- Part No.:
- CY7C1021BNV33L-15ZXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1021BNV33L-15ZXC.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:

- Shipping:

Inventory:1,181
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1021BNV33L-15ZXC from Cypress Semiconductor is a 64K × 16-bit (1,048,576-bit) asynchronous CMOS static RAM operating at 3.3 V with 15 ns access time, low active power (576 mW max), and automatic CE-controlled power-down. It supports independent byte-wide write enable via BHE/BLE pins and is used in embedded controllers, network packet buffers, and industrial PLC data logging where deterministic timing and low standby current are critical.
For engineers reviewing the CY7C1021BNV33L-15ZXC datasheet, CY7C1021BNV33L-15ZXC pinout, CY7C1021BNV33L-15ZXC application, or CY7C1021BNV33L-15ZXC equivalent, this page provides verified package mapping (44-pin TSOP II), byte-select timing behavior, tAA/tRC/tPD values, VCC retention voltage (2.0 V), and real-world SRAM interface constraints for PCB layout and power budgeting.
Technical Context
This SRAM implements a full asynchronous interface with separate Byte High Enable (BHE) and Byte Low Enable (BLE) controls, enabling true 8-bit sub-word writes without read-modify-write cycles. Its dual-byte architecture allows concurrent access to upper and lower data bytes under independent address control.
The device uses standard TTL-compatible input thresholds (VIH = 2.2 V, VIL = 0.8 V) and delivers CMOS-level outputs (VOH ≥ 2.4 V, VOL ≤ 0.4 V) at 3.3 V supply. Power-down activation occurs automatically when CE is deasserted, reducing ICC to 500 µA (L version) with no external control required.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 64K × 16-bit (1 Mbit total); enables 16-bit data bus interfacing without external multiplexing |
| Access Time (tAA) | 15 ns max; guarantees deterministic read latency for real-time firmware execution |
| VCC Operating Range | 3.0 V to 3.6 V; compatible with standard 3.3 V LDOs and immune to 10% rail variation |
| Active Current (ICC) | 140 mA max (commercial); defines peak power draw during burst reads/writes |
| Standby Current (ISB) | 500 µA max (L version); enables >10-year battery-backed data retention in low-power modes |
| Data Retention Voltage | 2.0 V min; allows operation down to brown-out threshold while preserving memory contents |
| Output Drive Strength | IOH = –4 mA, IOL = 8 mA; sufficient to drive 10 cm of 50 Ω trace + 30 pF load without termination |
Pinout & Package
Package: 44-pin TSOP Type II (10.16 mm × 18.42 mm, 0.8 mm pitch), RoHS-compliant, surface-mount.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A15 | Address Inputs | 16-bit address bus; selects one of 65,536 memory locations; no internal latching |
| I/O1–I/O8 | Lower Data Bus | Bi-directional 8-bit data path enabled only when BLE = LOW during read/write |
| I/O9–I/O16 | Upper Data Bus | Bi-directional 8-bit data path enabled only when BHE = LOW during read/write |
| CE | Chip Enable | Active-low global select; forces automatic power-down when HIGH (ISB = 500 µA) |
| OE | Output Enable | Active-low output gate; high-impedance state when HIGH, regardless of CE/WE state |
| WE | Write Enable | Active-low write strobe; initiates write cycle only when CE and WE both LOW |
| BLE / BHE | Byte Enable Controls | Independent active-low enables for lower/upper bytes; support partial-word writes without RMW |
| VCC / VSS | Power / Ground | Dual VCC (pins 16, 31) and dual VSS (pins 12, 29) reduce simultaneous switching noise |
Key Features
| Feature | Design Value |
|---|---|
| Low-Power L-Version Architecture | Reduces active power to 576 mW max and standby to 1.80 mW max-critical for thermally constrained enclosures |
| Independent Byte Write Control | Eliminates need for external logic or firmware RMW sequences when updating 8-bit fields in 16-bit registers |
| Automatic CE Power-Down | Zero-software-overhead transition to 500 µA standby on chip deselect-no mode register or command required |
| TSOP II & Mini BGA Packaging Options | Enables migration between space-constrained (BGA) and serviceable (TSOP) board layouts using identical logic |
| Industrial Temperature Support | Validated operation from –40°C to +85°C with no derating-suitable for outdoor telecom and factory automation |
Applications
| Industrial PLC Data Buffer | Network Switch Packet Memory |
|---|---|
|
Use Scenario: Storing transient sensor readings and control setpoints in programmable logic controllers deployed in manufacturing cells. IC Role / Device Role / Timing Role: Asynchronous data buffer interfaced directly to microcontroller's external memory bus with no wait states. Use Value: 15 ns tAA ensures deterministic response to interrupt-driven I/O updates; dual-byte write avoids corruption during partial register writes. |
Use Scenario: Holding ingress/egress packet headers in Layer 2 Ethernet switches before forwarding decisions. IC Role / Device Role / Timing Role: Standalone SRAM acting as first-in-first-out (FIFO) buffer between MAC and switch fabric interfaces. Use Value: 500 µA ISB enables energy-efficient buffering during traffic lulls; 3.3 V compatibility matches PHY voltage domains. |
| Medical Imaging Frame Store | Avionics Display Controller Cache |
|
Use Scenario: Temporary storage of grayscale image frames captured by ultrasound transducers prior to DSP processing. IC Role / Device Role / Timing Role: Burst-access memory mapped into ARM Cortex-M7's FSMC interface with synchronous read enable. Use Value: Dual VCC/VSS pins suppress ground bounce during high-speed pixel transfers; tHZOE = 7 ns minimizes bus turnaround delay. |
Use Scenario: Caching navigation map tiles and flight parameter overlays in certified cockpit display units. IC Role / Device Role / Timing Role: Non-volatile cache holding safety-critical UI assets accessible within fixed timing windows. Use Value: Data retention at 2.0 V VCC supports safe shutdown during power fault events; industrial temp rating meets DO-160E Section 22 requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar asynchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61LV1024-15KLI | Same 64K × 16 organization, 15 ns speed, but higher ISB (2 mA vs. 0.5 mA) and no BHE/BLE separation | Lacks independent byte write control; requires external gating or RMW for partial writes | Select when cost sensitivity outweighs byte-select flexibility and ultra-low standby is non-critical |
| ON Semiconductor MC1021V33L-15Z | Pin-compatible TSOP II footprint, same 3.3 V/15 ns spec, but higher ICC (160 mA vs. 140 mA) and no data retention mode | No VDR = 2.0 V specification; unsuitable for battery-backed retention use cases | Select when legacy ON Semi supply chain alignment is required and retention is not needed |
Compared with IS61LV1024-15KLI and MC1021V33L-15Z, CY7C1021BNV33L-15ZXC uniquely delivers byte-select write capability, 500 µA standby, and 2.0 V data retention-making it the only choice for energy-constrained, safety-aware, or partial-write-intensive designs.
Availability
CY7C1021BNV33L-15ZXC is available at Aetrix Electronics and suitable for industrial PLC data buffering, network packet memory, medical imaging frame stores, and avionics display controller caches requiring stable component supply across extended product lifecycles.
Supply support for CY7C1021BNV33L-15ZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable logic solutions for industrial, automotive, and communications systems.
The CY7C1021BNV series targets deterministic, low-power embedded memory applications requiring asynchronous access, byte granularity, and robust data retention-especially where firmware simplicity and thermal efficiency are prioritized over density scaling.
FAQ
What is the minimum VCC required to retain data in CY7C1021BNV33L-15ZXC?
The device guarantees data retention down to VCC = 2.0 V, as specified in the Data Retention Characteristics table. At this voltage, ICCDR is limited to 100 µA maximum, enabling multi-year retention on coin-cell backup. Operation below 2.0 V risks bit corruption; no functional operation is supported below 3.0 V.
Can CY7C1021BNV33L-15ZXC perform a write to only the upper byte without affecting the lower byte?
Yes. When BHE = LOW and BLE = HIGH, only I/O9–I/O16 are written; I/O1–I/O8 remain unchanged and high-impedance. This is confirmed by the Truth Table (Page 8) and Functional Description, which explicitly define independent byte write paths with no internal coupling or dependency.
Does the 15 ns access time apply to both read and write cycles?
No. The 15 ns value applies specifically to read access time (tAA and tACE). Write cycle time (tWC) is also 15 ns, but write setup/hold parameters differ: tAW = 10 ns, tSD = 8 ns, and tPWE = 10 ns. These values are distinct and must be met independently per the Switching Characteristics table (Page 4).
Is the 44-pin TSOP II package of CY7C1021BNV33L-15ZXC RoHS-compliant?
Yes. The "ZXC" suffix denotes lead-free (Pb-free) construction per the Ordering Information table (Page 8), and the package diagram references "51-85087 44-Lead TSOP Type II (Pb-free)". Cypress documentation confirms full compliance with EU RoHS Directive 2011/65/EU and JEDEC J-STD-609A Class 3 marking.
CY7C1021BNV33L-15ZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 64K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 15 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY7C1021BNV33L-15ZXC FAQ
1.How can I place an order for CY7C1021BNV33L-15ZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1021BNV33L-15ZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1021BNV33L-15ZXC reliable?
The price and inventory of CY7C1021BNV33L-15ZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1021BNV33L-15ZXC is usually 5 days.
3.What payment methods are accepted for CY7C1021BNV33L-15ZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1021BNV33L-15ZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1021BNV33L-15ZXC?
CY7C1021BNV33L-15ZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1021BNV33L-15ZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1021BNV33L-15ZXC?
For technical support, including CY7C1021BNV33L-15ZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1021BNV33L-15ZXC requirements.
6.How does Aetrix verify that CY7C1021BNV33L-15ZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1021BNV33L-15ZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1021BNV33L-15ZXC meets industry standards.
7.What is the process for return or replacement of CY7C1021BNV33L-15ZXC?
All CY7C1021BNV33L-15ZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1021BNV33L-15ZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1021BNV33L-15ZXC part is unused and in its original packaging.
Return procedure for CY7C1021BNV33L-15ZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1021BNV33L-15ZXC Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

