Infineon Technologies CY7C1041CV33-10BAJXET

Overview

CY7C1041CV33-10BAJXET from Cypress Semiconductor is an automotive-grade 4-Mbit (256 K × 16) CMOS static RAM with 10 ns access time, 3.3 V ±10% supply, and –40 °C to +125 °C operation. It supports independent byte write via BHE/BLE controls, automatic CE power-down (15 mA standby), and high-speed read/write cycles in BGA48 packaging. Used in engine control units for real-time sensor data buffering.

For engineers reviewing the CY7C1041CV33-10BAJXET datasheet, CY7C1041CV33-10BAJXET pinout, CY7C1041CV33-10BAJXET application, or CY7C1041CV33-10BAJXET equivalent, key selection criteria include tAA ≤ 10 ns, ISB2 ≤ 15 mA at automotive temperature, BGA48 thermal resistance (θJA = 38.15 °C/W), and dual-byte enable timing compatibility with ASIL-B–compliant microcontrollers.

Technical Context

This SRAM implements a synchronous, non-volatile-retentive memory array organized as 262,144 × 16 bits with full address decoding (A0–A17). Read and write operations are controlled by CE, OE, WE, BHE, and BLE with defined setup/hold and transition timing per JEDEC JESD8-12E.

It features two independent I/O byte lanes (I/O0–I/O7 and I/O8–I/O15), each with dedicated enable logic and high-impedance control. Power management relies on CE-driven automatic power-down, reducing ICC to 15 mA (ISB2) when CE is deasserted under CMOS input conditions.

Key Specifications

Pinout & Package

Package: 48-ball BGA (9 mm × 9 mm, 0.8 mm pitch), RoHS-compliant, with thermal pad on underside for PCB heat sinking.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed automotive SRAM applications.

Compared with IS61WV25616EDBLL-10BLI and AS6C4008-10BIN, CY7C1041CV33-10BAJXET uniquely delivers AEC-Q100 Grade 1 qualification, true dual-byte write capability, and 125 °C operation-enabling single-SRAM solutions in ASIL-B–rated powertrain systems without derating or external support logic.

Availability

CY7C1041CV33-10BAJXET is available at Aetrix Electronics and suitable for engine control units, ADAS camera modules, and electric power steering controllers requiring stable component supply across automotive production lifecycles.

Supply support for CY7C1041CV33-10BAJXET includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor, now part of Infineon Technologies, designs high-reliability memory and microcontroller solutions for automotive, industrial, and IoT applications.

The CY7C1041CV33 belongs to Cypress's automotive SRAM product line, engineered specifically for ASIL-B–compliant real-time control systems requiring deterministic timing, extended temperature operation, and robust power management.

FAQ

What is the minimum VCC required to retain data in CY7C1041CV33-10BAJXET?

Data retention is guaranteed down to 2.0 V across the full –40 °C to +125 °C temperature range. This allows the device to maintain stored calibration values during brown-out conditions where battery voltage drops to 2.2 V, ensuring no loss of critical ECU parameters during cranking or alternator failure events.

Does CY7C1041CV33-10BAJXET support true simultaneous read/write on high and low bytes?

No-it does not support true simultaneous read/write. While BHE and BLE allow independent byte write enable, reads require OE activation and are always full 16-bit or byte-selectable outputs. The device operates in strict read-or-write mode per cycle, with no internal dual-port architecture.

How is thermal performance validated for the 48-ball BGA package?

Thermal resistance is characterized per JEDEC JESD51-2: θJA = 38.15 °C/W measured on a 3 × 4.5 inch, four-layer PCB with 2 oz copper and defined copper pour patterns. θJC = 9.15 °C/W confirms efficient heat transfer from die to case, enabling junction temperatures below 150 °C at 125 °C ambient and full load.

Can NC pins on CY7C1041CV33-10BAJXET be used as vias or grounded for mechanical stability?

No-NC pins are unconnected on-die and must remain floating per datasheet guidance. Routing traces to or soldering NC balls risks internal shorting or contamination-induced reliability failure. Mechanical stability should be achieved via proper BGA reflow profile and board-level stiffeners, not NC pin utilization.