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Infineon Technologies CY7C1021CV26-15VXE

Part No.:
CY7C1021CV26-15VXE
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
44-BSOJ (0.400", 10.16mm Width)
Datasheet:
AetrixCY7C1021CV26-15VXE.pdf
Description:
IC SRAM 1MBIT PARALLEL 44SOJ
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,368

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Product details

Overview

CY7C1021CV26-15VXE from Cypress Semiconductor is a 1-Mbit (64 K × 16) high-speed CMOS static RAM with 15 ns access time, 2.5–2.7 V supply operation, and automotive-grade temperature range (–40 °C to +125 °C). It supports independent byte write control via BHE/ BLE pins and features automatic CE-controlled power-down for low standby current (10 mA max).

For engineers reviewing the CY7C1021CV26-15VXE datasheet, CY7C1021CV26-15VXE pinout, CY7C1021CV26-15VXE application, or CY7C1021CV26-15VXE equivalent, key selection criteria include tAA = 15 ns read timing, dual-byte enable architecture, TSOP II package compatibility, and automotive-grade thermal reliability.

Technical Context

This SRAM implements a 65,536 × 16-bit memory array with fully decoded address inputs (A0–A15), bidirectional I/O1–I/O16 data bus, and TTL/CMOS-compatible control logic. Its read/write cycle timing is defined by overlapping CE, WE, OE, BHE, and BLE signals - with CE LOW enabling chip selection and WE LOW initiating writes.

The device uses separate byte enables (BHE for I/O9–I/O16, BLE for I/O1–I/O8) to support 8-bit sub-word writes without affecting adjacent bytes. Power management relies on automatic CE-driven transition into low-power ISB2 mode (≤10 mA) when CE is deasserted HIGH under CMOS input conditions.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 64 K × 16 bits (1,048,576 total bits); supports full 16-bit parallel access or independent 8-bit byte writes.
Access Time (tAA) 15 ns maximum; ensures deterministic data valid window for high-speed microcontroller or FPGA interface timing budgets.
Supply Voltage Range 2.5 V to 2.7 V only; optimized for low-voltage automotive and industrial systems with tight regulation requirements.
Operating Temperature –40 °C to +125 °C; qualified for under-hood and engine-control module deployment without derating.
Active Current (ICC) 80 mA maximum at fMAX; enables predictable power budgeting in real-time control subsystems.
Standby Current (ISB2) 10 mA maximum with CE HIGH and CMOS-level inputs; reduces quiescent draw during idle states in battery-sensitive applications.
I/O Pin Count 16 bidirectional data lines (I/O1–I/O16) plus 16 address lines (A0–A15), supporting direct connection to 16-bit bus architectures.

Pinout & Package

Package: 44-pin TSOP II (400-mil width), surface-mount, lead-free compliant. Pin pitch: 0.8 mm. Body dimensions: 18.4 mm × 10.16 mm × 1.2 mm.

Pin/Terminal Circuit Role Design Meaning
A0–A15 Address Input 16-bit address bus; selects one of 65,536 memory locations; compatible with standard microprocessor address decoding.
I/O1–I/O8 Bidirectional Data (Lower Byte) Data path for lower 8 bits; enabled only when BLE = LOW; tri-stated otherwise.
I/O9–I/O16 Bidirectional Data (Upper Byte) Data path for upper 8 bits; enabled only when BHE = LOW; isolated from lower byte during partial writes.
CE Chip Enable (active LOW) Primary chip select; asserts internal logic and enables power-up; triggers automatic ISB2 power-down when HIGH.
WE Write Enable (active LOW) Controls write initiation; must be LOW with CE LOW and BHE/ BLE LOW to store data; HIGH enables read mode.
OE Output Enable (active LOW) Enables output drivers on I/O pins during reads; forces high-impedance state when HIGH to prevent bus contention.
BLE Byte Low Enable (active LOW) Selects I/O1–I/O8 for write/read; allows 8-bit access without disturbing upper byte contents.
BHE Byte High Enable (active LOW) Selects I/O9–I/O16 for write/read; enables independent upper-byte manipulation in mixed-width systems.
VCC Power Supply Two dedicated 2.5–2.7 V supply pins (pins 11 & 33); decoupling required per JEDEC TSOP layout guidelines.
VSS Ground Two ground pins (pins 12 & 34); provides low-inductance return path for I/O and core logic switching currents.
NC No Connect Pins 22, 23, 28 are unconnected internally; must remain floating or tied to GND per board design rules.

Key Features

Feature Design Value
Dual-byte write control Independent BHE/BLE pins enable selective 8-bit writes to upper or lower byte without read-modify-write overhead.
Automated CE power-down Reduces ICC to ≤10 mA when CE is HIGH and inputs meet CMOS thresholds - no external logic needed.
15 ns access time at 2.6 V Meets timing closure for 66 MHz bus interfaces with margin; validated across full automotive temperature range.
TSOP II footprint compatibility 44-pin 400-mil package matches industry-standard layout; supports drop-in replacement in legacy SRAM designs.
Automotive qualification Qualified per AEC-Q100 Grade 1 (–40 °C to +125 °C); includes HTOL, ESD, and thermal cycling validation.

Applications

Engine Control Unit (ECU) Advanced Driver Assistance Systems (ADAS)

Use Scenario: Real-time storage of sensor fusion buffers and actuator command histories in closed-loop engine timing control.

IC Role / Device Role / Timing Role: High-reliability, low-latency scratchpad memory interfaced directly to 16-bit MCU bus with deterministic 15 ns read timing.

Use Value: Enables zero-wait-state execution of safety-critical control algorithms while maintaining ASIL-B compliance through guaranteed timing and thermal stability.

Use Scenario: Frame buffering for radar pre-processing units requiring burst-mode data capture at >50 MB/s sustained bandwidth.

IC Role / Device Role / Timing Role: Dual-byte-access SRAM providing simultaneous 8-bit read/write to separate processing pipelines (e.g., Doppler vs. range FFT engines).

Use Value: Eliminates bus arbitration delays via independent BHE/BLE control, reducing latency jitter in time-synchronized multi-sensor fusion.

Industrial PLC I/O Module Infotainment Head Unit Display Cache

Use Scenario: Storing configuration registers and real-time I/O status maps in modular programmable logic controllers operating in harsh factory environments.

IC Role / Device Role / Timing Role: Automotive-grade SRAM serving as nonvolatile shadow RAM for fast register access, powered from isolated 2.6 V rail.

Use Value: Maintains functional integrity across –40 °C to +125 °C ambient swings without refresh or voltage scaling compensation.

Use Scenario: Pixel line buffer for LCD controller driving 1280×720 displays in automotive infotainment systems with dynamic UI updates.

IC Role / Device Role / Timing Role: High-speed 16-bit parallel SRAM acting as frame buffer intermediary between GPU and display timing controller.

Use Value: Supports 60 Hz refresh with 15 ns tAA and low-output-impedance drivers to minimize signal integrity degradation over 8 cm PCB traces.

Equivalent & Alternatives

The following parts are listed as comparable options for similar static RAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61LV102416-15TQLI 15 ns access, 2.7–3.6 V supply range; no BHE/ BLE byte control; 48-pin TQFP package. Requires external gating logic for byte writes; unsuitable for automotive thermal range without derating. Select only if system uses 3.3 V rails and does not require independent byte write capability.
AS6C1008-15TIN 15 ns access, 2.7–3.6 V supply; single-byte enable (UB/LB); 44-pin SOJ package; commercial temp range only (0–70 °C). Lacks automotive qualification and dual-byte isolation; higher standby current (25 mA typical). Acceptable for cost-sensitive consumer electronics where extended temperature operation is not required.

Compared with IS61LV102416-15TQLI and AS6C1008-15TIN, CY7C1021CV26-15VXE uniquely delivers automotive-grade reliability, true dual-byte write independence, and strict 2.5–2.7 V operation - critical for safety-critical embedded systems with constrained power domains.

Availability

CY7C1021CV26-15VXE is available at Aetrix Electronics and suitable for engine control units, ADAS radar processors, industrial PLC modules, and automotive infotainment display subsystems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for CY7C1021CV26-15VXE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for automotive, industrial, and IoT applications, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q200 standards.

CY7C1021CV26 belongs to Cypress's automotive-qualified parallel SRAM product line, engineered specifically for deterministic timing, low-voltage operation, and robustness in safety-critical electronic control units.

FAQ

Is CY7C1021CV26-15VXE pin-compatible with CY7C1021DV26-15VXI?

No. CY7C1021CV26-15VXE uses a 44-pin TSOP II package with specific pin assignments for BHE/BLE and dual VCC/VSS pairs. CY7C1021DV26-15VXI is a 48-ball FPBGA variant with different pinout, ball map, and thermal characteristics - not mechanically or electrically interchangeable without PCB redesign.

Does this SRAM require an external clock or refresh circuitry?

No. CY7C1021CV26-15VXE is a static RAM and operates asynchronously - it has no clock input and requires no refresh cycles. Data retention is maintained as long as VCC remains within 2.5–2.7 V and CE is held HIGH during standby.

Can BHE and BLE be asserted simultaneously for full 16-bit access?

Yes. When both BHE and BLE are LOW, all 16 I/O lines (I/O1–I/O16) are enabled for concurrent read or write operations. This mode supports standard 16-bit bus transactions without software byte masking or splitting.

What is the maximum supported bus frequency when using OE-controlled read cycles?

With tDOE = 7 ns and tHZOE = 7 ns, the minimum OE-controlled read cycle time is 15 ns, supporting up to 66.7 MHz sustained bus throughput. System-level timing must account for PCB trace delays and load capacitance to maintain setup/hold margins.

CY7C1021CV26-15VXE Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
44-BSOJ (0.400", 10.16mm Width)
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
1Mbit
Memory Organization:
64K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
15ns
Access Time:
15 ns
Voltage - Supply:
2.5V ~ 2.7V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
44-SOJ

CY7C1021CV26-15VXE FAQ

1.How can I place an order for CY7C1021CV26-15VXE through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1021CV26-15VXE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1021CV26-15VXE reliable?

The price and inventory of CY7C1021CV26-15VXE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1021CV26-15VXE is usually 5 days.

3.What payment methods are accepted for CY7C1021CV26-15VXE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1021CV26-15VXE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1021CV26-15VXE?

CY7C1021CV26-15VXE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1021CV26-15VXE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1021CV26-15VXE?

For technical support, including CY7C1021CV26-15VXE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1021CV26-15VXE requirements.

6.How does Aetrix verify that CY7C1021CV26-15VXE is sourced from the original manufacturer or authorized distributors?

All CY7C1021CV26-15VXE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1021CV26-15VXE meets industry standards.

7.What is the process for return or replacement of CY7C1021CV26-15VXE?

All CY7C1021CV26-15VXE units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1021CV26-15VXE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1021CV26-15VXE part is unused and in its original packaging.

Return procedure for CY7C1021CV26-15VXE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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