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Infineon Technologies CY7C1041CV33-12ZSXET

Part No.:
CY7C1041CV33-12ZSXET
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
44-TSOP (0.400", 10.16mm Width)
Datasheet:
AetrixCY7C1041CV33-12ZSXET.pdf
Description:
IC SRAM 4MBIT PARALLEL 44TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,931

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Product details

Overview

CY7C1041CV33-12ZSXET from Cypress Semiconductor is an automotive-grade 4-Mbit (256 K × 16) CMOS static RAM with 12 ns access time, TTL-compatible I/O, and dual-byte write control via BHE/BLE pins. It operates across –40 °C to +125 °C (Automotive-E grade), supports automatic CE power-down (ISB2 ≤ 15 mA), and is packaged in a 48-ball FBGA. It serves as main data buffer memory in engine control units requiring deterministic read/write timing.

For engineers reviewing the CY7C1041CV33-12ZSXET datasheet, CY7C1041CV33-12ZSXET pinout, CY7C1041CV33-12ZSXET application, or CY7C1041CV33-12ZSXET equivalent, key selection criteria include tAA = 12 ns, byte-selectable 16-bit I/O architecture, Automotive-E temperature compliance, and FBGA package thermal resistance (θJC = 9.15 °C/W).

Technical Context

This SRAM implements a synchronous, non-volatile-access memory array organized as 262,144 × 16 bits with full address decoding (A0–A17), independent high/low byte enables (BHE/BLE), and tri-state I/O drivers controlled by CE, OE, and WE. All control inputs are active-low and TTL-compatible.

It features two power-down modes: ISB1 (TTL input thresholds, ≤45 mA) and ISB2 (CMOS input thresholds, ≤15 mA), triggered automatically when CE is HIGH and all inputs are valid. Output leakage (IOZ ≤ ±20 µA) and input leakage (IIX ≤ ±20 µA) are specified over full Automotive-E range.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Size 4 Mbit (256 K × 16); supports 16-bit parallel data bus without external multiplexing
Access Time (tAA) 12 ns max at –40 °C to +125 °C; guarantees deterministic latency for real-time ECU firmware execution
Supply Voltage 3.3 V ±10%; compatible with standard automotive 3.3 V rail and eliminates level-shifting requirements
Operating Current (ICC) 120 mA max at fMAX; enables predictable power budgeting in ASIL-B subsystems
Standby Current (ISB2) 15 mA max at VCC = 3.63 V, CMOS inputs; reduces quiescent power during sleep mode in telematics modules
Package Thermal Resistance (θJC) 9.15 °C/W (FBGA); ensures junction temperature remains within safe limits under 1.2 W dissipation in under-hood environments
I/O Capacitance 8 pF typical; minimizes signal integrity degradation on high-speed 16-bit buses routed across multi-layer PCBs

Pinout & Package

Package: 48-ball FBGA (10 mm × 11.5 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address Input 18-bit address bus supporting full 256 K-word addressing; no address multiplexing required
I/O0–I/O7 Data I/O (Low Byte) Bidirectional low-byte data path enabled by BLE; allows partial writes without disturbing high byte
I/O8–I/O15 Data I/O (High Byte) Bidirectional high-byte data path enabled by BHE; enables efficient 8-bit peripheral interfacing
CE Chip Enable Active-low chip select; enables automatic power-down when deasserted, reducing system idle power
WE Write Enable Active-low write strobe; controls write initiation in conjunction with CE and BHE/BLE
OE Output Enable Active-low output driver control; places I/O pins in high-impedance state when HIGH to prevent bus contention
BHE / BLE Byte Write Enable Independent active-low controls for high/low byte; enables 8-bit or 16-bit write granularity
VCC Power Supply Two dedicated 3.3 V supply balls (D6, E1); reduces IR drop and improves noise immunity
VSS Ground Two dedicated ground balls (D1, E6); provides low-inductance return path for high-speed switching currents

Key Features

Feature Design Value
Automotive-E Temperature Range –40 °C to +125 °C operation with full parameter guarantee; qualified per AEC-Q100 Grade 1
Dual-Byte Write Architecture Independent BHE/BLE controls enable selective 8-bit writes to either byte lane without read-modify-write overhead
Automatic CE Power-Down Reduces ICC to ≤15 mA (ISB2) when CE is HIGH and inputs meet CMOS thresholds-no external logic needed
TTL-Compatible I/O VIH = 2.0 V min, VOL = 0.4 V max at 8 mA; interoperates directly with legacy microcontrollers and FPGAs
Low-Inductance FBGA Packaging 48-ball layout with dual VCC/VSS pairs minimizes simultaneous switching noise on 16-bit data bus

Applications

Engine Control Unit (ECU) Advanced Driver Assistance Systems (ADAS) Camera Buffer

Use Scenario: Real-time storage of sensor fusion data and actuator command history in gasoline direct injection controllers.

IC Role / Device Role / Timing Role: Primary working memory for 32-bit RISC MCU executing closed-loop fuel trim algorithms.

Use Value: 12 ns tAA ensures instruction/data fetches complete within single CPU clock cycle at 83 MHz, eliminating wait states.

Use Scenario: Frame buffering between image sensor interface and SoC ISP pipeline in surround-view camera systems.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency scratchpad memory for burst-mode pixel data ingestion.

Use Value: Dual-byte write capability allows concurrent YUV component writes, sustaining 1.2 Gbps effective throughput.

Automotive Infotainment Head Unit Electric Power Steering (EPS) Motor Controller

Use Scenario: Temporary storage of decoded audio frames and UI rendering assets during navigation voice guidance playback.

IC Role / Device Role / Timing Role: Offload buffer for ARM Cortex-A application processor managing multimedia subsystems.

Use Value: Automatic CE power-down cuts standby current to 15 mA during display-off periods, extending battery reserve time.

Use Scenario: Storing torque demand lookup tables and real-time motor phase current samples in safety-critical EPS ECUs.

IC Role / Device Role / Timing Role: Deterministic-access memory for ASIL-C software components performing torque verification checks.

Use Value: Guaranteed –40 °C to +125 °C operation ensures uninterrupted memory service during under-hood thermal transients.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61WV25616EDBLL-12BLI Same density and 12 ns speed, but only rated –40 °C to +85 °C (Industrial); no Automotive-E qualification Not suitable for under-hood placement; limited to cabin-mounted infotainment or body control modules Select only if operating ambient stays below 85 °C and AEC-Q100 compliance is not required.
MT45W8MW16BGX-12D:J LPDDR2 SDRAM, not SRAM; requires refresh circuitry and initialization sequence; higher bandwidth but non-deterministic latency Used where sustained throughput >2 GB/s matters more than worst-case access predictability Choose only when system includes DDR controller and real-time determinism is secondary to memory density/cost.

Compared with IS61WV25616EDBLL-12BLI and MT45W8MW16BGX-12D:J, the CY7C1041CV33-12ZSXET uniquely delivers guaranteed 12 ns access with zero refresh overhead and full AEC-Q100 Grade 1 compliance-critical for ASIL-B/C timing-critical automotive control loops.

Availability

CY7C1041CV33-12ZSXET is available at Aetrix Electronics and suitable for engine control units, ADAS camera buffers, and electric power steering controllers requiring stable component supply across extended automotive temperature ranges and long production lifecycles.

Supply support for CY7C1041CV33-12ZSXET includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for automotive, industrial, and IoT applications, with global manufacturing and qualification infrastructure.

This device belongs to Cypress's automotive-qualified parallel SRAM product line, engineered specifically for deterministic, low-latency data buffering in safety-critical vehicle subsystems operating under extreme thermal and electrical stress.

FAQ

Is CY7C1041CV33-12ZSXET pin-compatible with CY7C1041BNV33?

Yes, it is pin- and function-compatible with CY7C1041BNV33 per the datasheet's "Pin and function compatible" statement. Both share identical 48-ball FBGA pinout, address/data/control signal mapping, and byte-enable architecture-enabling drop-in replacement in existing designs qualified for the BNV33 variant.

What is the maximum clock frequency supported for read/write cycles?

The device does not use a clock; it is asynchronous. Maximum operational frequency is derived from tRC = 12 ns, yielding up to 83.3 MHz sustained random access rate. Cycle timing depends solely on CE/OE/WE setup/hold relationships-not a system clock edge.

Does this SRAM require external refresh circuitry?

No. As a static RAM, CY7C1041CV33-12ZSXET retains data indefinitely while powered and does not require refresh cycles. This eliminates refresh-related latency jitter and simplifies timing design in real-time automotive control applications.

Can BHE and BLE be asserted simultaneously for full 16-bit writes?

Yes. Asserting both BHE and BLE LOW enables concurrent write operations to I/O8–I/O15 and I/O0–I/O7, allowing full 16-bit word writes in a single cycle-matching standard microprocessor bus protocols without additional glue logic.

CY7C1041CV33-12ZSXET Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
44-TSOP (0.400", 10.16mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Discontinued at Digi-Key
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
4Mbit
Memory Organization:
256K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
12ns
Access Time:
12 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
44-TSOP II

CY7C1041CV33-12ZSXET FAQ

1.How can I place an order for CY7C1041CV33-12ZSXET through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1041CV33-12ZSXET on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1041CV33-12ZSXET reliable?

The price and inventory of CY7C1041CV33-12ZSXET are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1041CV33-12ZSXET is usually 5 days.

3.What payment methods are accepted for CY7C1041CV33-12ZSXET?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1041CV33-12ZSXET transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1041CV33-12ZSXET?

CY7C1041CV33-12ZSXET orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1041CV33-12ZSXET order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1041CV33-12ZSXET?

For technical support, including CY7C1041CV33-12ZSXET datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1041CV33-12ZSXET requirements.

6.How does Aetrix verify that CY7C1041CV33-12ZSXET is sourced from the original manufacturer or authorized distributors?

All CY7C1041CV33-12ZSXET products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1041CV33-12ZSXET meets industry standards.

7.What is the process for return or replacement of CY7C1041CV33-12ZSXET?

All CY7C1041CV33-12ZSXET units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1041CV33-12ZSXET, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1041CV33-12ZSXET part is unused and in its original packaging.

Return procedure for CY7C1041CV33-12ZSXET:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1041CV33-12ZSXET Tags

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