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Infineon Technologies CY7C1021CV33-10ZXCT
- Part No.:
- CY7C1021CV33-10ZXCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1021CV33-10ZXCT.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:
- Shipping:
Inventory:4,431
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Product details
Overview
CY7C1021CV33-10ZXCT from Cypress Semiconductor is a 1-Mbit (64K × 16) high-speed CMOS static RAM with 10 ns access time at industrial temperature (–40°C to +85°C), 3.3 V supply, automatic CE-controlled power-down, and independent byte write enable (BHE/BLE) for 16-bit data bus partitioning. It operates in 44-pin TSOP II package and supports embedded control memory, boot code storage, and real-time buffer applications.
For engineers reviewing the CY7C1021CV33-10ZXCT datasheet, CY7C1021CV33-10ZXCT pinout, CY7C1021CV33-10ZXCT application, or CY7C1021CV33-10ZXCT equivalent, key selection criteria include tAA = 10 ns timing, dual-byte write control, CMOS-compatible 3.3 V I/O, low active power (≤325 mW), and industrial-grade thermal performance (ΘJA = 76.92°C/W).
Technical Context
The device implements a synchronous, non-volatile-independent SRAM architecture with full address decoding (A0–A15), bidirectional 16-bit I/O (IO1–IO16), and TTL/CMOS-compatible input thresholds. Its read/write control logic relies on three active-low enables: CE (chip select), OE (output enable), and WE (write enable), with BHE/BLE enabling selective 8-bit writes to upper/lower data bytes.
Power management is handled via automatic CE-driven power-down mode, reducing ICC to 5 mA (ISB2) when CE is deasserted and inputs are stable. All I/O pins enter high-impedance state during deselection, write cycles, or when OE/BHE/BLE are inactive - ensuring clean bus sharing in multi-device systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 64K × 16 bits = 1 Mbit; supports 16-bit parallel data interface without external multiplexing. |
| Access Time (tAA) | 10 ns max at –40°C to +85°C; guarantees deterministic read latency for real-time control loops. |
| Supply Voltage | 3.3 V ±10%; compatible with standard LVCMOS 3.3 V system rails and eliminates level-shifting needs. |
| Active Current (ICC) | 85 mA max at industrial temp; enables predictable power budgeting in fanless industrial controllers. |
| Standby Current (ISB2) | 5 mA max with CMOS inputs; ensures ultra-low quiescent draw during idle periods in battery-backed systems. |
| Byte Write Control | BHE and BLE pins independently gate IO9–IO16 and IO1–IO8; allows atomic 8-bit updates without read-modify-write overhead. |
| Package | 44-pin TSOP II (0.400" width); surface-mount compatible with standard reflow profiles and IPC-7351B land patterns. |
Pinout & Package
Package: 44-pin Thin Small Outline Package (TSOP II), 400-mil body width, JEDEC MO-141AC compliant. Pin 1 index marked by notch or dot; pin 1 located at top-left corner when notch faces upward.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A15 | Address Input | 16-bit address bus; selects one of 65,536 memory locations; latched on CE/WE transitions. |
| IO1–IO8 | Bidirectional Data (Lower Byte) | Driven during read when BLE = LOW and OE = LOW; accepts data during write when BLE = LOW and WE = LOW. |
| IO9–IO16 | Bidirectional Data (Upper Byte) | Driven during read when BHE = LOW and OE = LOW; accepts data during write when BHE = LOW and WE = LOW. |
| CE | Chip Enable (Active Low) | Global device select; forces all I/O into high-Z when HIGH; triggers automatic power-down when held HIGH >100 μs. |
| OE | Output Enable (Active Low) | Controls output driver enable; must be LOW for read data to appear on IOx; tri-states outputs when HIGH. |
| WE | Write Enable (Active Low) | Initiates write cycle when CE and WE both LOW; determines write timing reference for setup/hold requirements. |
| BLE | Byte Low Enable (Active Low) | Enables write/read access to lower 8 bits (IO1–IO8); decouples byte-level operations from full-word transfers. |
| BHE | Byte High Enable (Active Low) | Enables write/read access to upper 8 bits (IO9–IO16); supports mixed-endian or partial-word update protocols. |
| VCC | Power Supply | 3.3 V ±10% supply; two dedicated pins (pins 11, 33) reduce IR drop and improve noise immunity. |
| VSS | Ground | System ground reference; two dedicated pins (pins 12, 34) provide low-inductance return path. |
Key Features
| Feature | Design Value |
|---|---|
| 10 ns industrial-grade access time | Meets deterministic timing for 100 MHz bus interfaces in PLCs and motor drives without wait states. |
| Dual independent byte write control (BHE/BLE) | Eliminates need for external byte masking logic; reduces PCB layer count and routing complexity. |
| Automatic CE power-down mode | Reduces standby current to 5 mA without external control signals - ideal for energy-constrained edge nodes. |
| High-impedance I/O during deselect/write | Prevents bus contention in shared-memory architectures with multiple masters or peripherals. |
| Pb-free and RoHS-compliant packaging | 44-pin TSOP II meets J-STD-020D reflow profile; qualified for industrial lifecycle (≥10 years). |
Applications
| Industrial PLC Memory Buffer | Automotive ECU Boot ROM Cache |
|---|---|
|
Use Scenario: Stores real-time I/O mapping tables and motion control trajectory buffers in programmable logic controllers. IC Role / Device Role / Timing Role: High-speed parallel SRAM acting as deterministic latency buffer between FPGA logic and fieldbus interface ASICs. Use Value: 10 ns tAA ensures sub-microsecond response to encoder interrupts; dual-byte write enables atomic status flag updates without locking entire memory word. |
Use Scenario: Caches boot firmware instructions and calibration data during cold-start sequence in engine control units. IC Role / Device Role / Timing Role: Nonvolatile-independent fast-access memory holding critical startup vectors before flash controller initialization. Use Value: Industrial temperature rating (–40°C to +85°C) and 5 mA ISB2 guarantee reliable operation across automotive thermal cycles without external regulators. |
| Medical Imaging Frame Buffer | Avionics Display Controller Memory |
|
Use Scenario: Holds uncompressed grayscale image frames (1024 × 768 @ 16 bpp) for real-time contrast enhancement in ultrasound systems. IC Role / Device Role / Timing Role: Dual-port-capable SRAM used as ping-pong frame buffer synchronized to pixel clock and DMA engine. Use Value: Independent BHE/BLE allows simultaneous write of new frame (upper byte) and read of previous frame (lower byte), doubling effective bandwidth. |
Use Scenario: Stores glyph bitmaps and overlay metadata for multifunction cockpit displays requiring ARINC 661 compliance. IC Role / Device Role / Timing Role: Deterministic-access memory interfaced directly to display controller ASIC with no glue logic. Use Value: TSOP II package provides mechanical robustness against vibration; 76.92°C/W ΘJA supports conduction-cooled avionics enclosures without forced air. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed parallel SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61LV102416AL-10TLI | Same 64K × 16 organization, 10 ns access, 3.3 V, but uses single-byte enable (UB/LB) instead of BHE/BLE; higher ISB2 (10 mA). | Lacks independent upper/lower byte write control; requires external logic for partial-word writes in legacy 8-bit bus designs. | Select when BHE/BLE functionality is unused and cost sensitivity outweighs byte-control flexibility. |
| ON Semiconductor MC1021V16-10L | 10 ns access, 3.3 V, but rated only for commercial temp (0°C to +70°C); no automotive or industrial qualification. | Not suitable for under-hood or factory-floor deployments; lacks AEC-Q100 or extended temp validation. | Choose only for lab prototypes or non-critical consumer electronics where ambient stays within 0–70°C. |
Compared with IS61LV102416AL-10TLI and MC1021V16-10L, CY7C1021CV33-10ZXCT uniquely delivers industrial-qualified dual-byte write control, 5 mA standby current, and TSOP II reliability - making it the only option for deterministic real-time buffering in harsh environments.
Availability
CY7C1021CV33-10ZXCT is available at Aetrix Electronics and suitable for industrial PLC memory buffers, automotive ECU boot caches, and medical imaging frame buffers requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CY7C1021CV33-10ZXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-reliability memory, microcontrollers, and connectivity solutions for industrial, automotive, and aerospace markets.
The CY7C1021CV33 belongs to Cypress's parallel SRAM product line, engineered specifically for deterministic-latency, low-power, and thermally robust embedded memory applications where asynchronous access and bus compatibility are critical.
FAQ
Does CY7C1021CV33-10ZXCT support true dual-port operation?
No. The device is a single-port SRAM with one address bus and one bidirectional data bus. While BHE/BLE enable concurrent access to upper and lower bytes, it does not support simultaneous independent read and write operations like a true dual-port RAM. All accesses are serialized through the shared address and control lines.
What is the maximum operating frequency supported by the 10 ns access time?
The 10 ns access time corresponds to a maximum read cycle time (tRC) of 10 ns, supporting up to 100 MHz continuous burst reads when CE remains asserted. However, sustained operation at this rate requires strict adherence to tOHA (3 ns address hold) and tHZOE (5 ns output disable delay) to avoid bus contention or metastability.
Can CY7C1021CV33-10ZXCT be used with 5 V logic interfaces?
No. The device is strictly a 3.3 V core and I/O part. VIH is specified as 2.0 V minimum and VCC + 0.3 V maximum, meaning 5 V inputs exceed absolute maximum ratings and risk latch-up or permanent damage. Level translation is mandatory for 5 V system integration.
Is the 44-pin TSOP II package lead-free and RoHS-compliant?
Yes. The -10ZXCT suffix denotes a Pb-free, RoHS-compliant 44-pin TSOP II package, qualified per J-STD-020D reflow profile and tested for intermetallic growth resistance under industrial temperature cycling conditions.
CY7C1021CV33-10ZXCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 64K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY7C1021CV33-10ZXCT FAQ
1.How can I place an order for CY7C1021CV33-10ZXCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1021CV33-10ZXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1021CV33-10ZXCT reliable?
The price and inventory of CY7C1021CV33-10ZXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1021CV33-10ZXCT is usually 5 days.
3.What payment methods are accepted for CY7C1021CV33-10ZXCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1021CV33-10ZXCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1021CV33-10ZXCT?
CY7C1021CV33-10ZXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1021CV33-10ZXCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1021CV33-10ZXCT?
For technical support, including CY7C1021CV33-10ZXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1021CV33-10ZXCT requirements.
6.How does Aetrix verify that CY7C1021CV33-10ZXCT is sourced from the original manufacturer or authorized distributors?
All CY7C1021CV33-10ZXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1021CV33-10ZXCT meets industry standards.
7.What is the process for return or replacement of CY7C1021CV33-10ZXCT?
All CY7C1021CV33-10ZXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1021CV33-10ZXCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1021CV33-10ZXCT part is unused and in its original packaging.
Return procedure for CY7C1021CV33-10ZXCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1021CV33-10ZXCT Tags
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M24C02-WMN6TP
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