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Infineon Technologies CY7C1041CV33-12ZSXE

Part No.:
CY7C1041CV33-12ZSXE
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
44-TSOP (0.400", 10.16mm Width)
Datasheet:
AetrixCY7C1041CV33-12ZSXE.pdf
Description:
IC SRAM 4MBIT PARALLEL 44TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,495

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Product details

Overview

CY7C1041CV33-12ZSXE from Cypress Semiconductor is an automotive-grade 4-Mbit (256 K × 16) CMOS static RAM with 12 ns access time, TTL-compatible I/O, and dual-byte write enable (BHE/BLE) for flexible data bus control. It operates across –40 °C to +125 °C (Automotive-E grade), supports automatic CE power-down (ISB2 ≤ 15 mA), and is packaged in a 44-pin TSOP II.

For engineers reviewing the CY7C1041CV33-12ZSXE datasheet, CY7C1041CV33-12ZSXE pinout, CY7C1041CV33-12ZSXE application, or CY7C1041CV33-12ZSXE equivalent, this page delivers verified timing parameters, byte-select logic behavior, thermal resistance values (θJA = 42.96 °C/W), and real-world automotive memory expansion use cases.

Technical Context

This SRAM implements a synchronous, non-volatile-access architecture with independent high- and low-byte enables (BHE/BLE), enabling partial-word writes without external logic. Its address decoding supports full 18-bit addressing (A0–A17) for 262,144 × 16-bit organization and features tri-state I/Os controlled by CE, OE, BHE, and BLE.

Switching behavior is defined by strict AC timing: tAA = 12 ns (max), tRC = 12 ns (max), tDOE = 7 ns (max at Automotive-E), and tHZOE = 8 ns (max). Power management includes two standby modes-TTL-input ISB1 ≤ 45 mA and CMOS-input ISB2 ≤ 15 mA-activated automatically on CE HIGH.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Size 4 Mbit (256 K × 16); supports 16-bit parallel data bus with byte-level granularity via BHE/BLE.
Access Time (tAA) 12 ns max at –40 °C to +125 °C; ensures deterministic read latency in safety-critical automotive timing budgets.
Operating Voltage 3.3 V ±10%; compatible with standard automotive 3.3 V supply rails and interfaces directly with 3.3 V microcontrollers.
Standby Current (ISB2) 15 mA max at VCC = max, CMOS inputs; enables low-power sleep mode during ECU idle states.
Package 44-pin TSOP II (ZSXE suffix); 400-mil body, surface-mount, JEDEC-standard footprint for automated PCB assembly.
Thermal Resistance (θJA) 42.96 °C/W; validated for sustained operation under under-hood ambient conditions up to +125 °C.
I/O Compatibility TTL-compatible inputs/outputs; eliminates level-shifting requirements when interfacing with legacy 3.3 V logic families.

Pinout & Package

44-pin TSOP II (ZSXE) package with 400-mil width, lead pitch of 0.8 mm, and standard JEDEC MO-141AC footprint. Pin 1 marked by notch or dot; pins arranged in single row on each long edge.

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address Input 18-bit address bus; selects one of 262,144 memory locations; A17 is MSB for full 4-Mbit addressing.
I/O0–I/O7 Bidirectional Data (Low Byte) Data path for D0–D7; enabled only when BLE = LOW; tri-stated when BLE = HIGH or OE = HIGH.
I/O8–I/O15 Bidirectional Data (High Byte) Data path for D8–D15; enabled only when BHE = LOW; isolated from low byte for independent byte writes.
CE Chip Enable (Active LOW) Global select signal; forces device into standby (ISB2) when HIGH; required LOW for all read/write operations.
OE Output Enable (Active LOW) Controls output driver state; LOW enables I/O pins as outputs during read; HIGH places them in high-Z.
WE Write Enable (Active LOW) Initiates write cycle when CE and WE both LOW; determines write vs. read mode alongside OE state.
BHE / BLE Byte High / Low Enable (Active LOW) Independent controls for upper/lower 8-bit data lanes; enables partial-word writes without external gating logic.
VCC Power Supply 3.3 V ±10% supply input; two dedicated pins (pins 11 & 33) reduce IR drop and improve noise immunity.
VSS Ground System ground reference; two dedicated pins (pins 12 & 34) enhance return path integrity and EMI performance.

Key Features

Feature Design Value
Dual-byte write control (BHE/BLE) Enables independent 8-bit writes to upper or lower data byte without masking logic or extra glue ICs.
Automatic CE power-down Reduces current to ≤15 mA (ISB2) when CE is deasserted, eliminating need for external power-gating circuitry.
Automotive temperature range Qualified for –40 °C to +125 °C (Automotive-E), supporting engine control, ADAS, and transmission ECU deployments.
TTL-compatible I/O Direct interface with 3.3 V microcontrollers and FPGAs without level shifters; VIH = 2.0 V min, VOL = 0.4 V max.
Multiple package options Available in 44-pin SOJ, 44-pin TSOP II (ZSXE), and 48-ball FBGA-enabling layout flexibility across cost, density, and thermal constraints.

Applications

Engine Control Unit (ECU) Advanced Driver Assistance Systems (ADAS)

Use Scenario: Real-time storage of sensor fusion buffers and actuator command history during closed-loop engine timing control.

IC Role / Device Role / Timing Role: High-speed, non-refreshing scratchpad memory for deterministic 12 ns read/write cycles synchronized to MCU clock edges.

Use Value: Eliminates DRAM refresh overhead and guarantees sub-15 ns data availability for misfire detection and knock correction algorithms.

Use Scenario: Frame buffering for radar pre-processing pipelines in 77 GHz automotive radar modules.

IC Role / Device Role / Timing Role: Dual-port-capable SRAM used as ping-pong buffer between ADC capture and DSP FFT engines.

Use Value: Byte-select capability allows simultaneous 8-bit metadata tagging and 16-bit sample storage, reducing inter-processor handshaking latency.

Transmission Control Module (TCM) Body Control Module (BCM)

Use Scenario: Storing gear-shift strategy tables and torque-map interpolation coefficients accessed during dynamic load transitions.

IC Role / Device Role / Timing Role: Nonvolatile-access memory mapped into MCU's external bus interface with CE/OE-controlled burst reads.

Use Value: 42.96 °C/W θJA enables reliable operation adjacent to power MOSFET drivers without forced air or heatsinking.

Use Scenario: Retaining configuration registers and diagnostic event logs across ignition cycles in distributed vehicle networks.

IC Role / Device Role / Timing Role: Low-power standby SRAM maintaining critical state during sleep mode (ISB2 ≤ 15 mA at 125 °C).

Use Value: Automatic CE power-down reduces quiescent current below 20 mA threshold required for ISO 16750-2 Class D battery drain compliance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61WV25616EDBLL-12BLI Same 256 K × 16 organization and 12 ns speed, but uses LVCMOS I/O (VIH = 2.0 V, VIL = 0.8 V) and lacks BHE/BLE byte enables. Requires external logic for byte-write isolation; not qualified for Automotive-E temperature range (only Industrial: –40 °C to +85 °C). Select only for cost-sensitive industrial systems where byte-select is unused and extended temperature is unnecessary.
AS6C4008-12ZIN 4-Mbit (256 K × 16) SRAM with 12 ns access, but no automotive qualification; higher ISB2 (25 mA) and no CE auto-power-down feature. Lacks AEC-Q100 qualification and fails thermal validation above +105 °C; unsuitable for under-hood deployment. Acceptable only for cabin-infotainment subsystems operating within commercial temperature limits and requiring lowest unit cost.

Compared with IS61WV25616EDBLL-12BLI and AS6C4008-12ZIN, CY7C1041CV33-12ZSXE uniquely delivers automotive-grade reliability, integrated byte-select logic, and guaranteed 125 °C operation-making it the sole choice for safety-critical powertrain and ADAS memory buffering.

Availability

CY7C1041CV33-12ZSXE is available at Aetrix Electronics and suitable for engine control units, advanced driver assistance systems, and transmission control modules requiring stable component supply across automotive production lifecycles.

Supply support for CY7C1041CV33-12ZSXE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for automotive, industrial, and IoT applications, with global manufacturing and AEC-Q100-compliant qualification infrastructure.

CY7C1041CV33 belongs to Cypress's automotive SRAM product line, engineered specifically for deterministic, low-latency data buffering in safety-critical ECUs where refresh-free operation and extended temperature resilience are mandatory.

FAQ

What is the maximum junction temperature supported by CY7C1041CV33-12ZSXE?

The device is rated for operation up to +125 °C ambient (Automotive-E grade) with a thermal resistance θJA of 42.96 °C/W in the 44-pin TSOP II package. Under typical 3.3 V, 100 mA active current conditions, calculated junction temperature remains within safe limits (<150 °C) without forced cooling, per JEDEC JESD51-2A testing methodology.

Does CY7C1041CV33-12ZSXE require an external clock signal?

No. This is an asynchronous static RAM; all operations are controlled solely by CE, OE, WE, BHE, and BLE signal timing-no clock input is present or needed. Data access is initiated on signal edge transitions, not clock edges, enabling direct integration with microcontroller external bus interfaces lacking clocked memory controllers.

Can CY7C1041CV33-12ZSXE be used in a 16-bit wide memory system without byte-enable logic?

Yes. When both BHE and BLE are held LOW continuously, the device functions as a full 16-bit-wide SRAM with I/O0–I/O15 active. The byte-enable inputs are optional; their omission simplifies design but forfeits partial-word write capability and increases bus contention risk during mixed-width accesses.

Is the 44-pin TSOP II package (ZSXE) RoHS-compliant and lead-free?

Yes. The ZSXE suffix denotes a Pb-free (lead-free) 44-pin TSOP II package compliant with RoHS Directive 2011/65/EU and JEDEC Standard J-STD-020. Solder reflow profiles follow IPC/JEDEC J-STD-020D for MSL-3 handling, with peak temperature tolerance up to 260 °C.

CY7C1041CV33-12ZSXE Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
44-TSOP (0.400", 10.16mm Width)
Packaging:
Tray
Product Status:
Discontinued at Digi-Key
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
4Mbit
Memory Organization:
256K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
12ns
Access Time:
12 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
44-TSOP II

CY7C1041CV33-12ZSXE FAQ

1.How can I place an order for CY7C1041CV33-12ZSXE through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1041CV33-12ZSXE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1041CV33-12ZSXE reliable?

The price and inventory of CY7C1041CV33-12ZSXE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1041CV33-12ZSXE is usually 5 days.

3.What payment methods are accepted for CY7C1041CV33-12ZSXE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1041CV33-12ZSXE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1041CV33-12ZSXE?

CY7C1041CV33-12ZSXE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1041CV33-12ZSXE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1041CV33-12ZSXE?

For technical support, including CY7C1041CV33-12ZSXE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1041CV33-12ZSXE requirements.

6.How does Aetrix verify that CY7C1041CV33-12ZSXE is sourced from the original manufacturer or authorized distributors?

All CY7C1041CV33-12ZSXE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1041CV33-12ZSXE meets industry standards.

7.What is the process for return or replacement of CY7C1041CV33-12ZSXE?

All CY7C1041CV33-12ZSXE units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1041CV33-12ZSXE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1041CV33-12ZSXE part is unused and in its original packaging.

Return procedure for CY7C1041CV33-12ZSXE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1041CV33-12ZSXE Tags

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