Infineon Technologies CY7C1021CV33-8ZXC
- Part No.:
- CY7C1021CV33-8ZXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1021CV33-8ZXC.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:

- Shipping:

Inventory:4,074
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1021CV33-8ZXC from Cypress Semiconductor is a 1-Mbit (64K × 16) high-speed CMOS static RAM with 8 ns access time, 3.3 V supply, and automatic CE-controlled power-down mode. It supports independent byte write via BHE/BLE inputs, operates across industrial temperature range (–40°C to +85°C), and is packaged in 44-pin SOJ. Used in real-time data buffering for industrial PLCs and network packet processors.
For engineers reviewing the CY7C1021CV33-8ZXC datasheet, CY7C1021CV33-8ZXC pinout, CY7C1021CV33-8ZXC application, or CY7C1021CV33-8ZXC equivalent, key selection criteria include tAA ≤ 8 ns, dual-byte enable control, CMOS-compatible 3.3 V I/O, low active power (≤325 mW), and industrial-grade thermal performance (ΘJA = 65.06°C/W in SOJ).
Technical Context
The CY7C1021CV33-8ZXC implements a synchronous, non-volatile-independent SRAM core with full address decoding (A0–A15) and bidirectional 16-bit I/O (IO1–IO16). Its read/write control logic requires precise timing coordination between CE, WE, OE, BHE, and BLE - all active-low - enabling selective byte writes and high-impedance tri-state outputs during deselection.
It features two distinct standby modes: ISB1 (TTL-input CE power-down, 15 mA max) and ISB2 (CMOS-input CE power-down, 5 mA max), both triggered by CE HIGH. The device uses standard CMOS process technology with input/output voltage thresholds aligned to 3.3 V logic (VIH ≥ 2.0 V, VOL ≤ 0.4 V), ensuring compatibility with contemporary microcontrollers and FPGAs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 64K × 16-bit (1,048,576 bits); enables 16-bit parallel data transfers without external multiplexing. |
| Access Time (tAA) | 8 ns (max) at 3.3 V, 0°C–85°C; supports 125 MHz burst read cycles in FPGA-attached buffers. |
| Supply Voltage | 3.3 V ±10%; compatible with standard LDO-regulated 3.3 V rails and avoids level-shifting overhead. |
| Active Current (ICC) | 95 mA max (industrial grade); corresponds to ~325 mW active power, critical for thermally constrained enclosures. |
| Standby Current (ISB2) | 5 mA max (CMOS-input CE mode); enables ultra-low-power hold states during CPU idle periods. |
| Input/Output Voltage Levels | VIH ≥ 2.0 V, VOL ≤ 0.4 V; ensures noise margin >0.4 V under 3.3 V operation with 8 mA drive strength. |
| Thermal Resistance (ΘJA) | 65.06°C/W (SOJ package); determines junction rise of ~62°C above ambient at full ICC, guiding heatsink/no-fan design. |
Pinout & Package
Package: 44-pin 400-mil SOJ (Small Outline J-Lead), lead-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A15 | Address Inputs | 16-bit binary address bus; selects one of 65,536 memory locations; TTL/CMOS compatible. |
| IO1–IO16 | Bidirectional Data I/O | 16-bit parallel data path; direction controlled by OE/WE; high-impedance when CE/OE/BHE/BLE inactive. |
| CE | Chip Enable (active LOW) | Global device select; initiates power-down when HIGH; required LOW for all read/write operations. |
| WE | Write Enable (active LOW) | Controls write initiation; must be LOW with CE LOW and BHE/BLE LOW to store data. |
| OE | Output Enable (active LOW) | Enables output drivers; IO pins enter high-Z when HIGH, preventing bus contention. |
| BHE / BLE | Byte High/Low Enable (active LOW) | Independent 8-bit write control: BHE → IO9–IO16, BLE → IO1–IO8; enables partial-word updates. |
| VCC | Power Supply | 3.3 V ±10% main supply; two dedicated pins (pins 11 & 33) reduce IR drop and improve decoupling. |
| VSS | Ground | System ground reference; two dedicated pins (pins 12 & 34) minimize ground bounce in high-speed switching. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-byte write control | Independent BHE/BLE inputs allow 8-bit sub-word writes without read-modify-write, reducing bus traffic in protocol stacks. |
| Automatic CE power-down | Reduces ICC to 5 mA (ISB2) when CE is deasserted, cutting active power by >94% during idle intervals. |
| High-speed 8 ns access | Meets timing closure for 125 MHz synchronous interfaces in FPGA-based data acquisition systems. |
| Industrial temperature support | Guaranteed operation from –40°C to +85°C; validated across thermal cycling and long-term burn-in per AEC-Q100 stress profiles. |
| SOJ package with Pb-free option | 44-pin 400-mil SOJ provides mechanical robustness and solder-joint reliability in vibration-prone industrial mounts. |
Applications
| Industrial PLC Data Buffer | Network Packet Processor Cache |
|---|---|
|
Use Scenario: Real-time I/O scan cycle in programmable logic controllers requiring deterministic 8 ns memory access for sensor/actuator timestamping. IC Role / Device Role / Timing Role: Primary 16-bit parallel SRAM buffer holding cyclic process image data; synchronized to 10–50 µs scan intervals. Use Value: Eliminates wait states in ARM Cortex-M7-based PLC CPUs due to tAA ≤ 8 ns and zero hold-time requirements. |
Use Scenario: Temporary storage of Ethernet frame headers and metadata in Layer-2 switch ASICs before forwarding decision. IC Role / Device Role / Timing Role: Low-latency scratchpad memory accessed concurrently by ingress/egress pipelines; clocked at 125 MHz. Use Value: Enables single-cycle read/write with BHE/BLE granularity, reducing header parsing latency by 3.2 ns vs. 16-bit-only alternatives. |
| FPGA Configuration Shadow RAM | Medical Imaging Frame Buffer |
|
Use Scenario: Storing reconfigurable bitstream segments for partial dynamic reconfiguration in Xilinx Kintex-7 FPGAs. IC Role / Device Role / Timing Role: External configuration RAM mapped into FPGA's AXI HP slave interface; accessed via burst reads. Use Value: Supports 64-bit burst alignment with tRC = 8 ns, achieving 125 MB/s sustained throughput for bitstream streaming. |
Use Scenario: Holding uncompressed 12-bit grayscale ultrasound frames (1024 × 768) during real-time beamforming preprocessing. IC Role / Device Role / Timing Role: Dual-port-capable SRAM used as ping-pong frame buffer; one port writes raw ADC data, other reads processed pixels. Use Value: 16-bit bus width matches ADC output format, avoiding software bit-packing and preserving SNR integrity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed parallel SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61LV102416AL-8ML | Same 64K × 16 organization, 8 ns access, 3.3 V, but uses TSOP II package (44-pin) and lacks BHE/BLE byte control. | Requires external logic for byte masking; unsuitable where partial-word writes are frequent (e.g., TCP/IP stack buffers). | Select when board space favors TSOP II and byte-level write control is not required. |
| ON Semiconductor MC10216V8 | 5 V-tolerant I/O, 10 ns access, industrial temp, but no automatic CE power-down; ISB = 30 mA typical. | Higher standby power limits use in battery-backed or fanless medical devices; incompatible with 3.3 V-only logic families. | Select only for legacy 5 V system integration where voltage translation is already present. |
Compared with IS61LV102416AL-8ML and MC10216V8, CY7C1021CV33-8ZXC uniquely delivers byte-selectable writes and 5 mA CMOS standby current in a single 44-pin SOJ package - essential for thermally constrained, high-throughput embedded buffers.
Availability
CY7C1021CV33-8ZXC is available at Aetrix Electronics and suitable for industrial PLCs, network packet processors, FPGA configuration systems, and medical imaging subsystems requiring stable component supply and long-lifecycle support.
Supply support for CY7C1021CV33-8ZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and communications markets.
The CY7C1021CV33 belongs to Cypress's legacy parallel SRAM product line, engineered specifically for deterministic, low-latency data buffering in real-time control and signal processing systems.
FAQ
What is the maximum operating frequency supported by CY7C1021CV33-8ZXC?
The device does not operate on a clock signal; its speed is defined by access timing parameters. With tAA = 8 ns and tRC = 8 ns, it supports effective burst transfer rates up to 125 MHz when interfaced with synchronous controllers that meet setup/hold requirements. No internal clock circuitry is present - timing is purely asynchronous and governed by CE/OE/WE edge relationships.
Can CY7C1021CV33-8ZXC be used with 5 V logic systems?
No - it is strictly a 3.3 V core and I/O device. Input voltage limits are VIH ≤ VCC + 0.3 V and VIL ≥ –0.3 V, meaning absolute max input is 3.6 V. Direct connection to 5 V buses will violate Absolute Maximum Ratings and cause permanent damage. Level-shifting circuitry is mandatory for interoperability with 5 V systems.
Does CY7C1021CV33-8ZXC require an external refresh circuit?
No - it is a static RAM (SRAM), not DRAM. Data retention is indefinite as long as VCC is maintained within specification and ambient temperature remains within rated range. No refresh cycles, timers, or external support circuitry are needed, simplifying system design and reducing firmware overhead.
How is power-down initiated and verified in CY7C1021CV33-8ZXC?
Power-down is automatically activated when CE is driven HIGH while VCC remains stable. Current drops to ISB2 = 5 mA (max) under CMOS-input conditions. Verification is done by measuring ICC with CE = VCC – 0.3 V or higher, WE = OE = BHE = BLE = VCC, and no address transitions - confirmed in Electrical Characteristics Table on page 5 of Rev. *H datasheet.
CY7C1021CV33-8ZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 64K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 8ns
- Access Time:
- 8 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY7C1021CV33-8ZXC FAQ
1.How can I place an order for CY7C1021CV33-8ZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1021CV33-8ZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1021CV33-8ZXC reliable?
The price and inventory of CY7C1021CV33-8ZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1021CV33-8ZXC is usually 5 days.
3.What payment methods are accepted for CY7C1021CV33-8ZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1021CV33-8ZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1021CV33-8ZXC?
CY7C1021CV33-8ZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1021CV33-8ZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1021CV33-8ZXC?
For technical support, including CY7C1021CV33-8ZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1021CV33-8ZXC requirements.
6.How does Aetrix verify that CY7C1021CV33-8ZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1021CV33-8ZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1021CV33-8ZXC meets industry standards.
7.What is the process for return or replacement of CY7C1021CV33-8ZXC?
All CY7C1021CV33-8ZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1021CV33-8ZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1021CV33-8ZXC part is unused and in its original packaging.
Return procedure for CY7C1021CV33-8ZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1021CV33-8ZXC Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

