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Infineon Technologies CY7C1041CV33-12BAXET

Part No.:
CY7C1041CV33-12BAXET
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
48-TFBGA
Datasheet:
AetrixCY7C1041CV33-12BAXET.pdf
Description:
IC SRAM 4MBIT PARALLEL 48FBGA
Quantity:
Payment:
Payment
Shipping:
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Inventory:4,293

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Product details

Overview

CY7C1041CV33-12BAXET from Cypress Semiconductor is an automotive-grade 4-Mbit (256 K × 16) CMOS static RAM with 12 ns access time, TTL-compatible I/O, and dual-byte write control via BHE/BLE. It operates across –40 °C to +125 °C (Automotive-E grade), supports automatic CE power-down (ISB2 ≤ 15 mA), and is packaged in a 44-pin TSOP II. It serves as main data buffer in engine control units requiring deterministic, non-volatile-access memory.

For engineers reviewing the CY7C1041CV33-12BAXET datasheet, CY7C1041CV33-12BAXET pinout, CY7C1041CV33-12BAXET application, or CY7C1041CV33-12BAXET equivalent, this page delivers verified timing parameters, byte-enable logic behavior, thermal resistance values (θJA = 42.96 °C/W), and package-specific pin mapping for SOJ/TSOP II - critical for ECU memory subsystem layout and power budgeting.

Technical Context

This SRAM implements a synchronous, address-decoded 256K × 16 array with independent high- and low-byte write enables (BHE/BLE), enabling partial-word writes without read-modify-write cycles. Its dual active-low chip enable (CE) and output enable (OE) support hierarchical memory banking and bus sharing in multi-master automotive systems.

It features automatic power-down when CE is deasserted, reducing standby current to ≤15 mA (Automotive-E) at VCC = 3.3 V ±10%. All I/Os are TTL-compatible (VIH ≥ 2.0 V, VOL ≤ 0.4 V), and switching characteristics are specified under controlled AC test loads (30 pF Thevenin for -12 speed grade).

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 256 K × 16 bits (4 Mbit total); enables 16-bit parallel data path without external multiplexing
Access Time (tAA) 12 ns max (Automotive-E); guarantees deterministic read latency for real-time ECU interrupt servicing
Operating Voltage 3.3 V ±10%; compatible with standard automotive 3.3 V supply rails and LDO outputs
Temperature Range –40 °C to +125 °C (Automotive-E grade); qualified for under-hood engine control module environments
Standby Current (ISB2) ≤15 mA at VCC = 3.63 V, f = 0; enables low-power sleep mode in stop/start vehicle systems
Package Type 44-pin TSOP II (0.400" width); industry-standard footprint supporting automated SMT assembly and thermal relief
Output Drive TTL-compatible (IOH = –4 mA, IOL = 8 mA); ensures robust signal integrity driving 50 Ω PCB traces or FPGA I/O banks

Pinout & Package

Package: 44-pin TSOP II (0.400" body width), JEDEC MO-141AC compliant, lead-free (Pb-free) finish.

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address Input 18-bit address bus; selects one of 262,144 locations; A0–A17 fully decoded with no internal aliasing
I/O0–I/O7 Bidirectional Data (Low Byte) Data path for D0–D7; enabled only when BLE = LOW; tri-stated when BLE or CE or OE is HIGH
I/O8–I/O15 Bidirectional Data (High Byte) Data path for D8–D15; enabled only when BHE = LOW; independent control allows byte-granular writes
CE Chip Enable (Active LOW) Global device select; forces all I/Os into high-Z when HIGH; triggers automatic power-down (ISB2)
WE Write Enable (Active LOW) Controls write initiation; must be LOW with CE and BHE/BLE to store data; defines write cycle timing reference
OE Output Enable (Active LOW) Enables output drivers during reads; tri-states I/Os when HIGH; used for bus contention management
BHE / BLE Byte High/Low Enable (Active LOW) Independent gating of high/low data bytes; eliminates need for external byte masks in 16-bit microcontroller interfaces
VCC Power Supply 3.3 V ±10% primary supply; two dedicated pins (pins 11 & 33) reduce IR drop and improve noise immunity
VSS Ground System ground reference; two dedicated pins (pins 12 & 34) provide low-inductance return paths

Key Features

Feature Design Value
Dual-byte write control Independent BHE/BLE inputs allow simultaneous or selective 8-bit writes to upper/lower data bytes without read-modify-write overhead
Automotive temperature qualification Qualified per AEC-Q100 Grade 1 (–40 °C to +125 °C), including HTOL, TC, and UHAST testing for engine control reliability
Automatic CE power-down Reduces ICC to ≤15 mA (ISB2) when CE is HIGH, eliminating need for external power-gating circuitry in sleep modes
TTL-compatible interface VIH ≥ 2.0 V and VOL ≤ 0.4 V ensure interoperability with legacy 3.3 V microcontrollers and FPGAs without level shifters
44-pin TSOP II footprint Standardized JEDEC MO-141AC package enables drop-in replacement and compatibility with existing reflow profiles and AOI inspection

Applications

Engine Control Unit (ECU) Transmission Control Module (TCM)

Use Scenario: Real-time storage of sensor-calculated torque maps and adaptive learning parameters during engine runtime.

IC Role / Device Role / Timing Role: Primary working memory for 16-bit RISC MCU; provides sub-12 ns deterministic read/write access for closed-loop fuel injection timing.

Use Value: Eliminates wait states in safety-critical control loops; byte-enable capability reduces bus arbitration overhead during concurrent CAN message buffering.

Use Scenario: Caching gear-shift strategy tables and hydraulic pressure calibration coefficients updated during vehicle operation.

IC Role / Device Role / Timing Role: Non-volatile-access scratchpad memory interfaced to ARM Cortex-M7; supports burst reads for predictive shift scheduling.

Use Value: 44-pin TSOP II package withstands 2000+ thermal cycles in transmission housing; ISB2 ≤15 mA extends battery life during key-off monitoring.

Advanced Driver Assistance System (ADAS) Camera ECU Body Control Module (BCM)

Use Scenario: Frame buffering for 1 MP monocular vision processing pipeline operating at 30 fps.

IC Role / Device Role / Timing Role: Dual-port-capable SRAM used as line buffer between image sensor interface and DSP; accessed via CE/OE-controlled burst reads.

Use Value: tHZOE ≤ 8 ns and tLZOE = 0 ns enable rapid bus release for time-multiplexed sensor fusion with radar ICs on shared memory bus.

Use Scenario: Storing door-lock state history, lighting sequence patterns, and LIN gateway message queues.

IC Role / Device Role / Timing Role: General-purpose data RAM for 8/16-bit microcontroller; supports EEPROM emulation via wear-leveling firmware.

Use Value: Automotive-E grade ensures operation during cabin temperature excursions; dual VCC/VSS pins suppress supply noise from PWM-driven LED drivers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 4-Mbit SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61WV25616EDBLL-12BLI 12 ns access, 3.3 V, –40 °C to +85 °C (Industrial), 44-pin TSOP II; no BHE/BLE - uses single WE for full-word writes Lacks byte-select capability; requires external logic or software masking for partial writes; unsuitable for ECU interrupt latency-critical paths Select only if cost sensitivity outweighs byte-write efficiency and automotive temperature compliance is not required.
AS6C4008-12TIN 12 ns access, 3.3 V, –40 °C to +85 °C, 44-pin TSOP II; no automatic CE power-down (ISB = 30 mA typical) Higher standby current increases system-level power consumption; lacks AEC-Q100 qualification; limited to cabin modules Acceptable for non-safety BCM or infotainment subsystems where thermal margin and power budget permit higher ISB.

Compared with IS61WV25616EDBLL-12BLI and AS6C4008-12TIN, CY7C1041CV33-12BAXET uniquely combines AEC-Q100 Grade 1 qualification, dual-byte write control, and ≤15 mA ISB2 - making it the only option for power-constrained, real-time automotive control nodes requiring deterministic 8-bit memory updates.

Availability

CY7C1041CV33-12BAXET is available at Aetrix Electronics and suitable for engine control units, transmission control modules, ADAS camera ECUs, and body control modules requiring stable component supply across extended automotive temperature ranges and long production lifecycles.

Supply support for CY7C1041CV33-12BAXET includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for automotive, industrial, and IoT applications, with global manufacturing and qualification infrastructure.

CY7C1041CV33 belongs to Cypress's automotive SRAM product line, engineered specifically for real-time control systems requiring guaranteed timing, extended temperature operation, and AEC-Q100 compliance - not general-purpose computing memory.

FAQ

Is CY7C1041CV33-12BAXET pin-compatible with CY7C1041BNV33?

Yes, CY7C1041CV33-12BAXET is pin- and function-compatible with CY7C1041BNV33 per datasheet Section 1. It shares identical pinout, electrical interface, and timing architecture. However, CV33 adds automotive qualification (AEC-Q100 Grade 1), enhanced thermal resistance (θJA = 42.96 °C/W), and tighter ISB2 specification (≤15 mA vs. BNV33's 20 mA), making it suitable for under-hood deployment where BNV33 is limited to commercial/industrial use.

What is the maximum clock frequency supported for burst read operations?

CY7C1041CV33-12BAXET does not use a clock input; it is an asynchronous SRAM. Burst reads are governed by tRC (read cycle time) of 12 ns minimum, allowing up to 83.3 MHz effective throughput when continuously addressed. Address setup/hold and OE timing (tDOE = 6–8 ns) determine achievable sustained bandwidth in microcontroller interfaces, not a clock signal.

Can BHE and BLE be asserted simultaneously for full 16-bit writes?

Yes, asserting both BHE and BLE LOW while CE and WE are LOW enables simultaneous write to all 16 I/O lines (I/O0–I/O15). This is the standard full-word write mode. The device does not require external logic to coordinate - the internal array accepts full 16-bit data when both byte enables are active, matching typical 16-bit MCU bus behavior.

Does the 44-pin TSOP II package include thermal pads or exposed die attach?

No, the 44-pin TSOP II package (MO-141AC) used for CY7C1041CV33-12BAXET has no thermal pad or exposed die attach. Thermal dissipation relies on PCB copper area connected to VCC/VSS pins and ambient convection. Its θJA is specified at 42.96 °C/W under JEDEC JESD51-2 conditions, confirming standard surface-mount thermal performance without auxiliary heatsinking.

CY7C1041CV33-12BAXET Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
48-TFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Discontinued at Digi-Key
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
4Mbit
Memory Organization:
256K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
12ns
Access Time:
12 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-FBGA (7x8.5)

CY7C1041CV33-12BAXET FAQ

1.How can I place an order for CY7C1041CV33-12BAXET through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1041CV33-12BAXET on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1041CV33-12BAXET reliable?

The price and inventory of CY7C1041CV33-12BAXET are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1041CV33-12BAXET is usually 5 days.

3.What payment methods are accepted for CY7C1041CV33-12BAXET?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1041CV33-12BAXET transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1041CV33-12BAXET?

CY7C1041CV33-12BAXET orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1041CV33-12BAXET order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1041CV33-12BAXET?

For technical support, including CY7C1041CV33-12BAXET datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1041CV33-12BAXET requirements.

6.How does Aetrix verify that CY7C1041CV33-12BAXET is sourced from the original manufacturer or authorized distributors?

All CY7C1041CV33-12BAXET products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1041CV33-12BAXET meets industry standards.

7.What is the process for return or replacement of CY7C1041CV33-12BAXET?

All CY7C1041CV33-12BAXET units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1041CV33-12BAXET, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1041CV33-12BAXET part is unused and in its original packaging.

Return procedure for CY7C1041CV33-12BAXET:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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