Infineon Technologies CY7C1021CV33-10VC
- Part No.:
- CY7C1021CV33-10VC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-BSOJ (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1021CV33-10VC.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 44SOJ
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1021CV33-10VC from Cypress Semiconductor is a 64K × 16-bit (1,048,576-bit) asynchronous CMOS static RAM with 10 ns maximum access time, 3.3 V supply, and independent byte-wide write control via BHE/BLE. It features automatic CE-controlled power-down (ISB2 = 5 mA), TTL/CMOS-compatible inputs, and operates across commercial temperature range (0°C to +70°C). Used in legacy embedded controllers, FPGA configuration buffers, and industrial data acquisition systems requiring deterministic low-latency memory access.
For engineers reviewing the CY7C1021CV33-10VC datasheet, CY7C1021CV33-10VC pinout, CY7C1021CV33-10VC application, or CY7C1021CV33-10VC equivalent, key selection criteria include tAA = 10 ns read timing, dual-byte enable architecture, SOJ/TSOP II package compatibility, and 3.3 V-only operation without 5 V tolerance.
Technical Context
The device implements a fully asynchronous SRAM core with separate address decoding for 16-bit words across 65,536 locations. Read and write operations are controlled by three independent enables: CE (chip select), OE (output enable), and WE (write enable), with byte-level granularity provided by BLE (I/O1–I/O8) and BHE (I/O9–I/O16).
Power management is hardware-automated: when CE is HIGH, the device enters ISB2 standby mode drawing only 5 mA at VCC max, regardless of OE/WE state. Input thresholds meet 3.3 V CMOS levels (VIH ≥ 2.0 V, VIL ≤ 0.8 V), and output drive complies with –4 mA VOH and 8 mA VOL specifications under load.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 64K × 16-bit (1 Mbit total); supports full-word or half-word (8-bit) accesses independently |
| Access Time (tAA) | 10 ns max; guarantees data valid within 10 ns after address stabilization under worst-case VCC/temp |
| Supply Voltage | 3.3 V ±10% (3.0 V to 3.6 V); no 5 V tolerance - requires dedicated 3.3 V rail |
| Active Current (ICC) | 90 mA max at fMAX = 100 MHz; defines peak dynamic power during continuous read/write cycling |
| Standby Current (ISB2) | 5 mA max with CE > VCC – 0.3 V; enables ultra-low-power retention in deselected state |
| Input/Output Voltage Levels | VIH ≥ 2.0 V, VIL ≤ 0.8 V; compatible with 3.3 V LVTTL and CMOS logic families |
| Byte Enable Logic | BLE and BHE active-Low; allows simultaneous or independent lower/upper byte writes without bus contention |
Pinout & Package
Package: 44-pin TSOP II (400-mil wide), RoHS-compliant, surface-mount. Pin pitch: 0.8 mm. Body dimensions: 12.0 mm × 20.0 mm × 1.2 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A15 | Address Inputs | 16-bit address bus; selects one of 65,536 memory locations; latched on CE transition |
| I/O1–I/O8 | Data I/O (Lower Byte) | Bi-directional 8-bit data path enabled only when BLE = LOW and CE = LOW |
| I/O9–I/O16 | Data I/O (Upper Byte) | Bi-directional 8-bit data path enabled only when BHE = LOW and CE = LOW |
| CE | Chip Enable | Active-Low master select; disables outputs and triggers automatic power-down when HIGH |
| OE | Output Enable | Active-Low read control; must be LOW with CE LOW and WE HIGH to place data on I/O pins |
| WE | Write Enable | Active-Low write strobe; initiates write when CE and WE both LOW; controls data latch timing |
| BLE | Byte Low Enable | Active-Low control for I/O1–I/O8; enables lower-byte write/read independent of upper byte |
| BHE | Byte High Enable | Active-Low control for I/O9–I/O16; enables upper-byte write/read independent of lower byte |
| VCC | Power Supply | 3.3 V primary supply; two dedicated pins (pins 16 & 37) reduce IR drop and noise coupling |
| VSS | Ground | Signal ground reference; two dedicated pins (pins 11 & 27) improve noise immunity and EMI performance |
Key Features
| Feature | Design Value |
|---|---|
| Independent byte write control | Enables partial-word updates without read-modify-write cycles - reduces bus traffic and latency in microcontroller interfaces |
| Automatic CE power-down | Reduces standby current to 5 mA without external logic or software intervention - critical for battery-backed systems |
| 10 ns access time at 3.3 V | Supports direct interface to 80–100 MHz microcontrollers and FPGAs without wait states |
| SOJ/TSOP II and FBGA packaging | Enables migration between through-hole prototyping (SOJ) and high-density SMT production (TSOP II/FBGA) |
| TTL/CMOS input compatibility | Accepts 3.3 V logic thresholds without level shifters - simplifies integration with mixed-voltage designs |
Applications
| Industrial PLC Data Buffers | FPGA Configuration Storage |
|---|---|
Use Scenario: Storing real-time I/O status and register values in programmable logic controllers with deterministic scan cycles. IC Role / Device Role / Timing Role: Asynchronous data buffer providing sub-10 ns read access to support 10 kHz I/O update rates. Use Value: Eliminates wait-state insertion in ARM9-based PLC CPUs, maintaining cycle consistency under varying load conditions. |
Use Scenario: Holding configuration bitstreams for Xilinx Spartan-3 and Altera Cyclone FPGAs during power-up and reconfiguration. IC Role / Device Role / Timing Role: Non-volatile shadow RAM (paired with EEPROM) delivering parallel 16-bit configuration words at startup. Use Value: Enables <100 ms FPGA initialization time by supporting burst-mode reads at full 10 ns speed. |
| Legacy Embedded Controller Memory | Medical Instrument Data Logging |
Use Scenario: Extending on-chip RAM in TI C2000 DSPs and NXP ColdFire MCUs for real-time FFT buffers and PID coefficient tables. IC Role / Device Role / Timing Role: External program/data memory mapped into CPU address space using standard AS interface. Use Value: Provides deterministic 10 ns access latency required for 50 µs control loop execution in motor drives. |
Use Scenario: Capturing high-resolution analog sensor streams (ECG, EEG) in portable diagnostic devices with intermittent power. IC Role / Device Role / Timing Role: Battery-backed SRAM holding up to 64 KB of timestamped waveform data before SD card transfer. Use Value: Maintains data integrity during brown-out events via 2.0 V data retention capability and 5 mA standby draw. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed 3.3 V SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61LV102416-10ML | Same 64K × 16 organization, 10 ns tAA, but uses single BE pin instead of dual BHE/BLE; higher ISB = 15 mA | Lacks independent byte write - requires full-word writes or external gating logic for partial updates | Select when board layout prioritizes pin count reduction over byte-granular write flexibility |
| ON Semiconductor MC1021C-10L | Functionally identical pinout and timing, but rated for industrial temp (–40°C to +85°C); ISB2 = 5 mA unchanged | Valid for extended temperature deployments where CY7C1021CV33-10VC's commercial grade (0°C to +70°C) is insufficient | Select when operating environment exceeds commercial temperature range and pin compatibility is mandatory |
Compared with IS61LV102416-10ML and MC1021C-10L, the CY7C1021CV33-10VC uniquely delivers dual-byte enable control in a commercial-grade TSOP II package while matching 10 ns timing and 5 mA standby - making it optimal for cost-sensitive, space-constrained embedded systems requiring precise memory access granularity.
Availability
CY7C1021CV33-10VC is available at Aetrix Electronics and suitable for industrial PLC data buffers, FPGA configuration storage, and legacy embedded controller memory requiring stable component supply and long-term obsolescence management.
Supply support for CY7C1021CV33-10VC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in memory, microcontrollers, and programmable systems-on-chip for industrial, automotive, and consumer applications.
The CY7C1021CV33 belongs to Cypress's legacy high-speed CMOS SRAM product line, designed specifically for deterministic, low-latency memory expansion in resource-constrained embedded systems with strict timing budgets.
FAQ
Is CY7C1021CV33-10VC compatible with 5 V logic interfaces?
No. The device operates exclusively at 3.3 V (3.0–3.6 V) and has no 5 V tolerance on inputs or outputs. Connecting to 5 V logic without level translation will exceed absolute maximum ratings and risk permanent damage. Interface requires dedicated 3.3 V logic families or bidirectional voltage translators such as TXB0104.
What happens to data during power-down mode?
Data is retained as long as VCC remains ≥ 2.0 V, per the datasheet's "Data retention at 2.0V" specification. In automatic CE power-down (ISB2 mode), the internal memory array remains powered and functional - only peripheral circuitry is gated. No external backup battery is needed for short-term retention.
Can BLE and BHE be asserted simultaneously for full 16-bit operation?
Yes. When both BLE and BHE are LOW with CE LOW and WE LOW, all 16 I/O pins (I/O1–I/O16) participate in the same write cycle. Similarly, during read, asserting both enables full-word output. This behavior is explicitly defined in the Truth Table on page 12 of the datasheet.
Does CY7C1021CV33-10VC support asynchronous burst reads?
No. It is a strictly asynchronous SRAM with no internal address counter or burst logic. Each read requires a new address assertion on A0–A15. Burst transfers must be implemented externally via controller logic or DMA with sequential address generation - the device itself performs only single-location access per CE/OE cycle.
CY7C1021CV33-10VC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 44-BSOJ (0.400", 10.16mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 64K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-SOJ
CY7C1021CV33-10VC FAQ
1.How can I place an order for CY7C1021CV33-10VC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1021CV33-10VC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1021CV33-10VC reliable?
The price and inventory of CY7C1021CV33-10VC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1021CV33-10VC is usually 5 days.
3.What payment methods are accepted for CY7C1021CV33-10VC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1021CV33-10VC transactions.
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CY7C1021CV33-10VC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1021CV33-10VC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1021CV33-10VC?
For technical support, including CY7C1021CV33-10VC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1021CV33-10VC requirements.
6.How does Aetrix verify that CY7C1021CV33-10VC is sourced from the original manufacturer or authorized distributors?
All CY7C1021CV33-10VC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1021CV33-10VC meets industry standards.
7.What is the process for return or replacement of CY7C1021CV33-10VC?
All CY7C1021CV33-10VC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1021CV33-10VC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1021CV33-10VC part is unused and in its original packaging.
Return procedure for CY7C1021CV33-10VC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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