My Inquiry
My Account
Infineon Technologies CY7C1041CV33-10ZSXAT
- Part No.:
- CY7C1041CV33-10ZSXAT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1041CV33-10ZSXAT.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:
- Shipping:
Inventory:3,215
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1041CV33-10ZSXAT from Cypress Semiconductor is an automotive-grade 4-Mbit (256 K × 16) CMOS static RAM with 10 ns access time, TTL-compatible I/O, and dual-byte write enable (BHE/BLE). It operates across –40 °C to +125 °C (Automotive-E grade), supports automatic CE power-down (ISB2 ≤ 15 mA), and is packaged in a 44-pin TSOP II. It serves as main data buffer in engine control units requiring deterministic low-latency memory access.
For engineers reviewing the CY7C1041CV33-10ZSXAT datasheet, CY7C1041CV33-10ZSXAT pinout, CY7C1041CV33-10ZSXAT application, or CY7C1041CV33-10ZSXAT equivalent, key selection criteria include tAA = 10 ns at 125 °C, VCC = 3.3 V ±10%, byte-selectable 16-bit I/O, CE/OE/WE control logic, and Automotive-E qualification per AEC-Q100.
Technical Context
The device implements a synchronous, non-volatile-independent SRAM array organized as 262,144 × 16 bits, with independent high- and low-byte write enables (BHE/BLE) enabling partial-word writes without read-modify-write cycles. Address decoding uses hierarchical row/column architecture with sense amplifiers for stable data retrieval under transient noise.
All control inputs (CE, OE, WE, BHE, BLE) are active-low and fully TTL-compatible (VIH ≥ 2.0 V, VIL ≤ 0.8 V). Output drivers support 8 mA sink capability (VOL ≤ 0.4 V), while input leakage remains ≤ ±20 µA over full temperature range, ensuring robust interfacing with microcontroller address/data buses.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 4 Mbit (256 K × 16) - provides 512 KB of fast, random-access storage for real-time firmware variables and sensor buffers. |
| Access Time (tAA) | 10 ns max at –40 °C to +125 °C - guarantees deterministic latency for safety-critical ECU timing budgets. |
| VCC Supply | 3.3 V ±10% - matches standard automotive MCU core I/O voltage rails without level-shifting. |
| Standby Current (ISB2) | 15 mA max at 125 °C - enables low-power sleep modes during vehicle ignition-off states. |
| Operating Temp | –40 °C to +125 °C (Automotive-E) - qualified per AEC-Q100 Grade 0 for under-hood deployment. |
| I/O Interface | TTL-compatible (VIH ≥ 2.0 V, VOL ≤ 0.4 V @ 8 mA) - ensures direct connection to legacy 3.3 V microcontrollers. |
| Package | 44-pin TSOP II (10.16 mm × 20.95 mm) - surface-mount compatible with automated SMT assembly and thermal relief via VCC/VSS pin distribution. |
Pinout & Package
44-pin TSOP II (10.16 mm × 20.95 mm, 0.8 mm pitch), RoHS-compliant, with exposed pad not present. Pin 1 marked by notch; top view shown in datasheet Figure 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Input | 18-bit address bus selecting one of 262,144 locations; no internal latching - requires stable address before CE/OE assertion. |
| I/O0–I/O7 | Bidirectional Data (Low Byte) | 8-bit data path enabled only when BLE = LOW; tri-stated when BLE = HIGH or CE = HIGH. |
| I/O8–I/O15 | Bidirectional Data (High Byte) | 8-bit data path enabled only when BHE = LOW; independent control allows 8-bit peripheral coexistence on same bus. |
| CE | Chip Enable (Active Low) | Primary chip select; forces automatic power-down (ISB2) when HIGH, reducing system standby current. |
| OE | Output Enable (Active Low) | Controls output driver state; HIGH disables outputs (tri-state), essential for bus sharing with other peripherals. |
| WE | Write Enable (Active Low) | Initiates write cycle when CE and WE both LOW; rising edge terminates write, defining tPWE minimum pulse width (7 ns). |
| BHE / BLE | Byte Write Enable (Active Low) | Independent gating of high/low byte paths - enables 8-bit writes without disturbing adjacent byte in 16-bit word. |
| VCC | Power Supply | Two dedicated pins (pins 11, 33) reduce IR drop and improve noise immunity on 3.3 V rail. |
| VSS | Ground | Two dedicated ground pins (pins 12, 34) provide low-inductance return path for switching currents. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-byte write control (BHE/BLE) | Enables partial-word writes to I/O0–I/O7 or I/O8–I/O15 independently - eliminates need for external byte masking logic in 8-bit peripheral interfaces. |
| Automatic CE power-down | Reduces ICC to ≤15 mA at 125 °C when CE = HIGH - cuts idle power in always-on vehicle modules without software intervention. |
| 10 ns tAA at 125 °C | Meets hard real-time deadlines in engine control loops where memory latency directly impacts PID loop stability. |
| TTL-compatible I/O | Direct interface with legacy 3.3 V MCUs (e.g., Infineon TC2xx, NXP S32K) without level shifters - simplifies PCB routing and BOM. |
| AEC-Q100 Grade 0 qualification | Validated for operation up to +125 °C ambient with extended reliability testing - suitable for transmission control and brake ECU placement. |
Applications
| Engine Control Unit (ECU) | Transmission Control Module (TCM) |
|---|---|
|
Use Scenario: Real-time storage of crankshaft position lookup tables and fuel injection timing parameters updated every 10 ms. IC Role / Device Role / Timing Role: Primary volatile data buffer with deterministic 10 ns access, synchronized to 40 MHz MCU bus clock. Use Value: Eliminates wait states during critical combustion cycle calculations, maintaining <500 ns jitter budget for spark timing. |
Use Scenario: Storing gear ratio calibration maps and torque converter slip compensation coefficients accessed during shift events. IC Role / Device Role / Timing Role: High-reliability scratchpad memory supporting concurrent read/write via BHE/BLE for dual-clutch actuation sequencing. Use Value: Enables atomic 8-bit updates to clutch pressure tables without corrupting adjacent torque values during 50 ms shift windows. |
| Advanced Driver Assistance System (ADAS) Camera ECU | Electric Power Steering (EPS) Controller |
|
Use Scenario: Frame buffering for 1280×720 image preprocessing pipeline running at 30 fps with motion detection algorithms. IC Role / Device Role / Timing Role: Low-latency line buffer between image sensor interface and DSP core, operating in burst-read mode. Use Value: Sustains 1.2 GB/s effective bandwidth using tRC = 10 ns and interleaved CE/OE cycling - avoids frame drops during lane detection. |
Use Scenario: Storing motor phase current feedback history and assist-torque correction factors updated at 10 kHz sampling rate. IC Role / Device Role / Timing Role: Deterministic-access scratchpad supporting closed-loop current control with <1 µs memory access jitter. Use Value: Maintains torque ripple <±0.5 N·m by guaranteeing 10 ns tAA even at junction temperature of 110 °C under hood. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV25616EDBLL-10MLI | Same density (256 K × 16), 10 ns tAA, but rated –40 °C to +85 °C only (Industrial grade); no AEC-Q100 certification. | Not qualified for under-hood use; limited to cabin modules like infotainment or HVAC control. | Select only if operating ambient stays ≤85 °C and AEC-Q100 is not mandated by OEM Tier 1 requirements. |
| AS6C4008-10TIN | 4-Mbit (512 K × 8) organization; single-byte interface; tAA = 10 ns; AEC-Q100 Grade 2 (–40 °C to +105 °C). | Requires external byte-width adaptation for 16-bit MCU buses; lower max temperature than CY7C1041CV33-10ZSXAT. | Choose when system uses 8-bit data path or when 105 °C max ambient suffices and cost-per-bit is prioritized over interface simplicity. |
Compared with IS61WV25616EDBLL-10MLI and AS6C4008-10TIN, CY7C1041CV33-10ZSXAT uniquely delivers 16-bit native interface, AEC-Q100 Grade 0 qualification, and dual-byte write control - making it the only option for safety-critical 125 °C under-hood applications requiring zero-wait-state 16-bit data transfers.
Availability
CY7C1041CV33-10ZSXAT is available at Aetrix Electronics and suitable for engine control units, transmission control modules, and ADAS camera ECUs requiring stable component supply across automotive production lifecycles.
Supply support for CY7C1041CV33-10ZSXAT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for automotive, industrial, and IoT systems, with global manufacturing and quality certifications including IATF 16949.
CY7C1041CV33 belongs to Cypress's automotive SRAM product line, engineered specifically for AEC-Q100-compliant, high-speed, low-power data buffering in engine, transmission, and chassis control systems.
FAQ
Is CY7C1041CV33-10ZSXAT pin-compatible with CY7C1041BNV33?
Yes - the datasheet explicitly states pin and function compatibility with CY7C1041BNV33. Both share identical 44-pin TSOP II pinout, address/data/control signal mapping, and timing behavior, enabling drop-in replacement in existing designs without layout changes.
What is the maximum junction temperature during continuous operation at 125 °C ambient?
With θJA = 42.96 °C/W (TSOP II) and max ICC = 130 mA at 3.3 V, power dissipation is 429 mW; junction temperature rise is 18.4 °C, resulting in TJ = 143.4 °C - within the device's 150 °C absolute maximum rating per datasheet page 5.
Does CY7C1041CV33-10ZSXAT support asynchronous burst reads?
No - it is a classic asynchronous SRAM with no internal burst counter or sequential address generation. All accesses require full 18-bit address assertion per cycle; burst behavior must be implemented externally via controller logic or address sequencer.
Can BHE and BLE be asserted simultaneously for full 16-bit writes?
Yes - asserting both BHE and BLE LOW enables concurrent write to I/O0–I/O15. The truth table on page 11 confirms that when CE and WE are LOW and both byte enables are active, the entire 16-bit word is written atomically without intermediate states.
CY7C1041CV33-10ZSXAT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY7C1041CV33-10ZSXAT FAQ
1.How can I place an order for CY7C1041CV33-10ZSXAT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1041CV33-10ZSXAT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1041CV33-10ZSXAT reliable?
The price and inventory of CY7C1041CV33-10ZSXAT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1041CV33-10ZSXAT is usually 5 days.
3.What payment methods are accepted for CY7C1041CV33-10ZSXAT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1041CV33-10ZSXAT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1041CV33-10ZSXAT?
CY7C1041CV33-10ZSXAT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1041CV33-10ZSXAT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1041CV33-10ZSXAT?
For technical support, including CY7C1041CV33-10ZSXAT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1041CV33-10ZSXAT requirements.
6.How does Aetrix verify that CY7C1041CV33-10ZSXAT is sourced from the original manufacturer or authorized distributors?
All CY7C1041CV33-10ZSXAT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1041CV33-10ZSXAT meets industry standards.
7.What is the process for return or replacement of CY7C1041CV33-10ZSXAT?
All CY7C1041CV33-10ZSXAT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1041CV33-10ZSXAT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1041CV33-10ZSXAT part is unused and in its original packaging.
Return procedure for CY7C1041CV33-10ZSXAT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1041CV33-10ZSXAT Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
