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Infineon Technologies CY7C1021CV33-8ZXCT

Part No.:
CY7C1021CV33-8ZXCT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
44-TSOP (0.400", 10.16mm Width)
Datasheet:
AetrixCY7C1021CV33-8ZXCT.pdf
Description:
IC SRAM 1MBIT PARALLEL 44TSOP II
Quantity:
Payment:
Payment
Shipping:
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Inventory:3,303

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Product details

Overview

CY7C1021CV33-8ZXCT from Cypress Semiconductor is a 1-Mbit (64K × 16) high-speed CMOS static RAM with 8 ns access time, 3.3 V supply, and independent byte write control via BHE/ BLE pins. It supports commercial (0°C to 70°C) and industrial (–40°C to 85°C) temperature ranges, features automatic CE-controlled power-down (ISB2 = 5 mA), and is packaged in a 44-pin TSOP II (ZXC suffix). It serves as main data buffer in real-time industrial controllers requiring deterministic low-latency memory access.

For engineers reviewing the CY7C1021CV33-8ZXCT datasheet, CY7C1021CV33-8ZXCT pinout, CY7C1021CV33-8ZXCT application, or CY7C1021CV33-8ZXCT equivalent, key selection criteria include tAA ≤ 8 ns read timing, dual-byte enable architecture for partial-word writes, CMOS-compatible 3.3 V I/O levels, and TSOP II package compatibility with legacy SRAM footprints in space-constrained embedded systems.

Technical Context

The CY7C1021CV33-8ZXCT implements a synchronous, address-decoded 64K × 16-bit memory array with separate row/column decoders and sense amplifiers. Its operation relies on three active-low control signals-CE, OE, and WE-with byte-level granularity managed by BHE (IO9–IO16) and BLE (IO1–IO8).

It uses TTL- and CMOS-compatible input thresholds (VIH ≥ 2.0 V, VIL ≤ 0.8 V), delivers VOH ≥ 2.4 V at –4 mA, and maintains VOL ≤ 0.4 V at 8 mA. Power management includes two standby modes: ISB1 (15 mA, TTL inputs) and ISB2 (5 mA, CMOS inputs), triggered automatically when CE is deasserted.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 64K × 16-bit (1,048,576 bits); enables 16-bit parallel data bus interfacing without external multiplexing.
Access Time (tAA) 8 ns max (Commercial/Industrial); guarantees deterministic read latency for real-time firmware execution.
Supply Voltage (VCC) 3.3 V ± 10%; compatible with standard 3.3 V logic domains and eliminates need for level-shifting circuitry.
Active Current (ICC) 95 mA max at fMAX; defines worst-case power budget for memory subsystem thermal design.
Standby Current (ISB2) 5 mA max (CMOS inputs); enables ultra-low-power sleep mode during processor idle cycles.
Input/Output Capacitance CIN/COUT = 8 pF; constrains maximum trace length and fan-out in high-speed PCB layout.
Operating Temperature –40°C to +85°C (Industrial grade); validated for use in factory automation and motor drive control environments.

Pinout & Package

Package: 44-pin TSOP II (Type II, 400-mil width), RoHS-compliant, surface-mount. Pin pitch: 0.8 mm. Body dimensions: 18.4 mm × 10.16 mm × 1.2 mm.

Pin/Terminal Circuit Role Design Meaning
A0–A15 Address Inputs 16-bit address bus; selects one of 65,536 memory locations; must be stable before CE/OE/WE assertion.
IO1–IO8 / IO9–IO16 Bidirectional Data I/O Two independent 8-bit data ports; IO1–IO8 controlled by BLE, IO9–IO16 by BHE for partial-word writes.
CE Chip Enable (Active LOW) Global device select; drives internal power-down when HIGH; determines tHZCE (7 ns max) and tPD (8 ns).
OE Output Enable (Active LOW) Enables output drivers; controls direction of IO pins; tHZOE = 4 ns defines minimum bus release delay.
WE Write Enable (Active LOW) Initiates write cycle; combined with CE and BHE/ BLE to define write overlap window per JEDEC timing rules.
BLE / BHE Byte Low/High Enable (Active LOW) Independent 8-bit write masking; allows simultaneous or staggered writes to upper/lower bytes without data corruption.
VCC Power Supply 3.3 V core and I/O supply; requires local 0.1 µF ceramic decoupling per VCC pin (pins 11 & 33).
VSS Ground Dual ground pins (12 & 34) reduce ground bounce; must connect to low-impedance system ground plane.

Key Features

Feature Design Value
8 ns access time (tAA) Meets tight timing budgets in 32-bit microcontroller data caches and FPGA configuration buffers.
Independent byte write control Eliminates need for external byte-mask logic in mixed-data-width systems (e.g., 16-bit CPU accessing 8-bit peripherals).
Automatic CE power-down Reduces standby current to 5 mA without software intervention-critical for battery-backed industrial logging.
TSOP II footprint compatibility Direct drop-in replacement for CY7C1021BV33 and other legacy 44-pin SRAMs, preserving PCB layout integrity.
Industrial temperature range Validated operation from –40°C to +85°C ensures reliability in uncontrolled cabinet environments (e.g., PLC backplanes).

Applications

Industrial PLC Data Buffer Automotive Engine Control Unit (ECU) RAM

Use Scenario: Stores real-time sensor fusion results and actuator command queues in programmable logic controllers with deterministic scan cycles.

IC Role / Device Role / Timing Role: Primary working RAM interfaced directly to ARM Cortex-M7 bus; provides sub-10 ns read/write turnaround for <100 µs control loops.

Use Value: 8 ns tAA and dual-byte write enable deterministic execution of motion control algorithms without pipeline stalls.

Use Scenario: Holds transient calibration tables and fault history logs in engine control modules operating under hood temperatures up to 85°C.

IC Role / Device Role / Timing Role: Non-volatile shadow RAM backed by EEPROM; accessed during cold-start initialization and runtime diagnostics.

Use Value: Industrial-grade temperature rating and 5 mA ISB2 ensure reliable data retention during ignition-off periods with minimal battery drain.

FPGA Configuration Memory Medical Imaging Signal Buffer

Use Scenario: Stores partial reconfiguration bitstreams and lookup tables for Xilinx Spartan-7 FPGA-based ultrasound beamformers.

IC Role / Device Role / Timing Role: External fast-access memory mapped to FPGA AXI HP port; synchronized to 100 MHz clock domain via handshaking.

Use Value: 44-pin TSOP II package allows dense placement near FPGA BGA; 8 pF CIN/COUT minimizes signal integrity degradation at 100 Mbps data rates.

Use Scenario: Buffers raw ADC samples from 16-bit, 5 MSPS analog front-ends in portable MRI gradient controllers.

IC Role / Device Role / Timing Role: Dual-port-capable SRAM used in ping-pong configuration to decouple acquisition and processing pipelines.

Use Value: Independent BLE/BHE control enables concurrent write to one bank and read from another-eliminating FIFO logic overhead.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed parallel SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61LV102416AL-8TLI Same 64K × 16 organization, 8 ns tAA, but 3.3 V only; no automotive temp grade; 44-pin TSOP II pinout identical. Lacks BHE/ BLE separation-uses single UB/LB pins; requires external gating for true byte masking. Select when cost sensitivity outweighs need for independent byte control and automotive qualification.
AS6C1008-8TIN 64K × 16, 8 ns, 3.3 V; industrial temp (–40°C to +85°C); 44-pin TSOP II; lower ICC (70 mA max) but higher ISB (10 mA). No automatic CE power-down-requires explicit software-controlled sleep mode entry. Prefer for thermally constrained designs where active power dominates, and firmware can manage sleep state.

Compared with IS61LV102416AL-8TLI and AS6C1008-8TIN, the CY7C1021CV33-8ZXCT uniquely combines hardware-enforced byte masking, guaranteed 5 mA ISB2, and full automotive-A qualification-making it optimal for safety-critical, low-power, and mixed-width interface applications.

Availability

CY7C1021CV33-8ZXCT is available at Aetrix Electronics and suitable for industrial PLCs, automotive ECUs, FPGA configuration systems, and medical imaging equipment requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for CY7C1021CV33-8ZXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and microcontroller solutions for industrial, automotive, and communications infrastructure markets.

The CY7C1021CV33 belongs to Cypress's parallel SRAM product line, engineered specifically for deterministic, low-latency data buffering in real-time embedded systems where predictability trumps density or serial interface flexibility.

FAQ

Is CY7C1021CV33-8ZXCT pin-compatible with CY7C1021BV33?

Yes-CY7C1021CV33-8ZXCT is functionally and pin-compatible with CY7C1021BV33, sharing identical 44-pin TSOP II pinout, address/data/control signal mapping, and byte-enable architecture. The 'V33' suffix denotes 3.3 V operation for both, and timing parameters are aligned for 8 ns speed grade. No PCB redesign is required for migration.

What is the maximum capacitive load supported on IO pins?

The CY7C1021CV33-8ZXCT specifies COUT = 8 pF maximum per IO pin under standard test conditions (TA = 25°C, f = 1 MHz, VCC = 3.3 V). This value governs trace length and fan-out limits; exceeding it risks violating tDOE (5 ns) and tHZOE (4 ns) timing margins in high-speed bus implementations.

Does this SRAM require an external clock signal?

No-CY7C1021CV33-8ZXCT is an asynchronous static RAM and operates without a clock. All timing is governed by setup/hold relationships among CE, OE, WE, BHE, BLE, and address transitions. No clock generation or synchronization circuitry is needed, simplifying system timing design.

Can BLE and BHE be asserted simultaneously for full 16-bit writes?

Yes-asserting both BLE and BHE LOW enables concurrent writing to all 16 IO lines (IO1–IO16). The device treats this as a full-word write; no timing penalty or conflict occurs. This mode is electrically and functionally identical to asserting only CE and WE LOW with both byte enables active.

CY7C1021CV33-8ZXCT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
44-TSOP (0.400", 10.16mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
1Mbit
Memory Organization:
64K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
8ns
Access Time:
8 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
44-TSOP II

CY7C1021CV33-8ZXCT FAQ

1.How can I place an order for CY7C1021CV33-8ZXCT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1021CV33-8ZXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1021CV33-8ZXCT reliable?

The price and inventory of CY7C1021CV33-8ZXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1021CV33-8ZXCT is usually 5 days.

3.What payment methods are accepted for CY7C1021CV33-8ZXCT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1021CV33-8ZXCT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1021CV33-8ZXCT?

CY7C1021CV33-8ZXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1021CV33-8ZXCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1021CV33-8ZXCT?

For technical support, including CY7C1021CV33-8ZXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1021CV33-8ZXCT requirements.

6.How does Aetrix verify that CY7C1021CV33-8ZXCT is sourced from the original manufacturer or authorized distributors?

All CY7C1021CV33-8ZXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1021CV33-8ZXCT meets industry standards.

7.What is the process for return or replacement of CY7C1021CV33-8ZXCT?

All CY7C1021CV33-8ZXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1021CV33-8ZXCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1021CV33-8ZXCT part is unused and in its original packaging.

Return procedure for CY7C1021CV33-8ZXCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1021CV33-8ZXCT Tags

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