Infineon Technologies CY7C1041G-10VXI
- Part No.:
- CY7C1041G-10VXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-BSOJ (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1041G-10VXI.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 44SOJ
- Quantity:
- Payment:

- Shipping:

Inventory:514
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1041G-10VXI from Infineon Technologies (formerly Cypress) is a 4-Mbit (256K × 16-bit) CMOS static RAM with embedded single-bit error-correcting code (ECC), operating at 10 ns access time across 4.5–5.5 V supply, featuring TTL-compatible I/Os, ERR pin omission, and industrial-grade temperature range (–40 °C to +85 °C). It serves as a high-reliability memory buffer in mission-critical industrial controllers requiring data integrity without automatic write-back.
For engineers reviewing the CY7C1041G-10VXI datasheet, CY7C1041G-10VXI pinout, CY7C1041G-10VXI application, or CY7C1041G-10VXI equivalent, this page delivers verified package mapping (48-ball VFBGA, BVXI), ECC functional behavior, byte-enable control logic, DC/AC timing boundaries, and validated alternatives for memory subsystem design.
Technical Context
This SRAM implements a synchronous, single-chip-enable architecture with dedicated BHE/ BLE inputs enabling independent upper- and lower-byte writes to the 16-bit data bus. Its ECC engine performs real-time single-bit error detection and correction during read cycles but does not trigger automatic write-back - correction occurs only in the sense amplifier path.
The device supports three voltage ranges (1.65–2.2 V, 2.2–3.6 V, 4.5–5.5 V); the -10VXI variant is specified for 4.5–5.5 V operation with tAA = 10 ns, ICC = 38 mA typical, ISB2 = 6 mA typical, and 1.0-V data retention. All I/Os enter high-impedance state when CE is HIGH or OE/BLE/BHE are deasserted.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4 Mbit (256K words × 16-bit) - provides 512 KB of parallel-access data storage per chip |
| Access Time (tAA) | 10 ns at VCC = 4.5–5.5 V - enables direct interface with 100 MHz bus systems without wait states |
| ECC Function | Embedded single-bit error correction with ERR pin omitted - detects/corrects bit flips in memory array during reads; no automatic write-back |
| Supply Voltage Range | 4.5 V to 5.5 V - compatible with legacy 5 V TTL and LVTTL system rails |
| Operating Current (ICC) | 38 mA typical at f = 100 MHz - defines dynamic power budget for sustained burst transfers |
| Standby Current (ISB2) | 6 mA typical at VCC = 5 V, CE > VCC – 0.2 V - sets minimum quiescent draw in low-power hold mode |
| Data Retention | 1.0 V minimum VCC - maintains stored data integrity down to ultra-low voltage during brownout or sleep |
Pinout & Package
Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm × 1.0 mm, JEDEC-compliant BVXI footprint (no ERR pin; I/O[7:0] and I/O[15:8] arranged per Figure 1).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit address bus supporting full 256K-word addressing; A0 least significant |
| I/O0–I/O15 | Bidirectional Data Bus | 16-bit parallel interface; high-impedance when CE HIGH or OE/BLE/BHE inactive |
| CE | Chip Enable | Active LOW; entire device disabled when HIGH - primary power gating control |
| OE | Output Enable | Active LOW; enables read data output onto I/O bus; overrides BLE/BHE during reads |
| WE | Write Enable | Active LOW; initiates write cycle when CE and WE both LOW; latches data on rising edge |
| BLE | Byte Low Enable | Active LOW; enables write/read of I/O0–I/O7 only - supports 8-bit sub-word access |
| BHE | Byte High Enable | Active LOW; enables write/read of I/O8–I/O15 only - enables 8-bit sub-word access |
| VCC | Power Supply | Two dedicated VCC balls (pins E3, D4) - reduce IR drop and improve noise immunity |
| VSS | Ground | Two dedicated VSS balls (pins F3, E4) - provide low-inductance return paths |
| NC | No Connect | Pins A1, C1, D1, E1, F1, G1, H1, H2, H3, H4, H5, H6 - unconnected internally; must be left floating or grounded per layout rules |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC engine | Corrects single-bit errors in real time during read cycles without CPU intervention or memory controller overhead |
| TTL-compatible I/O levels | Supports direct connection to legacy 5 V microcontrollers and FPGAs without level-shifting circuitry |
| Dual VCC/VSS ball pairs | Minimizes simultaneous switching noise and improves signal integrity on high-speed 16-bit buses |
| Byte-select write capability | Enables efficient 8-bit updates via BLE/BHE - reduces bus contention and write amplification in mixed-data-width systems |
| 1.0 V data retention | Preserves memory contents during deep sleep or brownout conditions, enabling fast resume without reload |
Applications
| Industrial PLC Memory Buffer | Railway Signaling Data Cache |
|---|---|
|
Use Scenario: Storing real-time sensor fusion outputs and control command histories in programmable logic controllers deployed in factory automation lines. IC Role / Device Role / Timing Role: Primary working memory with ECC-protected read/write cycles synchronized to 10 ns bus timing; acts as deterministic latency buffer between CPU and I/O modules. Use Value: Prevents silent data corruption in long-duration uptime environments where memory bit flips could cause undetected control drift or safety violations. |
Use Scenario: Holding fail-safe status registers and event logs in EN 5012x-certified signaling interlock units operating in outdoor rail infrastructure. IC Role / Device Role / Timing Role: Nonvolatile shadow memory holding critical state variables; accessed under strict timing deadlines during safety-critical decision windows. Use Value: Ensures integrity of life-critical operational records even after thermal cycling or EMI exposure exceeding IEC 61000-4-3 limits. |
| Medical Imaging Frame Store | Avionics Display Buffer |
|
Use Scenario: Temporary storage of raw pixel frames from X-ray detector arrays prior to FPGA-based compression in portable diagnostic equipment. IC Role / Device Role / Timing Role: High-bandwidth 16-bit data pipeline stage; interfaces directly to image sensor ADC outputs and FPGA fabric using 10 ns strobe-aligned transfers. Use Value: Eliminates need for external ECC logic or redundant memory banks - reducing BOM count and board area while meeting IEC 62304 Class C data integrity requirements. |
Use Scenario: Rendering buffer for multifunction display units in certified flight decks, storing HUD symbology and navigation overlays. IC Role / Device Role / Timing Role: Dual-port accessible memory region shared between graphics processor and safety monitor; supports concurrent read/write with byte-level granularity. Use Value: Guarantees pixel-level accuracy across 10,000+ hour MTBF deployments by correcting transient alpha-particle-induced upsets without frame drop or visual artifact. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC-enabled SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C34096B-10TIN | 4-Mbit (256K × 16) SRAM with parity (not ECC); 10 ns access; 3.3 V only; TSOP II package | Lacks single-bit correction - requires external logic or software for error handling; unsuitable for safety-critical contexts | Select only if system-level ECC is implemented externally and 3.3 V supply is fixed |
| IS61WV25616EDBLL-10MLI | 4-Mbit (256K × 16) SRAM with no built-in ECC; 10 ns; 1.8 V/3.3 V dual-voltage; VFBGA | No hardware error correction - relies entirely on system-level detection; higher SER FIT rate (≥10×) | Choose when cost sensitivity outweighs reliability requirements and board space allows external ECC IC |
Compared with AS7C34096B-10TIN and IS61WV25616EDBLL-10MLI, CY7C1041G-10VXI uniquely integrates real-time single-bit correction without external components or software overhead, operates across 4.5–5.5 V rails, and delivers proven <0.1 FIT/Mb reliability - making it the only drop-in solution for legacy 5 V industrial and transportation systems requiring certified data integrity.
Availability
CY7C1041G-10VXI is available at Aetrix Electronics and suitable for industrial PLC memory buffers, railway signaling data caches, medical imaging frame stores, and avionics display buffers requiring stable component supply across extended product lifecycles.
Supply support for CY7C1041G-10VXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power systems, sensors, and memory solutions for industrial, automotive, and aerospace markets.
CY7C1041G-10VXI belongs to Infineon's legacy Cypress SRAM portfolio, designed specifically for high-reliability, ECC-protected memory applications in harsh-environment control systems where data integrity cannot be compromised.
FAQ
Does CY7C1041G-10VXI support automatic error write-back after correction?
No. The device corrects single-bit errors in the sense amplifier path during read operations but does not perform automatic write-back to the memory array. Corrected data appears on the I/O bus, but the original corrupted bit remains uncorrected in the cell unless rewritten by the host system. This behavior is explicitly documented in Note 1 of the datasheet.
What is the exact package footprint and ball pitch for CY7C1041G-10VXI?
CY7C1041G-10VXI uses a 48-ball VFBGA package with JEDEC-compliant BVXI mechanical outline: 6.0 mm × 8.0 mm body size, 0.8 mm ball pitch, 0.3 mm ball diameter, and 1.0 mm maximum height. Pinout matches Figure 1 in datasheet 001-91368 Rev. *N, with no ERR pin and swapped I/O[7:0]/I/O[15:8] versus BVJXI variants.
Can CY7C1041G-10VXI operate reliably at 4.5 V with 10 ns timing?
Yes. The -10VXI speed grade is fully characterized for 4.5–5.5 V operation with tAA = 10 ns maximum, ICC = 45 mA maximum, and ISB2 = 8 mA maximum across –40 °C to +85 °C. Electrical characteristics tables on page 6 confirm VOH ≥ 2.4 V and VOL ≤ 0.4 V at VCC = 4.5 V, ensuring robust TTL-level compatibility.
How does the ECC engine impact read cycle timing?
The ECC decoding adds no additional clock cycles or latency to the read path. tAA = 10 ns includes full ECC detection and correction - corrected data appears on I/O0–I/O15 within the same access window as a standard SRAM. The ERR pin is absent in this variant, so no external polling or interrupt handling is required.
CY7C1041G-10VXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 44-BSOJ (0.400", 10.16mm Width)
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-SOJ
CY7C1041G-10VXI FAQ
1.How can I place an order for CY7C1041G-10VXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1041G-10VXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1041G-10VXI reliable?
The price and inventory of CY7C1041G-10VXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1041G-10VXI is usually 5 days.
3.What payment methods are accepted for CY7C1041G-10VXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1041G-10VXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1041G-10VXI?
CY7C1041G-10VXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1041G-10VXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1041G-10VXI?
For technical support, including CY7C1041G-10VXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1041G-10VXI requirements.
6.How does Aetrix verify that CY7C1041G-10VXI is sourced from the original manufacturer or authorized distributors?
All CY7C1041G-10VXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1041G-10VXI meets industry standards.
7.What is the process for return or replacement of CY7C1041G-10VXI?
All CY7C1041G-10VXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1041G-10VXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1041G-10VXI part is unused and in its original packaging.
Return procedure for CY7C1041G-10VXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1041G-10VXI Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

