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Infineon Technologies CY7C1041CV33-20ZC
- Part No.:
- CY7C1041CV33-20ZC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1041CV33-20ZC.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
CY7C1041CV33-20ZC from Cypress Semiconductor is a 4-Mbit (256K × 16) asynchronous CMOS static RAM with 10 ns access time, 3.3V supply, TTL-compatible I/O, and byte-wide write control via BHE/ BLE pins. It operates across industrial temperature range (–40°C to +85°C), supports automatic CE power-down (ISB2 = 10 mA), and is packaged in 44-pin TSOP II with center power/ground pinout for noise immunity.
For engineers reviewing the CY7C1041CV33-20ZC datasheet, CY7C1041CV33-20ZC pinout, CY7C1041CV33-20ZC application, or CY7C1041CV33-20ZC equivalent, key selection criteria include tAA = 20 ns timing compliance, VCC = 3.3V ±0.3V operation, byte-selectable 16-bit I/O architecture, and support for high-density memory expansion in embedded controllers and telecom line cards.
Technical Context
The CY7C1041CV33-20ZC implements a fully asynchronous SRAM core with independent byte enable control: BLE selects I/O0–I/O7 and BHE selects I/O8–I/O15, enabling partial writes without read-modify-write cycles. Its dual active-low chip enable (CE) and output enable (OE) allow hierarchical memory banking and low-latency read access.
It features automatic power-down when CE is deasserted (ISB2 = 10 mA at CMOS inputs), 2.0V data retention during standby, and TTL-compatible input thresholds (VIH = 2.0V min, VIL = 0.8V max). The device uses a 262,144-word × 16-bit array with address pins A0–A17 and bidirectional I/O lines supporting high-impedance tri-state during deselect, write, or OE-high conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4 Mbit (256K × 16) - provides 512 KB of byte-addressable storage for firmware buffers or real-time data logging |
| Access Time (tAA) | 20 ns - guarantees deterministic read latency for 50 MHz bus interfaces without wait states |
| Supply Voltage | 3.3V ±0.3V - compatible with standard LVTTL and LVCMOS logic domains; no level-shifting required |
| Operating Temperature | –40°C to +85°C - qualified for industrial-grade deployment in base stations and motor drives |
| Standby Current (ISB2) | 10 mA - enables low-power hold mode during processor sleep while retaining full memory contents |
| Byte Write Control | BLE/BHE active-low - allows independent 8-bit writes to upper/lower bytes, reducing bus traffic in mixed-data-width systems |
| Package | 44-pin TSOP II (400-mil), center VCC/VSS pinout - improves power integrity and reduces simultaneous switching noise |
Pinout & Package
Package: 44-pin Thin Small Outline Package (TSOP II), 400-mil body width, with center power (Pin 11, 33) and ground (Pin 12, 34) pins for enhanced signal integrity and thermal performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Input | 18-bit address bus selecting one of 262,144 memory locations; supports full 4-Mbit addressing without external decoding |
| I/O0–I/O7 | Bidirectional Data (Lower Byte) | Data path for lower 8 bits; enabled only when BLE = LOW during read/write; tri-stated otherwise |
| I/O8–I/O15 | Bidirectional Data (Upper Byte) | Data path for upper 8 bits; enabled only when BHE = LOW; enables independent 8-bit operations on 16-bit bus |
| CE | Chip Enable (active LOW) | Global select signal; forces device into low-power ISB2 mode (10 mA) when HIGH; enables memory access when LOW |
| OE | Output Enable (active LOW) | Controls I/O direction: LOW enables output drivers for reads; HIGH places I/O in high-impedance state |
| WE | Write Enable (active LOW) | Initiates write cycle when CE and WE both LOW; transitions define write timing window per AC specs (tWC = 20 ns) |
| BLE / BHE | Byte Low/High Enable (active LOW) | Selects lower (BLE) or upper (BHE) byte for write/read; permits partial writes without disturbing adjacent byte |
Key Features
| Feature | Design Value |
|---|---|
| 20 ns access time with 3.3V supply | Enables direct interface to 50 MHz microcontrollers without glue logic or wait-state insertion |
| Independent byte write control (BLE/BHE) | Eliminates need for external byte masking logic in 8-bit peripheral interfacing or legacy ISA-style designs |
| Automatic CE power-down (ISB2 = 10 mA) | Reduces system standby power by >90% vs. active current (ICC = 75 mA), critical for fanless industrial enclosures |
| TTL-compatible I/O levels | Direct connection to 3.3V microcontrollers (e.g., ARM Cortex-M3/M4) and FPGAs without level translators |
| Center VCC/VSS pinout in TSOP II | Minimizes ground bounce and supply noise in high-speed parallel bus layouts; improves signal integrity |
Applications
| Industrial PLC Memory Buffer | Telecom Line Card Data Cache |
|---|---|
|
Use Scenario: Storing real-time I/O status and motion control trajectory points in programmable logic controllers with deterministic scan cycles. IC Role / Device Role / Timing Role: Asynchronous SRAM buffer providing zero-wait-state access to 256K × 16-bit configuration and runtime data under 50 µs scan deadlines. Use Value: 20 ns tAA ensures full register update within single CPU clock cycle at 50 MHz, eliminating pipeline stalls during fieldbus interrupt servicing. |
Use Scenario: Caching packet header metadata and QoS policy tables in DSLAM and ONU line cards operating in temperature-varying cabinets. IC Role / Device Role / Timing Role: Nonvolatile-retentive (2.0V) memory holding critical forwarding rules during brief brownouts or hot-swap events. Use Value: –40°C to +85°C qualification and 10 mA ISB2 guarantee uninterrupted rule lookup during ambient shifts up to 85°C cabinet temperatures. |
| Automotive ADAS Sensor Fusion Hub | Medical Imaging Frame Buffer |
|
Use Scenario: Temporarily storing synchronized camera and radar timestamped frames prior to GPU-based fusion processing in Level 2+ ADAS ECUs. IC Role / Device Role / Timing Role: High-bandwidth, low-latency frame staging memory interfaced directly to image sensor parallel outputs and SoC DMA engines. Use Value: Byte-selectable writes (BLE/BHE) allow concurrent ingestion of left/right camera streams into separate 8-bit lanes, doubling effective throughput. |
Use Scenario: Holding uncompressed grayscale ultrasound or X-ray frames (e.g., 1024×1024 @ 16-bit) during real-time DICOM compression and display rendering. IC Role / Device Role / Timing Role: Dual-port-capable (via CE/OE arbitration) buffer enabling simultaneous acquisition and display refresh without FIFO bottlenecks. Use Value: 44-pin TSOP II package with center VCC/VSS minimizes EMI in sensitive analog front-end proximity, meeting IEC 60601-1 EMC requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar asynchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61LV25616AL-20TQLI | Same density (256K × 16), 20 ns, 3.3V, but uses standard TSOP II pinout (non-center VCC/VSS); ISB2 = 12 mA | Lacks center power/ground layout; higher noise susceptibility in dense PCBs with fast-switching peripherals | Preferred where board layout prioritizes footprint compatibility over noise immunity; verify VCC decoupling sufficiency |
| ON Semiconductor MC14LC5481M16-20 | 256K × 16, 20 ns, 3.3V, but rated only for commercial temp (0°C to +70°C); ISB2 = 15 mA | Not qualified for industrial or automotive use; unsuitable for uncontrolled ambient deployments | Acceptable only in climate-controlled indoor equipment; requires thermal derating analysis beyond 70°C |
Compared with IS61LV25616AL-20TQLI and MC14LC5481M16-20, the CY7C1041CV33-20ZC uniquely combines industrial temperature rating, center VCC/VSS noise suppression, and 10 mA ISB2-making it optimal for high-reliability embedded systems where signal integrity and thermal margin are non-negotiable.
Availability
CY7C1041CV33-20ZC is available at Aetrix Electronics and suitable for industrial PLCs, telecom line cards, automotive ADAS hubs, and medical imaging systems requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CY7C1041CV33-20ZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, PSoC, and USB solutions for industrial, automotive, and communications markets.
The CY7C1041CV33 belongs to Cypress's high-speed asynchronous SRAM product line, engineered for deterministic timing, low-power standby, and robust operation in noise-sensitive embedded systems with parallel bus interfaces.
FAQ
What is the maximum clock frequency supported by CY7C1041CV33-20ZC?
The CY7C1041CV33-20ZC is an asynchronous SRAM and does not use a clock signal. Its timing is governed by access parameters: tAA = 20 ns, tRC = 20 ns, and tWC = 20 ns. When interfaced with a 50 MHz microcontroller (20 ns period), it operates without wait states provided setup/hold times (e.g., tSA = 0 ns, tSD = 8 ns) are met using proper PCB layout and signal integrity practices.
Does CY7C1041CV33-20ZC support battery backup or data retention below 3.3V?
Yes. The device guarantees data retention down to 2.0V at temperatures up to +85°C, enabling operation during brownout conditions or when backed by a coin-cell battery. This is specified in the DC Electrical Characteristics table under "2.0V data retention" and does not require external circuitry-only VCC must remain ≥2.0V while CE is HIGH.
Can CY7C1041CV33-20ZC be used in place of CY7C1041BV33?
Yes-CY7C1041CV33-20ZC is explicitly pin-equivalent to CY7C1041BV33 per its datasheet Feature section. Both share identical pinout, voltage levels, and functional behavior. However, the 'V' version offers improved tAA consistency and tighter ISB2 specification (10 mA vs. typical 12 mA), making it preferable for low-power industrial designs.
What is the significance of the 'ZC' suffix in CY7C1041CV33-20ZC?
The 'ZC' suffix denotes the 44-pin TSOP II package ('Z') and commercial/industrial temperature grade ('C' = –40°C to +85°C). It distinguishes this variant from SOJ ('ZS') and FBGA ('ZA') versions, and confirms qualification for industrial applications-not just commercial. The '20' indicates 20 ns access time, and 'CV33' identifies the 3.3V core voltage generation.
CY7C1041CV33-20ZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Bag
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 20ns
- Access Time:
- 20 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY7C1041CV33-20ZC FAQ
1.How can I place an order for CY7C1041CV33-20ZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1041CV33-20ZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1041CV33-20ZC reliable?
The price and inventory of CY7C1041CV33-20ZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1041CV33-20ZC is usually 5 days.
3.What payment methods are accepted for CY7C1041CV33-20ZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1041CV33-20ZC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1041CV33-20ZC?
CY7C1041CV33-20ZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1041CV33-20ZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1041CV33-20ZC?
For technical support, including CY7C1041CV33-20ZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1041CV33-20ZC requirements.
6.How does Aetrix verify that CY7C1041CV33-20ZC is sourced from the original manufacturer or authorized distributors?
All CY7C1041CV33-20ZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1041CV33-20ZC meets industry standards.
7.What is the process for return or replacement of CY7C1041CV33-20ZC?
All CY7C1041CV33-20ZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1041CV33-20ZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1041CV33-20ZC part is unused and in its original packaging.
Return procedure for CY7C1041CV33-20ZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1041CV33-20ZC Tags
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