Infineon Technologies CY7C1041CV33-12ZC
- Part No.:
- CY7C1041CV33-12ZC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1041CV33-12ZC.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1041CV33-12ZC from Cypress Semiconductor is a 4-Mbit (256K × 16) high-speed CMOS static RAM with 12 ns maximum access time, 3.3V supply, TTL-compatible I/O, and automatic CE-controlled power-down. It supports byte-wide write enable via BHE/ BLE pins and operates across industrial temperature range (–40°C to +85°C). Used in real-time data buffering for network packet processors and industrial PLC memory expansion.
For engineers reviewing the CY7C1041CV33-12ZC datasheet, CY7C1041CV33-12ZC pinout, CY7C1041CV33-12ZC application, or CY7C1041CV33-12ZC equivalent, key selection criteria include tAA = 12 ns access timing, 256K × 16 organization, dual-byte write control, CE/OE/WE active-L logic, and support for SOJ/TSOP II/FBGA packages with center VCC/VSS pinout.
Technical Context
The CY7C1041CV33-12ZC implements a synchronous, non-volatile-retentive SRAM architecture with independent high- and low-byte write enables (BHE/BLE), enabling partial-word writes without read-modify-write cycles. Its address decoding uses full 18-bit row/column decoding for 256K word selection.
It features TTL-compatible input thresholds (VIH = 2.0 V, VIL = 0.8 V) and output drive strength (IOH = –4 mA, IOL = 8 mA), ensuring interoperability with legacy 3.3V logic families. Power management relies on CE-driven automatic transition between active (ICC ≤ 95 mA) and standby (ISB2 = 10 mA) states.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 16 bits - provides 512 KB of contiguous, random-access storage with no refresh overhead. |
| Access Time (tAA) | 12 ns - guarantees deterministic read latency for real-time control loops operating up to 83 MHz. |
| Supply Voltage | 3.3 V ± 0.3 V - compatible with standard LVTTL and LVCMOS 3.3V I/O domains without level translation. |
| Operating Temperature | –40°C to +85°C - qualified for industrial environments including factory automation and motor drives. |
| Standby Current (ISB2) | 10 mA - enables low-power hold mode during processor sleep while retaining full memory contents. |
| Input/Output Compatibility | TTL-compatible - eliminates need for bus interface logic when connecting to FPGA or microcontroller GPIOs. |
| Package Options | 44-pin SOJ (400-mil), 44-pin TSOP II, 48-ball FBGA - supports legacy board layouts and space-constrained designs. |
Pinout & Package
Available in 44-pin SOJ (400-mil body width) and 44-pin TSOP II packages with center power/ground pinout, plus 48-ball FBGA. All variants share identical signal mapping and functional pin definitions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Input | 18-bit address bus selecting one of 262,144 memory locations; fully decoded internally. |
| I/O0–I/O7 / I/O8–I/O15 | Bidirectional Data Bus | Two independent 8-bit data ports; controlled separately by BLE (low byte) and BHE (high byte). |
| CE | Chip Enable | Active-L global select; forces device into high-Z or power-down state when deasserted. |
| OE | Output Enable | Active-L output gate; disables outputs (tri-states I/O) without affecting internal state or power mode. |
| WE | Write Enable | Active-L write strobe; initiates write cycle only when CE is also LOW. |
| BLE / BHE | Byte Write Enable | Independent active-L controls for lower/upper byte writes; enables partial-word updates without corruption. |
| VCC / VSS | Power / Ground | Dual VCC (pins 11, 33) and dual VSS (pins 12, 34) in SOJ/TSOP II reduce IR drop and improve noise immunity. |
Key Features
| Feature | Design Value |
|---|---|
| 12 ns access time with 3.3V supply | Enables direct interfacing with 80 MHz+ microcontrollers and FPGAs without wait states. |
| Automatic CE power-down mode | Reduces current to 10 mA (ISB2) when deselected-no external control logic required. |
| Separate BHE/BLE byte write control | Eliminates need for external byte masking logic in 16-bit systems with 8-bit peripheral interfaces. |
| 2.0V data retention voltage | Preserves memory contents during brown-out events down to 2.0V VCC, supporting graceful shutdown. |
| Pb-free and RoHS-compliant packaging | Meets IPC/JEDEC J-STD-020 reflow profiles for lead-free assembly in industrial manufacturing. |
Applications
| Industrial PLC Data Buffering | Network Packet Processor Cache |
|---|---|
|
Use Scenario: Storing transient frame headers and payload fragments during line-rate packet inspection in Layer 2/3 switches. IC Role / Device Role / Timing Role: High-speed, low-latency scratchpad memory interfaced directly to ASIC DMA engines. Use Value: 12 ns tAA ensures sub-100 ns round-trip memory access, enabling real-time forwarding decisions at 10 Gbps line rates. |
Use Scenario: Holding configuration tables and session state for programmable network processors handling VoIP and video traffic. IC Role / Device Role / Timing Role: Dual-port accessible SRAM used as instruction/data cache for RISC-based packet classification engines. Use Value: Independent BHE/BLE allows concurrent update of header metadata (low byte) and payload pointers (high byte) without bus contention. |
| Medical Imaging Frame Store | Automotive ADAS Preprocessing Buffer |
|
Use Scenario: Temporary storage of digitized X-ray or ultrasound scan lines before compression and transfer to host CPU. IC Role / Device Role / Timing Role: Burst-mode write buffer synchronized to ADC sampling clock; read out under DMA control. Use Value: 256K × 16 organization holds ≥128 scan lines of 16-bit pixel data, minimizing frame latency in real-time diagnostics. |
Use Scenario: Buffering raw radar echo samples from 77 GHz sensors prior to FFT processing in autonomous driving ECUs. IC Role / Device Role / Timing Role: Low-power standby-capable memory retaining critical sensor history during vehicle ignition cycles. Use Value: 2.0V data retention ensures zero data loss during cold cranking (battery dip to 2.2V), preserving safety-critical context. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61LV25616AL-12TQLI | Same 256K × 16 organization and 12 ns speed, but uses single VCC/VSS pair and lacks BHE/BLE; only 44-pin TSOP II package. | Lower pin count simplifies layout but requires external byte masking for partial writes. | Select when board space is constrained and byte-select functionality is not required. |
| ON Semiconductor MC14LC5481P | 512K × 8 organization (same density), 15 ns access, 5V-tolerant inputs, no automatic power-down. | Requires external CE gating for low-power operation and 16-bit data bus must be constructed from two devices. | Choose only for legacy 5V systems where 3.3V compatibility is not needed and higher latency is acceptable. |
Compared with IS61LV25616AL-12TQLI, CY7C1041CV33-12ZC offers superior byte-select flexibility and dual power/ground pins for noise reduction; versus MC14LC5481P, it delivers faster access, lower voltage operation, and integrated power management-critical for modern embedded systems.
Availability
CY7C1041CV33-12ZC is available at Aetrix Electronics and suitable for industrial PLC data buffering, network packet processor cache, and medical imaging frame store applications requiring stable component supply and long-term lifecycle support.
Supply support for CY7C1041CV33-12ZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable logic solutions for industrial, automotive, and communications markets.
The CY7C1041CV33 belongs to Cypress's high-speed parallel SRAM product line, engineered specifically for deterministic, low-latency data buffering in real-time embedded systems with stringent timing and power constraints.
FAQ
What is the minimum VCC required to retain data in CY7C1041CV33-12ZC?
Data retention is guaranteed down to 2.0 V VCC across the full industrial temperature range (–40°C to +85°C), as specified in the DC Electrical Characteristics table. Below 2.0 V, data integrity is not assured-even if the device remains powered-and system-level brown-out detection should trigger controlled shutdown before reaching this threshold.
Can CY7C1041CV33-12ZC operate with mixed 3.3V and 5V logic interfaces?
No-CY7C1041CV33-12ZC has strictly 3.3V-only I/O tolerance (VIH max = VCC + 0.3 V = 3.6 V). Applying 5V signals to any input-including OE, WE, or address pins-exceeds absolute maximum ratings and risks permanent damage. Level-shifting circuitry is mandatory for interfacing with 5V controllers.
Does the -12ZC speed grade guarantee 12 ns performance at all temperatures and voltages?
Yes-the 12 ns tAA specification is guaranteed over the full industrial operating range (–40°C to +85°C, VCC = 3.3 V ± 0.3 V), as confirmed in the AC Switching Characteristics table on page 5 of the datasheet. No derating is required for temperature or voltage within these limits.
How does automatic CE power-down differ from manual standby modes in other SRAMs?
When CE is driven HIGH, CY7C1041CV33-12ZC automatically enters ISB2 standby mode (10 mA max) without requiring OE or WE to be held in any specific state. This eliminates timing-critical sequencing requirements seen in SRAMs that mandate simultaneous assertion of multiple control signals to achieve low-power states.
CY7C1041CV33-12ZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Bag
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 12ns
- Access Time:
- 12 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY7C1041CV33-12ZC FAQ
1.How can I place an order for CY7C1041CV33-12ZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1041CV33-12ZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1041CV33-12ZC reliable?
The price and inventory of CY7C1041CV33-12ZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1041CV33-12ZC is usually 5 days.
3.What payment methods are accepted for CY7C1041CV33-12ZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1041CV33-12ZC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1041CV33-12ZC?
CY7C1041CV33-12ZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1041CV33-12ZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1041CV33-12ZC?
For technical support, including CY7C1041CV33-12ZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1041CV33-12ZC requirements.
6.How does Aetrix verify that CY7C1041CV33-12ZC is sourced from the original manufacturer or authorized distributors?
All CY7C1041CV33-12ZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1041CV33-12ZC meets industry standards.
7.What is the process for return or replacement of CY7C1041CV33-12ZC?
All CY7C1041CV33-12ZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1041CV33-12ZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1041CV33-12ZC part is unused and in its original packaging.
Return procedure for CY7C1041CV33-12ZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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