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Infineon Technologies CY7C1021DV33-10ZSXI
- Part No.:
- CY7C1021DV33-10ZSXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1021DV33-10ZSXI.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:
- Shipping:
Inventory:1,062
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Product details
Overview
CY7C1021DV33-10ZSXI from Cypress Semiconductor is a 1-Mbit (64 K × 16) high-speed CMOS static RAM with 10 ns access time, 3.3 V supply, industrial/automotive-A temperature range (–40 °C to +85 °C), and automatic CE-controlled power-down. It supports independent byte-wide writes via BHE/BLE inputs and operates in SOJ-44 package for embedded memory buffering in real-time control systems.
For engineers reviewing the CY7C1021DV33-10ZSXI datasheet, CY7C1021DV33-10ZSXI pinout, CY7C1021DV33-10ZSXI application, or CY7C1021DV33-10ZSXI equivalent, key selection criteria include tAA ≤ 10 ns, ISB2 ≤ 3 mA standby current, dual-byte enable architecture, and Pb-free SOJ-44 mechanical compatibility with legacy CY7C1021CV33 designs.
Technical Context
The device implements a synchronous, address-decoded SRAM array with independent upper/lower byte write control via dedicated BHE and BLE pins, enabling partial-word updates without read-modify-write cycles. Its automatic CE-driven power-down mode reduces ICC to 3 mA when deselected, meeting low-power requirements in battery-backed or intermittent-operation systems.
Timing behavior is defined by strict AC parameters including tRC = 10 ns, tDOE = 5 ns, and tHZOE = 5 ns, all specified at 3.3 V ±0.3 V and –40 °C to +85 °C. The I/O structure places pins in high-impedance state during deselect, OE HIGH, or write operations-ensuring clean bus sharing in multi-device memory subsystems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 64 K × 16-bit (1,048,576 bits); enables 16-bit data bus interfacing without external multiplexing |
| Access Time (tAA) | 10 ns max; supports 100 MHz burst read timing in microcontroller or FPGA memory interfaces |
| VCC Supply | 3.3 V ± 0.3 V; compatible with standard LVCMOS I/O domains and eliminates level-shifting in 3.3 V systems |
| Standby Current (ISB2) | 3 mA max at CMOS input conditions; enables low-quiescent power in sleep-mode industrial controllers |
| Data Retention Voltage | 2.0 V min; allows operation from backup coin cell or supercapacitor during main power loss |
| Operating Temperature | –40 °C to +85 °C (Industrial/Automotive-A); qualified for under-hood or factory-floor deployment |
| Package | 44-pin 400-mil SOJ (ZSXI suffix); surface-mount compatible with automated assembly and legacy socket footprint |
Pinout & Package
44-pin 400-mil wide molded SOJ (Small Outline J-Lead) package with gull-wing leads, JEDEC MS-024AC compliant, lead-free (Pb-free) finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A15 | Address Inputs | 16-bit address bus; selects one of 65,536 memory locations for read/write access |
| I/O0–I/O7 | Lower Byte Data I/O | Bi-directional 8-bit data path enabled when BLE = LOW; isolated during BHE-only operations |
| I/O8–I/O15 | Upper Byte Data I/O | Bi-directional 8-bit data path enabled when BHE = LOW; operates independently of lower byte |
| CE | Chip Enable | Active-low global select; forces automatic power-down and high-Z I/O when HIGH |
| WE | Write Enable | Active-low write strobe; initiates write cycle when CE and WE both LOW with valid BHE/BLE |
| OE | Output Enable | Active-low output control; enables data drive on I/O pins only when CE and OE both LOW |
| BLE | Byte Low Enable | Active-low control for I/O0–I/O7; permits partial-word writes without disturbing upper byte |
| BHE | Byte High Enable | Active-low control for I/O8–I/O15; enables independent upper-byte update capability |
| VCC | Power Supply | 3.3 V core and I/O supply; two dedicated pins reduce IR drop and improve noise immunity |
| VSS | Ground | Two ground pins provide low-inductance return paths for I/O and core logic switching currents |
Key Features
| Feature | Design Value |
|---|---|
| Independent byte write control | Enables atomic 8-bit updates to upper or lower half of 16-bit word without full-word read-modify-write overhead |
| Automatic CE power-down | Reduces ICC to 3 mA when CE is deasserted-no external control logic required for low-power sleep states |
| 2.0 V data retention | Maintains stored data during brown-out or backup power scenarios using minimal energy storage capacitance |
| Pb-free SOJ-44 packaging | Meets RoHS Directive 2011/65/EU and supports reflow soldering with standard SnAgCu profiles |
| Pin-and function-compatible with CY7C1021CV33 | Direct drop-in replacement for existing designs using the earlier CV33 variant, preserving layout and firmware |
Applications
| Industrial PLC Memory Buffer | Automotive Body Control Module |
|---|---|
|
Use Scenario: Storing real-time sensor logs and configuration registers in programmable logic controllers with deterministic scan cycles. IC Role / Device Role / Timing Role: Non-volatile shadow RAM holding critical runtime variables; accessed at 10 ns latency during each 1 ms control loop. Use Value: Eliminates EEPROM wear-out from frequent writes while maintaining deterministic access timing under interrupt-driven execution. |
Use Scenario: Caching door lock status, window position, and lighting presets in centralized body electronics units. IC Role / Device Role / Timing Role: Fast-access scratchpad memory for volatile vehicle state tracking between ignition cycles. Use Value: Supports instant resume of user preferences after key-off/key-on transition using 2.0 V data retention during battery disconnect. |
| Medical Diagnostic Imaging Buffer | Avionics Display Frame Store |
|
Use Scenario: Temporary storage of digitized ultrasound frame segments prior to DSP processing and display rendering. IC Role / Device Role / Timing Role: High-bandwidth 16-bit parallel buffer interfaced to ADC and FPGA; synchronized to pixel clock domain. Use Value: 10 ns tAA ensures zero wait-state transfers at 100 MHz burst rates, preventing pipeline stalls in real-time imaging pipelines. |
Use Scenario: Holding rendered cockpit display frames in flight management systems requiring guaranteed read availability during CPU resets. IC Role / Device Role / Timing Role: Dual-port accessible memory bank providing glitch-free frame output while background rendering occurs. Use Value: Independent BHE/BLE control allows simultaneous update of HUD symbology (upper byte) and map data (lower byte) without visual tearing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar static RAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61LV102416-10TLI | 10 ns access, 3.3 V, but uses TSOP-II-44 package and lacks BHE/BLE byte-enable logic | Requires external gating for byte-select writes; not pin-compatible with SOJ-44 footprint | Select when board redesign allows TSOP-II mounting and system firmware can manage full-word writes |
| AS6C1008-10TIN | 10 ns access, 3.3 V, SOJ-44 package, but no automatic CE power-down (ISB = 15 mA typical) | Higher standby current limits use in battery-powered avionics or portable medical devices | Prefer only where cost sensitivity outweighs 5× higher quiescent power and no data retention below 3.0 V |
Compared with IS61LV102416-10TLI and AS6C1008-10TIN, CY7C1021DV33-10ZSXI uniquely combines SOJ-44 pinout, true dual-byte enable, sub-3 mA CMOS standby, and 2.0 V data retention-making it the sole option for drop-in upgrades requiring all four features simultaneously.
Availability
CY7C1021DV33-10ZSXI is available at Aetrix Electronics and suitable for industrial PLC memory buffering, automotive body control modules, and medical diagnostic imaging buffers requiring stable component supply across extended product lifecycles.
Supply support for CY7C1021DV33-10ZSXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and aerospace applications with emphasis on signal integrity and long-term manufacturability.
CY7C1021DV33 belongs to Cypress's legacy high-speed SRAM product line, engineered specifically for deterministic, low-latency memory interfacing in real-time embedded controllers and safety-critical subsystems.
FAQ
Is CY7C1021DV33-10ZSXI pin-compatible with CY7C1021CV33?
Yes. CY7C1021DV33-10ZSXI is explicitly designed as a pin-and function-compatible upgrade to CY7C1021CV33, sharing identical SOJ-44 pinout, signal definitions, and DC/AC electrical specifications-including 10 ns access time and 3.3 V operation. No PCB or firmware changes are required for migration.
What is the minimum VCC required to retain data during power loss?
The device guarantees data retention down to VCC = 2.0 V, as specified in the Data Retention Characteristics table. At this voltage, ISB2 remains ≤3 mA, allowing sustained retention for minutes to hours depending on backup capacitance-verified per Figure 2 waveform in Rev. *H datasheet.
Can CY7C1021DV33-10ZSXI operate reliably at 85 °C ambient?
Yes. The -10ZSXI suffix denotes Industrial/Automotive-A qualification, with full AC/DC parameter compliance verified from –40 °C to +85 °C ambient. Thermal resistance (θJA = 59.52 °C/W for SOJ) ensures junction temperature stays within safe limits under typical airflow and PCB copper area conditions.
Does the device support true concurrent read/write on upper and lower bytes?
No. While BHE and BLE allow independent byte write enable, the device performs single-cycle reads or writes per address location. Concurrent access requires external arbitration; the architecture supports sequential byte updates within one 10 ns cycle but not simultaneous dual-port operation.
CY7C1021DV33-10ZSXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 64K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY7C1021DV33-10ZSXI FAQ
1.How can I place an order for CY7C1021DV33-10ZSXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1021DV33-10ZSXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1021DV33-10ZSXI reliable?
The price and inventory of CY7C1021DV33-10ZSXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1021DV33-10ZSXI is usually 5 days.
3.What payment methods are accepted for CY7C1021DV33-10ZSXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1021DV33-10ZSXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1021DV33-10ZSXI?
CY7C1021DV33-10ZSXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1021DV33-10ZSXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1021DV33-10ZSXI?
For technical support, including CY7C1021DV33-10ZSXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1021DV33-10ZSXI requirements.
6.How does Aetrix verify that CY7C1021DV33-10ZSXI is sourced from the original manufacturer or authorized distributors?
All CY7C1021DV33-10ZSXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1021DV33-10ZSXI meets industry standards.
7.What is the process for return or replacement of CY7C1021DV33-10ZSXI?
All CY7C1021DV33-10ZSXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1021DV33-10ZSXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1021DV33-10ZSXI part is unused and in its original packaging.
Return procedure for CY7C1021DV33-10ZSXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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