Infineon Technologies CY7C1041CV33-10BAXAT
- Part No.:
- CY7C1041CV33-10BAXAT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
CY7C1041CV33-10BAXAT.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 48FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1041CV33-10BAXAT from Cypress Semiconductor is an automotive-grade 4-Mbit (256 K × 16) CMOS static RAM with 10 ns access time, TTL-compatible I/O, and dual-byte write control via BHE/BLE. It operates across –40 °C to +125 °C (Automotive-E grade), supports automatic CE power-down (15 mA max standby), and is packaged in a 44-pin 400-mil SOJ. Used for real-time data buffering in engine control units and ADAS domain controllers.
For engineers reviewing the CY7C1041CV33-10BAXAT datasheet, CY7C1041CV33-10BAXAT pinout, CY7C1041CV33-10BAXAT application, or CY7C1041CV33-10BAXAT equivalent, key selection criteria include its 10 ns tAA timing at 3.3 V, byte-selectable 16-bit I/O architecture, Automotive-E temperature compliance, and SOJ package compatibility with legacy PCB footprints.
Technical Context
This SRAM implements a synchronous, non-volatile-access memory array organized as 262,144 × 16 bits, with independent high- and low-byte enable paths (BHE/BLE) enabling partial-word writes without read-modify-write cycles. Address decoding uses hierarchical row/column architecture with sense amplifiers driving bidirectional I/O lines.
All control inputs (CE, WE, OE, BHE, BLE) are active-low and TTL-compatible. Output enable (OE) and chip enable (CE) jointly manage tri-state behavior: outputs enter high-impedance state when CE is HIGH, OE is HIGH, or during write operations (WE LOW). Power-down is fully automatic upon CE deassertion.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4 Mbit (256 K × 16); enables storage of 32 KB of 16-bit data per device, suitable for firmware scratchpad or sensor FIFO buffers. |
| Access Time (tAA) | 10 ns at 3.3 V, –40 °C to +125 °C; ensures deterministic latency for real-time microcontroller interfaces in safety-critical ECUs. |
| Supply Voltage | 3.3 V ±10%; compatible with standard automotive LDO rails and eliminates need for level-shifting circuitry. |
| Standby Current (ISB2) | 15 µA max at VCC = 3.63 V, TA = 125 °C; reduces quiescent power in always-on vehicle modules like telematics gateways. |
| I/O Interface | TTL-compatible inputs/outputs; allows direct connection to legacy MCU GPIOs without interface logic or voltage translators. |
| Byte Enable Control | Separate BHE (I/O15–I/O8) and BLE (I/O7–I/O0); permits atomic 8-bit updates in mixed-endian systems without bus contention. |
| Thermal Resistance (θJA) | 25.99 °C/W (44-pin SOJ); supports operation up to 125 °C ambient without forced airflow in under-hood applications. |
Pinout & Package
Package: 44-pin 400-mil SOJ (Small Outline J-Lead), JEDEC MS-025 compliant, lead-free (Pb-free) finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Input | 18-bit address bus supporting full 256K-word addressing; A0–A17 mapped directly to physical memory locations. |
| I/O0–I/O7 | Bidirectional Data (Low Byte) | Low-byte data path enabled by BLE; used for LSB-aligned transfers in 16-bit microprocessor buses. |
| I/O8–I/O15 | Bidirectional Data (High Byte) | High-byte data path enabled by BHE; enables independent update of upper byte in mixed-data-width peripherals. |
| CE | Chip Enable (Active Low) | Primary device select; forces full power-down and high-Z I/O when HIGH, reducing system-level leakage. |
| WE | Write Enable (Active Low) | Controls write initiation; must be LOW with CE LOW and BHE/BLE LOW to latch data into memory array. |
| OE | Output Enable (Active Low) | Enables output drivers only during reads; tri-states I/O when HIGH, preventing bus conflicts during writes. |
| BHE / BLE | Byte High / Low Enable (Active Low) | Independent gating of high/low byte paths; eliminates need for external byte-mask logic in 8-bit peripheral interfacing. |
| VCC | Power Supply | 3.3 V supply input; two dedicated pins (pins 11 & 33) reduce IR drop and improve noise immunity on dense PCBs. |
| VSS | Ground | System ground reference; two dedicated pins (pins 12 & 34) provide low-inductance return path for switching currents. |
Key Features
| Feature | Design Value |
|---|---|
| Automotive Temperature Range | Qualified to –40 °C to +125 °C (Automotive-E), meeting AEC-Q100 Grade 1 requirements for under-hood ECU use. |
| Dual-Byte Write Architecture | Independent BHE/BLE control enables true 8-bit partial writes without read-modify-write overhead, reducing CPU cycle count. |
| Automatic CE Power-Down | Reduces ICC to 15 µA (max) when CE is HIGH, eliminating need for external power-gating circuitry in sleep modes. |
| TTL-Compatible Signaling | VIH = 2.0 V min, VOL = 0.4 V max at 8 mA drive - interoperable with legacy 3.3 V MCUs (e.g., Infineon TC1797, NXP MPC56xx) without level shifters. |
| SOJ Package Footprint | 44-pin 400-mil SOJ matches legacy Cypress CY7C1041BNV33 layout, enabling drop-in replacement in existing automotive PCB designs. |
Applications
| Engine Control Unit (ECU) | Advanced Driver Assistance Systems (ADAS) |
|---|---|
|
Use Scenario: Real-time calibration parameter storage and sensor data buffering during closed-loop combustion control. IC Role / Device Role / Timing Role: High-speed scratchpad memory for transient engine maps, accessed synchronously with 10 ns latency by 32-bit RISC cores. Use Value: Enables sub-millisecond map interpolation and fault logging without CPU stall, critical for ISO 26262 ASIL-B timing compliance. |
Use Scenario: Frame buffer for radar pre-processing units handling 77 GHz FMCW signal digitization. IC Role / Device Role / Timing Role: Dual-port-capable SRAM staging raw ADC samples before FFT acceleration, leveraging BHE/BLE for parallel byte writes. Use Value: Eliminates DMA bottlenecks by allowing concurrent high/low byte writes from parallel ADC channels, sustaining 200 MB/s throughput. |
| Body Control Module (BCM) | Infotainment Head Unit |
|
Use Scenario: Non-volatile configuration storage for lighting sequences, window position memory, and door lock state retention. IC Role / Device Role / Timing Role: Low-power standby memory holding EEPROM-like settings while main SoC sleeps; powered via always-on rail. Use Value: Achieves 15 µA ISB2 current at 125 °C, extending battery runtime in parked vehicle mode beyond 30 days. |
Use Scenario: Audio codec buffer for multi-channel digital signal processing in premium audio amplifiers. IC Role / Device Role / Timing Role: Low-latency data exchange between DSP core and audio DAC/ADC, synchronized to I²S frame clocks. Use Value: 10 ns tAA ensures zero-buffer-underrun during dynamic volume ramping and bass boost processing at 96 kHz sample rates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed automotive SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61WV25616EDBLL-10MLI | Same density (256K × 16), 10 ns access, but rated –40 °C to +85 °C (Industrial), not Automotive-E. | Lacks AEC-Q100 qualification; unsuitable for under-hood placement but acceptable for cabin modules. | Select when cost sensitivity outweighs extended temperature requirement and AEC-Q100 is not mandated. |
| Cypress CY7C1041DV33-10ZXC | Same die, but in 48-ball FBGA package; θJA = 38.15 °C/W vs. SOJ's 25.99 °C/W; no pin compatibility. | Enables higher board density but requires PCB redesign; thermal performance less robust in convection-limited spaces. | Select for space-constrained infotainment modules where thermal margin exceeds 25 °C and rework is feasible. |
Compared with IS61WV25616EDBLL-10MLI, CY7C1041CV33-10BAXAT delivers guaranteed 125 °C operation and AEC-Q100 compliance, while versus CY7C1041DV33-10ZXC, it offers superior thermal dissipation and mechanical reliability in vibration-prone SOJ form factor.
Availability
CY7C1041CV33-10BAXAT is available at Aetrix Electronics and suitable for engine control units, ADAS radar processors, and body control modules requiring stable component supply across automotive production lifecycles.
Supply support for CY7C1041CV33-10BAXAT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for automotive, industrial, and IoT markets, with global manufacturing and AEC-Q100 validation infrastructure.
CY7C1041CV33 belongs to Cypress's automotive SRAM product line, engineered specifically for deterministic, low-latency data buffering in safety-critical electronic control units operating under extreme thermal and EMI conditions.
FAQ
Is CY7C1041CV33-10BAXAT qualified to AEC-Q100?
Yes. This part is qualified to AEC-Q100 Grade 1 (–40 °C to +125 °C), with full stress testing including HTOL, TCT, and ESD per automotive standards. The "Automotive-E" designation in the datasheet confirms its qualification scope, and the BAXAT suffix denotes the 44-pin SOJ Pb-free package variant meeting automotive solderability and RoHS requirements.
What is the maximum clock frequency supported for burst reads?
The CY7C1041CV33-10BAXAT does not use a clock signal; it is an asynchronous SRAM. Its maximum effective throughput is governed by tRC = 10 ns, enabling up to 100 MHz random access rate. Burst reads rely on address sequencing and CE/OE timing - no internal clock limits apply, and no setup/hold clock constraints exist.
Can BHE and BLE be asserted simultaneously for full 16-bit writes?
Yes. Asserting both BHE and BLE LOW while CE and WE are LOW enables simultaneous writing of all 16 data bits (I/O0–I/O15) to the addressed location. This is the standard full-word write mode, documented in the Truth Table (page 11) and functional description - no timing penalty or conflict occurs when both byte enables are active.
Does this SRAM retain data during VCC brown-out events?
No. As a volatile static RAM, CY7C1041CV33-10BAXAT requires continuous VCC within 3.3 V ±10% to retain data. Below VCC(min) = 2.97 V, data retention is not guaranteed. For brown-out resilience, external circuitry (e.g., power-fail interrupt + controlled save-to-EEPROM) must be implemented - the device has no built-in non-volatility or backup power path.
CY7C1041CV33-10BAXAT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 48-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-FBGA (7x8.5)
CY7C1041CV33-10BAXAT FAQ
1.How can I place an order for CY7C1041CV33-10BAXAT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1041CV33-10BAXAT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1041CV33-10BAXAT reliable?
The price and inventory of CY7C1041CV33-10BAXAT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1041CV33-10BAXAT is usually 5 days.
3.What payment methods are accepted for CY7C1041CV33-10BAXAT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1041CV33-10BAXAT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1041CV33-10BAXAT?
CY7C1041CV33-10BAXAT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1041CV33-10BAXAT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1041CV33-10BAXAT?
For technical support, including CY7C1041CV33-10BAXAT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1041CV33-10BAXAT requirements.
6.How does Aetrix verify that CY7C1041CV33-10BAXAT is sourced from the original manufacturer or authorized distributors?
All CY7C1041CV33-10BAXAT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1041CV33-10BAXAT meets industry standards.
7.What is the process for return or replacement of CY7C1041CV33-10BAXAT?
All CY7C1041CV33-10BAXAT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1041CV33-10BAXAT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1041CV33-10BAXAT part is unused and in its original packaging.
Return procedure for CY7C1041CV33-10BAXAT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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