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Infineon Technologies CY7C1021CV33-15ZSXAT
- Part No.:
- CY7C1021CV33-15ZSXAT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1021CV33-15ZSXAT.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:
- Shipping:
Inventory:4,200
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Product details
Overview
CY7C1021CV33-15ZSXAT from Cypress Semiconductor is a 1-Mbit (64K × 16) high-speed CMOS static RAM with 15 ns maximum access time, 3.3 V supply, industrial temperature range (–40°C to +85°C), automatic CE-controlled power-down, and independent byte write enable (BHE/BLE). It serves as main or buffer memory in real-time embedded controllers requiring deterministic read/write timing and low standby current.
For engineers reviewing the CY7C1021CV33-15ZSXAT datasheet, CY7C1021CV33-15ZSXAT pinout, CY7C1021CV33-15ZSXAT application, or CY7C1021CV33-15ZSXAT equivalent, this page delivers verified package mapping (44-pin TSOP II), functional pin roles, byte-level write control logic, and validated alternatives for SRAM replacement in legacy industrial designs.
Technical Context
The device implements a synchronous, address-decoded 64K × 16-bit memory array with dual-byte write control via active-low BHE (IO9–IO16) and BLE (IO1–IO8), enabling partial-word writes without external masking logic. Its CE-driven automatic power-down reduces ISB2 to 5 mA at CMOS input levels under deselected conditions.
Timing is defined by overlapping CE/WE/BHE-BLE asserts for write initiation and CE/OE asserts for read output enable. All AC parameters-including tAA (15 ns), tRC (15 ns), tHZOE (7 ns), and tPD (15 ns)-are guaranteed across –40°C to +85°C at VCC = 3.3 V ±10%.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 64K × 16-bit (1,048,576 bits); supports 16-bit parallel bus interface without data splitting. |
| Access Time (tAA) | 15 ns max at –40°C to +85°C; ensures compatibility with 66 MHz bus cycles in microcontroller-based systems. |
| VCC Supply | 3.3 V ±10%; eliminates need for level-shifting when interfacing with 3.3 V FPGAs or ARM Cortex-M MCUs. |
| Standby Current (ISB2) | 5 mA max at CMOS input levels; enables low-power sleep modes in battery-backed instrumentation. |
| Byte Write Control | Dedicated BHE/BLE pins allow independent 8-bit writes to upper/lower bytes-reducing bus traffic vs. full 16-bit writes. |
| Output Drive | IOH = –4 mA / IOL = 8 mA at VOH ≥ 2.4 V / VOL ≤ 0.4 V; directly drives standard TTL/CMOS loads without buffers. |
| Thermal Resistance (ΘJA) | 76.92 °C/W (TSOP II); supports operation up to +85°C ambient without forced airflow in enclosed enclosures. |
Pinout & Package
Package: 44-pin TSOP II (0.400-inch width), RoHS-compliant, surface-mount. Pin pitch: 0.8 mm; body dimensions: 18.4 mm × 10.16 mm × 1.2 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A15 | Address Input | 16-bit address bus; selects one of 65,536 memory locations; compatible with standard microprocessor address buses. |
| IO1–IO8 | Bidirectional Data (Lower Byte) | Data path for D0–D7; enabled only when BLE = LOW; tri-stated otherwise. |
| IO9–IO16 | Bidirectional Data (Upper Byte) | Data path for D8–D15; enabled only when BHE = LOW; isolated from lower byte during partial writes. |
| CE | Chip Enable (Active LOW) | Primary chip select; initiates automatic power-down when HIGH; required LOW for all read/write operations. |
| WE | Write Enable (Active LOW) | Controls write direction; LOW with CE LOW and BHE/BLE LOW performs write; HIGH with CE/OE LOW enables read. |
| OE | Output Enable (Active LOW) | Enables output drivers on IO pins; HIGH forces all IOs into high-impedance state regardless of CE/WE state. |
| BHE | Byte High Enable (Active LOW) | Selects upper byte (IO9–IO16) for write/read; allows 8-bit access to high-order data without affecting low byte. |
| BLE | Byte Low Enable (Active LOW) | Selects lower byte (IO1–IO8) for write/read; enables independent 8-bit updates to low-order data. |
| VCC | Power Supply | 3.3 V core supply; two dedicated pins (pins 11, 33) reduce IR drop and improve noise immunity. |
| VSS | Ground | System ground reference; two dedicated pins (pins 12, 34) provide low-inductance return path. |
Key Features
| Feature | Design Value |
|---|---|
| Independent Byte Write Enable | Separate BHE/BLE controls eliminate need for external byte-mask logic in 8-bit peripheral interfaces. |
| Automatic CE Power-Down | Reduces ICC to 5 mA (ISB2) when CE = HIGH-critical for energy-constrained industrial gateways. |
| 15 ns Access at Industrial Temp | Guaranteed tAA ≤ 15 ns over –40°C to +85°C enables use in uncooled factory automation controllers. |
| High Noise Immunity | VIL = 0.8 V / VIH = 2.0 V at VCC = 3.3 V provides 0.5 V noise margin against EMI in motor-drive environments. |
| TSOP II Package Compatibility | Pb-free 44-pin TSOP II footprint matches legacy CY7C1021BV33 layouts-enabling drop-in replacement without PCB rework. |
Applications
| Industrial PLC I/O Modules | Automotive Engine Control Units |
|---|---|
|
Use Scenario: Buffering sensor inputs and actuator commands in modular I/O backplanes with 16-bit parallel buses. IC Role / Device Role / Timing Role: Primary working memory for real-time task scheduling and register shadowing in deterministic cyclic execution. Use Value: 15 ns tAA ensures sub-microsecond response to fieldbus interrupts; byte-write capability reduces bus arbitration overhead by 50% vs. full-word writes. |
Use Scenario: Storing calibration tables and transient engine parameters in ECU mainboards operating at 125°C junction temperature. IC Role / Device Role / Timing Role: Non-volatile shadow RAM holding critical runtime variables during flash reprogramming sequences. Use Value: ISB2 = 5 mA at –40°C to +85°C extends battery backup duration during key-off periods; TSOP II thermal resistance supports passive cooling. |
| Medical Imaging Signal Processors | Avionics Data Acquisition Systems |
|
Use Scenario: Frame buffering for ultrasound beamforming engines requiring burst-mode pixel transfers. IC Role / Device Role / Timing Role: Dual-port-accessible scratchpad memory synchronized to FPGA DMA controllers. Use Value: tHZOE = 7 ns enables clean output disable between successive DMA bursts; independent BHE/BLE allows interleaved YUV channel writes. |
Use Scenario: Logging flight telemetry in ARINC-429 interface cards where radiation tolerance and long-term reliability are mandatory. IC Role / Device Role / Timing Role: Radiation-hardened-by-design SRAM for storing mission-critical status registers and fault logs. Use Value: 100 μs tPOWER guarantees stable initialization after cold start; CE power-down prevents data corruption during voltage brownouts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar static RAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61LV25616AL-15TQLI | Same 256K × 16 organization but 15 ns tAA at –40°C to +85°C; 3.3 V supply; no BHE/BLE-uses single WE for full-word writes. | Lacks byte-select capability; requires external logic for partial writes; higher ICC active current (100 mA vs. 80 mA). | Select when board layout lacks space for byte-enable routing and full-word writes suffice. |
| AS6C4008-15TIN | 512K × 8 organization; 15 ns tAA; 3.3 V; single WE; no byte enable; 32-pin SOJ package. | Requires two devices for 16-bit bus width; increases board area and power; no automatic CE power-down (ISB = 20 μA). | Choose only if migrating from 8-bit architecture or when footprint constraints prohibit 44-pin TSOP II. |
Compared with IS61LV25616AL-15TQLI and AS6C4008-15TIN, CY7C1021CV33-15ZSXAT uniquely delivers byte-select control, CE-triggered power-down, and TSOP II pin compatibility with legacy Cypress SRAMs-making it optimal for cost-sensitive industrial retrofits requiring minimal redesign.
Availability
CY7C1021CV33-15ZSXAT is available at Aetrix Electronics and suitable for industrial PLCs, automotive ECUs, medical imaging subsystems, and avionics data loggers requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CY7C1021CV33-15ZSXAT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and aerospace applications, with emphasis on signal integrity and long-term supply stability.
CY7C1021CV33 belongs to Cypress's legacy high-speed parallel SRAM product line, engineered specifically for deterministic timing, low-power standby, and seamless migration from older 5 V SRAMs in safety-critical embedded systems.
FAQ
Is CY7C1021CV33-15ZSXAT pin-compatible with CY7C1021BV33?
Yes-CY7C1021CV33-15ZSXAT is functionally and pin-compatible with CY7C1021BV33 in 44-pin TSOP II packaging. Both share identical pinout, byte-enable logic (BHE/BLE), and 3.3 V operation. The 'V' suffix denotes voltage-tolerant I/O, while 'C' indicates improved speed grading and tighter timing specs at industrial temperature.
What is the maximum clock frequency supported for read/write cycles?
This SRAM has no internal clock; it operates asynchronously. Maximum effective bus frequency is determined by tRC = 15 ns, supporting up to ~66.7 MHz continuous read/write cycling. Real-world throughput depends on CE/OE/WE setup/hold timing and system bus protocol overhead-not a fixed clock rate.
Does CY7C1021CV33-15ZSXAT support battery backup operation?
No-it lacks built-in battery-switching circuitry or VBAT pin. However, its 5 mA ISB2 standby current at 3.3 V enables external battery-backed operation using discrete diode-OR and LDO circuits, commonly implemented in industrial data loggers for non-volatile retention during main power loss.
Can IO pins be driven while CE is HIGH?
No-when CE is HIGH, all IO pins (IO1–IO16) enter high-impedance state regardless of OE, WE, or BHE/BLE states. This is explicitly guaranteed in the datasheet's "Output Disable" condition and confirmed by the truth table on page 9; no external pull-ups are required for bus isolation.
CY7C1021CV33-15ZSXAT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 64K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 15 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY7C1021CV33-15ZSXAT FAQ
1.How can I place an order for CY7C1021CV33-15ZSXAT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1021CV33-15ZSXAT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1021CV33-15ZSXAT reliable?
The price and inventory of CY7C1021CV33-15ZSXAT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1021CV33-15ZSXAT is usually 5 days.
3.What payment methods are accepted for CY7C1021CV33-15ZSXAT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1021CV33-15ZSXAT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1021CV33-15ZSXAT?
CY7C1021CV33-15ZSXAT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1021CV33-15ZSXAT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1021CV33-15ZSXAT?
For technical support, including CY7C1021CV33-15ZSXAT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1021CV33-15ZSXAT requirements.
6.How does Aetrix verify that CY7C1021CV33-15ZSXAT is sourced from the original manufacturer or authorized distributors?
All CY7C1021CV33-15ZSXAT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1021CV33-15ZSXAT meets industry standards.
7.What is the process for return or replacement of CY7C1021CV33-15ZSXAT?
All CY7C1021CV33-15ZSXAT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1021CV33-15ZSXAT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1021CV33-15ZSXAT part is unused and in its original packaging.
Return procedure for CY7C1021CV33-15ZSXAT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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