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Infineon Technologies CY7C1021CV33-10VC

Part No.:
CY7C1021CV33-10VC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
44-BSOJ (0.400", 10.16mm Width)
Datasheet:
AetrixCY7C1021CV33-10VC.pdf
Description:
IC SRAM 1MBIT PARALLEL 44SOJ
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,593

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Product details

Overview

CY7C1021CV33-10VC from Cypress Semiconductor is a 64K × 16-bit (1,048,576-bit) asynchronous CMOS static RAM with 10 ns maximum access time, 3.3 V supply, and independent byte-wide write control via BHE/BLE. It features automatic CE-controlled power-down (ISB2 = 5 mA), TTL/CMOS-compatible inputs, and operates across commercial temperature range (0°C to +70°C). Used in legacy embedded controllers, FPGA configuration buffers, and industrial data acquisition systems requiring deterministic low-latency memory access.

For engineers reviewing the CY7C1021CV33-10VC datasheet, CY7C1021CV33-10VC pinout, CY7C1021CV33-10VC application, or CY7C1021CV33-10VC equivalent, key selection criteria include tAA = 10 ns read timing, dual-byte enable architecture, SOJ/TSOP II package compatibility, and 3.3 V-only operation without 5 V tolerance.

Technical Context

The device implements a fully asynchronous SRAM core with separate address decoding for 16-bit words across 65,536 locations. Read and write operations are controlled by three independent enables: CE (chip select), OE (output enable), and WE (write enable), with byte-level granularity provided by BLE (I/O1–I/O8) and BHE (I/O9–I/O16).

Power management is hardware-automated: when CE is HIGH, the device enters ISB2 standby mode drawing only 5 mA at VCC max, regardless of OE/WE state. Input thresholds meet 3.3 V CMOS levels (VIH ≥ 2.0 V, VIL ≤ 0.8 V), and output drive complies with –4 mA VOH and 8 mA VOL specifications under load.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 64K × 16-bit (1 Mbit total); supports full-word or half-word (8-bit) accesses independently
Access Time (tAA) 10 ns max; guarantees data valid within 10 ns after address stabilization under worst-case VCC/temp
Supply Voltage 3.3 V ±10% (3.0 V to 3.6 V); no 5 V tolerance - requires dedicated 3.3 V rail
Active Current (ICC) 90 mA max at fMAX = 100 MHz; defines peak dynamic power during continuous read/write cycling
Standby Current (ISB2) 5 mA max with CE > VCC – 0.3 V; enables ultra-low-power retention in deselected state
Input/Output Voltage Levels VIH ≥ 2.0 V, VIL ≤ 0.8 V; compatible with 3.3 V LVTTL and CMOS logic families
Byte Enable Logic BLE and BHE active-Low; allows simultaneous or independent lower/upper byte writes without bus contention

Pinout & Package

Package: 44-pin TSOP II (400-mil wide), RoHS-compliant, surface-mount. Pin pitch: 0.8 mm. Body dimensions: 12.0 mm × 20.0 mm × 1.2 mm.

Pin/Terminal Circuit Role Design Meaning
A0–A15 Address Inputs 16-bit address bus; selects one of 65,536 memory locations; latched on CE transition
I/O1–I/O8 Data I/O (Lower Byte) Bi-directional 8-bit data path enabled only when BLE = LOW and CE = LOW
I/O9–I/O16 Data I/O (Upper Byte) Bi-directional 8-bit data path enabled only when BHE = LOW and CE = LOW
CE Chip Enable Active-Low master select; disables outputs and triggers automatic power-down when HIGH
OE Output Enable Active-Low read control; must be LOW with CE LOW and WE HIGH to place data on I/O pins
WE Write Enable Active-Low write strobe; initiates write when CE and WE both LOW; controls data latch timing
BLE Byte Low Enable Active-Low control for I/O1–I/O8; enables lower-byte write/read independent of upper byte
BHE Byte High Enable Active-Low control for I/O9–I/O16; enables upper-byte write/read independent of lower byte
VCC Power Supply 3.3 V primary supply; two dedicated pins (pins 16 & 37) reduce IR drop and noise coupling
VSS Ground Signal ground reference; two dedicated pins (pins 11 & 27) improve noise immunity and EMI performance

Key Features

Feature Design Value
Independent byte write control Enables partial-word updates without read-modify-write cycles - reduces bus traffic and latency in microcontroller interfaces
Automatic CE power-down Reduces standby current to 5 mA without external logic or software intervention - critical for battery-backed systems
10 ns access time at 3.3 V Supports direct interface to 80–100 MHz microcontrollers and FPGAs without wait states
SOJ/TSOP II and FBGA packaging Enables migration between through-hole prototyping (SOJ) and high-density SMT production (TSOP II/FBGA)
TTL/CMOS input compatibility Accepts 3.3 V logic thresholds without level shifters - simplifies integration with mixed-voltage designs

Applications

Industrial PLC Data Buffers FPGA Configuration Storage

Use Scenario: Storing real-time I/O status and register values in programmable logic controllers with deterministic scan cycles.

IC Role / Device Role / Timing Role: Asynchronous data buffer providing sub-10 ns read access to support 10 kHz I/O update rates.

Use Value: Eliminates wait-state insertion in ARM9-based PLC CPUs, maintaining cycle consistency under varying load conditions.

Use Scenario: Holding configuration bitstreams for Xilinx Spartan-3 and Altera Cyclone FPGAs during power-up and reconfiguration.

IC Role / Device Role / Timing Role: Non-volatile shadow RAM (paired with EEPROM) delivering parallel 16-bit configuration words at startup.

Use Value: Enables <100 ms FPGA initialization time by supporting burst-mode reads at full 10 ns speed.

Legacy Embedded Controller Memory Medical Instrument Data Logging

Use Scenario: Extending on-chip RAM in TI C2000 DSPs and NXP ColdFire MCUs for real-time FFT buffers and PID coefficient tables.

IC Role / Device Role / Timing Role: External program/data memory mapped into CPU address space using standard AS interface.

Use Value: Provides deterministic 10 ns access latency required for 50 µs control loop execution in motor drives.

Use Scenario: Capturing high-resolution analog sensor streams (ECG, EEG) in portable diagnostic devices with intermittent power.

IC Role / Device Role / Timing Role: Battery-backed SRAM holding up to 64 KB of timestamped waveform data before SD card transfer.

Use Value: Maintains data integrity during brown-out events via 2.0 V data retention capability and 5 mA standby draw.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed 3.3 V SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISSI IS61LV102416-10ML Same 64K × 16 organization, 10 ns tAA, but uses single BE pin instead of dual BHE/BLE; higher ISB = 15 mA Lacks independent byte write - requires full-word writes or external gating logic for partial updates Select when board layout prioritizes pin count reduction over byte-granular write flexibility
ON Semiconductor MC1021C-10L Functionally identical pinout and timing, but rated for industrial temp (–40°C to +85°C); ISB2 = 5 mA unchanged Valid for extended temperature deployments where CY7C1021CV33-10VC's commercial grade (0°C to +70°C) is insufficient Select when operating environment exceeds commercial temperature range and pin compatibility is mandatory

Compared with IS61LV102416-10ML and MC1021C-10L, the CY7C1021CV33-10VC uniquely delivers dual-byte enable control in a commercial-grade TSOP II package while matching 10 ns timing and 5 mA standby - making it optimal for cost-sensitive, space-constrained embedded systems requiring precise memory access granularity.

Availability

CY7C1021CV33-10VC is available at Aetrix Electronics and suitable for industrial PLC data buffers, FPGA configuration storage, and legacy embedded controller memory requiring stable component supply and long-term obsolescence management.

Supply support for CY7C1021CV33-10VC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in memory, microcontrollers, and programmable systems-on-chip for industrial, automotive, and consumer applications.

The CY7C1021CV33 belongs to Cypress's legacy high-speed CMOS SRAM product line, designed specifically for deterministic, low-latency memory expansion in resource-constrained embedded systems with strict timing budgets.

FAQ

Is CY7C1021CV33-10VC compatible with 5 V logic interfaces?

No. The device operates exclusively at 3.3 V (3.0–3.6 V) and has no 5 V tolerance on inputs or outputs. Connecting to 5 V logic without level translation will exceed absolute maximum ratings and risk permanent damage. Interface requires dedicated 3.3 V logic families or bidirectional voltage translators such as TXB0104.

What happens to data during power-down mode?

Data is retained as long as VCC remains ≥ 2.0 V, per the datasheet's "Data retention at 2.0V" specification. In automatic CE power-down (ISB2 mode), the internal memory array remains powered and functional - only peripheral circuitry is gated. No external backup battery is needed for short-term retention.

Can BLE and BHE be asserted simultaneously for full 16-bit operation?

Yes. When both BLE and BHE are LOW with CE LOW and WE LOW, all 16 I/O pins (I/O1–I/O16) participate in the same write cycle. Similarly, during read, asserting both enables full-word output. This behavior is explicitly defined in the Truth Table on page 12 of the datasheet.

Does CY7C1021CV33-10VC support asynchronous burst reads?

No. It is a strictly asynchronous SRAM with no internal address counter or burst logic. Each read requires a new address assertion on A0–A15. Burst transfers must be implemented externally via controller logic or DMA with sequential address generation - the device itself performs only single-location access per CE/OE cycle.

CY7C1021CV33-10VC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
44-BSOJ (0.400", 10.16mm Width)
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
1Mbit
Memory Organization:
64K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
44-SOJ

CY7C1021CV33-10VC FAQ

1.How can I place an order for CY7C1021CV33-10VC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1021CV33-10VC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1021CV33-10VC reliable?

The price and inventory of CY7C1021CV33-10VC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1021CV33-10VC is usually 5 days.

3.What payment methods are accepted for CY7C1021CV33-10VC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1021CV33-10VC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1021CV33-10VC?

CY7C1021CV33-10VC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1021CV33-10VC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1021CV33-10VC?

For technical support, including CY7C1021CV33-10VC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1021CV33-10VC requirements.

6.How does Aetrix verify that CY7C1021CV33-10VC is sourced from the original manufacturer or authorized distributors?

All CY7C1021CV33-10VC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1021CV33-10VC meets industry standards.

7.What is the process for return or replacement of CY7C1021CV33-10VC?

All CY7C1021CV33-10VC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1021CV33-10VC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1021CV33-10VC part is unused and in its original packaging.

Return procedure for CY7C1021CV33-10VC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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