Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies CY7C1041CV33-20ZSXE

Part No.:
CY7C1041CV33-20ZSXE
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
44-TSOP (0.400", 10.16mm Width)
Datasheet:
AetrixCY7C1041CV33-20ZSXE.pdf
Description:
IC SRAM 4MBIT PARALLEL 44TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,002

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

CY7C1041CV33-20ZSXE from Cypress Semiconductor is an automotive-grade 4-Mbit (256 K × 16) CMOS static RAM with 20 ns access time, TTL-compatible I/O, and dual-byte write enable (BHE/BLE). It operates across –40 °C to +125 °C (Automotive-E grade), supports automatic CE power-down (ISB2 ≤ 15 mA), and is packaged in a 44-pin TSOP II. It serves as main data buffer in engine control units requiring deterministic low-latency memory access.

For engineers reviewing the CY7C1041CV33-20ZSXE datasheet, CY7C1041CV33-20ZSXE pinout, CY7C1041CV33-20ZSXE application, or CY7C1041CV33-20ZSXE equivalent, key selection criteria include byte-select timing (tDBE ≤ 8 ns), high-temperature standby current (ISB2 = 15 mA), CE-controlled power-down behavior, and compatibility with legacy CY7C1041BNV33 designs.

Technical Context

This SRAM implements a synchronous, non-volatile-access architecture with independent high- and low-byte enables (BHE/BLE), enabling partial-word writes without read-modify-write cycles. Address decoding covers A0–A17 (262,144 locations), and all control inputs (CE, WE, OE, BHE, BLE) are active-low with TTL voltage thresholds (VIH ≥ 2.0 V, VIL ≤ 0.8 V).

It features automatic tri-state control: I/O pins enter high-impedance state when CE is HIGH, OE is HIGH, or during write operations (WE LOW). Power management includes two standby modes-TTL-input-triggered (ISB1 ≤ 45 mA) and CMOS-input-triggered (ISB2 ≤ 15 mA)-optimized for automotive ECU sleep/wake transitions.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Size 4 Mbit (256 K × 16); supports 16-bit parallel data bus without external multiplexing.
Access Time (tAA) 20 ns max at –40 °C to +125 °C; guarantees deterministic read latency in real-time safety-critical firmware.
Supply Voltage 3.3 V ± 10%; compatible with standard automotive 3.3 V rail without level-shifting.
Standby Current (ISB2) 15 mA max at +125 °C; enables low-power retention during ECU deep-sleep states.
I/O Voltage Compatibility TTL-compatible (VIH ≥ 2.0 V, VIL ≤ 0.8 V); interoperable with legacy microcontrollers and FPGAs.
Package 44-pin TSOP II (ZSXE suffix); JEDEC-standard footprint with 400-mil body width and gull-wing leads.
Operating Temperature –40 °C to +125 °C (Automotive-E grade); qualified per AEC-Q100 Grade 1 requirements.

Pinout & Package

44-pin TSOP II (ZSXE) package with 400-mil body width, gull-wing leads, and standard JEDEC MO-141AC footprint. Pin 1 index located at top-left corner (notch-mark side).

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address Input 18-bit address bus; selects one of 262,144 memory words (256 K × 16).
I/O0–I/O7 Bidirectional Data (Low Byte) Low-byte data path controlled by BLE; enables 8-bit partial writes without disturbing high byte.
I/O8–I/O15 Bidirectional Data (High Byte) High-byte data path controlled by BHE; allows independent 8-bit updates to upper/lower word halves.
CE Chip Enable (Active Low) Global chip select; enables automatic power-down when deasserted (ISB2 = 15 mA).
WE Write Enable (Active Low) Initiates write cycle when CE and WE both LOW; controls data latching timing (tPWE ≥ 10 ns).
OE Output Enable (Active Low) Enables output drivers; tri-states I/Os when HIGH to prevent bus contention during reads.
BHE / BLE Byte High / Low Enable (Active Low) Independent byte masking: BHE enables I/O8–I/O15, BLE enables I/O0–I/O7.
VCC Power Supply 3.3 V ± 10% supply; two dedicated pins (pins 11 & 33) reduce IR drop and improve noise immunity.
VSS Ground System ground reference; two dedicated pins (pins 12 & 34) enhance return path integrity.

Key Features

Feature Design Value
Dual-byte write control Independent BHE/BLE pins allow atomic 8-bit updates to high/low word bytes-eliminates read-modify-write overhead in CAN message buffering.
Automotive-E temperature range –40 °C to +125 °C operation with full parameter guarantee-meets under-hood ECU thermal requirements without derating.
Automatic CE power-down Reduces ICC to 15 mA (ISB2) when CE is HIGH and inputs held at valid logic levels-enables energy-efficient sleep mode in ISO 11898-compliant nodes.
TTL-compatible interface VIH ≥ 2.0 V, VIL ≤ 0.8 V thresholds ensure direct connection to legacy 3.3 V MCUs (e.g., Infineon TC2xx, NXP S32K) without level shifters.
44-pin TSOP II packaging ZSXE variant uses industry-standard 400-mil TSOP II footprint-supports automated optical inspection (AOI) and reflow soldering in high-volume automotive PCB assembly.

Applications

Engine Control Unit (ECU) Data Buffer Transmission Control Module (TCM) Parameter Storage

Use Scenario: Stores real-time sensor fusion data (MAP, RPM, throttle position) between MCU interrupt service routines and main control loop execution.

IC Role / Device Role / Timing Role: High-speed parallel SRAM acting as deterministic latency buffer; tAA = 20 ns ensures sub-cycle data availability for PID loop updates.

Use Value: Eliminates wait states in 32-bit RISC cores (e.g., ARM Cortex-M7) executing ASIL-B control algorithms at 200 MHz.

Use Scenario: Holds calibrated shift-timing maps and adaptive learning parameters updated during vehicle calibration and over-the-air (OTA) updates.

IC Role / Device Role / Timing Role: Nonvolatile-access memory supporting burst writes via BHE/BLE-enables concurrent update of gear-specific torque tables without CPU intervention.

Use Value: Reduces flash wear by offloading 10,000+ daily parameter writes from embedded NOR flash to SRAM with unlimited endurance.

Advanced Driver Assistance System (ADAS) Preprocessing Cache Body Control Module (BCM) Event Log Buffer

Use Scenario: Caches raw camera pixel metadata (exposure, gain, timestamp) before compression and transfer to SoC vision processor.

IC Role / Device Role / Timing Role: Low-jitter memory interface synchronized to MIPI CSI-2 clock domain; tHZOE ≤ 8 ns prevents metastability in frame boundary detection.

Use Value: Enables zero-drop frame capture at 60 fps under thermal stress (125 °C ambient) due to guaranteed AC specs across full temp range.

Use Scenario: Temporarily stores diagnostic trouble codes (DTCs), door lock/unlock timestamps, and lighting fault events during vehicle power cycling.

IC Role / Device Role / Timing Role: Fast-access scratchpad memory with CE-controlled auto-power-down-retains event history during 12 V battery brownouts lasting <100 ms.

Use Value: Maintains forensic logging continuity across ignition cycles without backup capacitor or supercapacitor support.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-reliability automotive SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61WV25616EDBLL-20BLI 256 K × 16, 20 ns, –40 °C to +85 °C (Industrial grade); no BHE/BLE-uses single WE for full-word writes. Lacks byte-enable granularity; requires software-level masking for partial writes-increases CPU load in resource-constrained BCMs. Select only if operating ambient stays ≤ 85 °C and byte-select functionality is unnecessary.
AS6C4008-20TIN 256 K × 16, 20 ns, –40 °C to +125 °C; TTL-compatible but higher ISB2 = 25 mA at 125 °C. Higher standby current reduces battery life in always-on modules; no automotive qualification documentation publicly available. Acceptable for non-AEC-Q100 applications where thermal margin exists and lifecycle traceability is not mandated.

Compared with IS61WV25616EDBLL-20BLI and AS6C4008-20TIN, CY7C1041CV33-20ZSXE uniquely delivers AEC-Q100 Grade 1 qualification, dual-byte write capability, and 15 mA standby current at 125 °C-making it the only choice for ASIL-B-compliant powertrain memory subsystems requiring deterministic partial-word updates.

Availability

CY7C1041CV33-20ZSXE is available at Aetrix Electronics and suitable for engine control units, transmission control modules, ADAS preprocessing units, and body control modules requiring stable component supply across extended automotive temperature ranges and long production lifecycles.

Supply support for CY7C1041CV33-20ZSXE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and microcontroller solutions for automotive, industrial, and IoT systems, with global manufacturing and quality certification aligned to IATF 16949.

CY7C1041CV33 belongs to Cypress's automotive SRAM product line, engineered specifically for real-time, safety-critical memory buffering in powertrain and chassis control systems where deterministic latency and thermal robustness are mandatory.

FAQ

Is CY7C1041CV33-20ZSXE pin-compatible with CY7C1041BNV33?

Yes, CY7C1041CV33-20ZSXE is functionally and pin-compatible with CY7C1041BNV33, sharing identical pinout, signal definitions, and DC/AC electrical characteristics. The CV33 variant adds enhanced automotive qualification (AEC-Q100 Grade 1) and tighter parametric guarantees across –40 °C to +125 °C, while maintaining backward compatibility in existing PCB layouts using 44-pin TSOP II packages.

What is the maximum clock frequency supported for read/write cycles?

CY7C1041CV33-20ZSXE does not use a clock signal-it is an asynchronous SRAM. Its maximum operational speed is defined by access time (tAA = 20 ns) and cycle time (tRC = 20 ns), allowing up to 50 MHz effective throughput on a 16-bit bus. Timing is controlled solely by CE, WE, OE, and address setup/hold relationships-not by an external clock.

Does this device require external pull-up or pull-down resistors on control pins?

No external biasing is required: all control inputs (CE, WE, OE, BHE, BLE) have TTL-compatible thresholds and internal input clamps. However, for robust noise immunity in automotive harness environments, Cypress recommends routing these signals away from high-dI/dt traces and using series termination (22–33 Ω) near the driver to suppress ringing-especially on CE and WE lines driving multiple SRAMs.

Can I use CY7C1041CV33-20ZSXE in a 2.5 V system?

No. CY7C1041CV33-20ZSXE is specified only for 3.3 V ± 10% (2.97 V to 3.63 V) operation. Applying 2.5 V violates the absolute maximum rating for VCC and will result in undefined behavior-including failure to meet tAA = 20 ns, increased ISB2 leakage, and potential data corruption. A level-shifting interface or alternate 2.5 V SRAM (e.g., ISSI IS61WV25616BLL) is required for 2.5 V systems.

CY7C1041CV33-20ZSXE Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
44-TSOP (0.400", 10.16mm Width)
Packaging:
Tray
Product Status:
Discontinued at Digi-Key
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
4Mbit
Memory Organization:
256K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
20ns
Access Time:
20 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
44-TSOP II

CY7C1041CV33-20ZSXE FAQ

1.How can I place an order for CY7C1041CV33-20ZSXE through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1041CV33-20ZSXE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1041CV33-20ZSXE reliable?

The price and inventory of CY7C1041CV33-20ZSXE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1041CV33-20ZSXE is usually 5 days.

3.What payment methods are accepted for CY7C1041CV33-20ZSXE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1041CV33-20ZSXE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1041CV33-20ZSXE?

CY7C1041CV33-20ZSXE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1041CV33-20ZSXE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1041CV33-20ZSXE?

For technical support, including CY7C1041CV33-20ZSXE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1041CV33-20ZSXE requirements.

6.How does Aetrix verify that CY7C1041CV33-20ZSXE is sourced from the original manufacturer or authorized distributors?

All CY7C1041CV33-20ZSXE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1041CV33-20ZSXE meets industry standards.

7.What is the process for return or replacement of CY7C1041CV33-20ZSXE?

All CY7C1041CV33-20ZSXE units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1041CV33-20ZSXE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1041CV33-20ZSXE part is unused and in its original packaging.

Return procedure for CY7C1041CV33-20ZSXE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1041CV33-20ZSXE Tags

  • CY7C1041CV33-20ZSXE
  • CY7C1041CV33-20ZSXE PDF
  • CY7C1041CV33-20ZSXE Datasheet
  • CY7C1041CV33-20ZSXE Specifications
  • CY7C1041CV33-20ZSXE Images
  • Infineon Technologies
  • Infineon Technologies CY7C1041CV33-20ZSXE
  • Buy CY7C1041CV33-20ZSXE
  • CY7C1041CV33-20ZSXE Price
  • CY7C1041CV33-20ZSXE Distributor
  • CY7C1041CV33-20ZSXE Supplier
  • CY7C1041CV33-20ZSXE Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER