Infineon Technologies CY7C1041CV33-10BAJXE

Overview

CY7C1041CV33-10BAJXE from Cypress Semiconductor is an automotive-grade 4-Mbit (256 K × 16) CMOS static RAM with 10 ns access time, operating over –40 °C to +125 °C, supporting 3.3 V ±10% supply, and featuring independent byte enable (BHE/BLE) for high-speed memory expansion in engine control units and ADAS domain controllers.

For engineers reviewing the CY7C1041CV33-10BAJXE datasheet, CY7C1041CV33-10BAJXE pinout, CY7C1041CV33-10BAJXE application, or CY7C1041CV33-10BAJXE equivalent, key selection criteria include tAA = 10 ns read timing, automatic CE-controlled power-down (ISB2 ≤ 15 mA), dual-byte write capability, BGA-48 packaging, and automotive-E qualification per AEC-Q100.

Technical Context

This SRAM implements a synchronous, non-volatile-retentive memory array organized as 262,144 × 16 bits with full address decoding (A0–A17), sense amplifiers, and data drivers. It supports three active read modes (address-, CE-, or OE-controlled) and two write modes (CE- or byte-enable-controlled), with all I/Os entering high-impedance state when CE, OE, BHE, or BLE are deasserted.

The device uses TTL/CMOS-compatible input thresholds (VIH ≥ 2.0 V, VIL ≤ 0.8 V), features 8 pF input/output capacitance, and achieves thermal resistance of θJA = 38.15 °C/W on a four-layer PCB - enabling stable operation under transient thermal loads in under-hood environments.

Key Specifications

Pinout & Package

48-ball BGA package (JEDEC MO-270AB, 9 mm × 9 mm body, 0.8 mm ball pitch), RoHS-compliant, Pb-free, with 4 NC (no-connect) balls (pins A1, D1, G1, H11).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive SRAM applications.

Compared with IS61WV25616EDBLL-10MLI and AS6C4008-10BIN, CY7C1041CV33-10BAJXE uniquely delivers AEC-Q100 Grade 1 qualification, true dual-byte control, and BGA-48 packaging - making it the only drop-in solution for safety-critical automotive memory subsystems requiring guaranteed operation at 125 °C.

Availability

CY7C1041CV33-10BAJXE is available at Aetrix Electronics and suitable for engine control units, ADAS radar processors, body control modules, and infotainment head units requiring stable component supply across extended automotive lifecycles.

Supply support for CY7C1041CV33-10BAJXE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and microcontroller solutions for automotive, industrial, and IoT applications, with focus on functional safety and long-term supply stability.

The CY7C1041CV33 belongs to Cypress's automotive SRAM product line, engineered specifically for AEC-Q100-compliant, high-speed parallel memory interfacing in safety-critical electronic control units.

FAQ

What is the minimum VCC required to retain data in CY7C1041CV33-10BAJXE?

The device guarantees data retention down to 2.0 V VCC across the full automotive temperature range (–40 °C to +125 °C). This specification is verified per AEC-Q100 stress testing and enables reliable operation during engine cranking when battery voltage drops to 6–7 V and LDO output sags accordingly.

Does CY7C1041CV33-10BAJXE support true simultaneous read/write on upper and lower bytes?

No - the device does not support true simultaneous read/write. BHE and BLE control write enable only; reads require OE and CE assertion and affect the entire 16-bit word. However, independent byte enables allow selective writing to either byte without disturbing the other, reducing software overhead in partial-update scenarios.

How is power-down triggered, and what is the recovery latency?

Power-down is automatically initiated when CE is driven HIGH while the device is deselected. Recovery to active operation requires CE LOW followed by tPU = 100 µs minimum delay before first valid access. This delay is fixed and independent of clock or external timing signals.

Are the NC pins on the 48-ball BGA required to be grounded or left floating?

NC pins (A1, D1, G1, H11) are not connected to the die and must be left unconnected - neither grounded nor tied to VCC. Solder mask should fully cover these pads to prevent accidental shorts; no thermal or electrical function is assigned to them per Cypress Package Drawing 001-86495.