Infineon Technologies CY7C1041G-10ZSXIT
- Part No.:
- CY7C1041G-10ZSXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1041G-10ZSXIT.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1041G-10ZSXIT from Infineon Technologies (formerly Cypress) is a 4-Mbit (256K × 16) CMOS static RAM with embedded single-bit error-correcting code (ECC), operating at 10 ns access time across 4.5–5.5 V supply, featuring TTL-compatible I/Os, ERR pin for error indication, and low 38 mA typical active current. It serves as a high-reliability memory buffer in industrial control systems requiring data integrity under radiation-prone or long-term operation conditions.
For engineers reviewing the CY7C1041G-10ZSXIT datasheet, CY7C1041G-10ZSXIT pinout, CY7C1041G-10ZSXIT application, or CY7C1041G-10ZSXIT equivalent, key selection criteria include ECC-enabled read reliability, 44-pin TSOP II package compatibility, 10 ns timing at 5 V, byte-level write enable via BHE/ BLE, and industrial-grade temperature support (–40°C to +85°C).
Technical Context
This SRAM implements on-die ECC encoding/decoding logic that detects and corrects single-bit errors during read cycles without automatic write-back-error status is signaled solely via the ERR output pin. The memory array uses standard row/column decoding with sense amplifiers and supports full 16-bit parallel access or byte-selectable writes using independent BHE (I/O8–I/O15) and BLE (I/O0–I/O7) controls.
All I/Os enter high-impedance state when CE is HIGH or when OE, BHE, and BLE are simultaneously deasserted-enabling clean bus sharing in multi-device systems. Data retention is guaranteed at 1.0 V down to –40°C, supporting low-power suspend modes without external backup power.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4 Mbit (256K words × 16-bit) - supports 32 KB of wide-data storage per device, ideal for microcontroller co-processor buffers. |
| Access Time (tAA) | 10 ns at VCC = 4.5–5.5 V - enables direct interface with 100 MHz synchronous controllers without wait states. |
| ECC Function | Embedded single-bit error correction with ERR output assertion - provides real-time detection/correction visibility for safety-critical firmware validation. |
| Supply Voltage Range | 4.5 V to 5.5 V - compatible with legacy 5 V logic families and industrial power rails without level-shifting. |
| Active Current (ICC) | 38 mA typical at f = 100 MHz - enables predictable thermal budgeting in dense PCB layouts. |
| Standby Current (ISB2) | 6 mA typical at VCC = 5 V, CE > VCC – 0.2 V - supports low-power sleep modes while retaining full memory content. |
| Data Retention Voltage | 1.0 V minimum - allows battery-backed retention during main power loss without external charge pumps. |
Pinout & Package
Package: 44-pin TSOP II (Type II, 400 mil width), RoHS-compliant, JEDEC MO-141AC, body size 18.4 mm × 10.16 mm × 1.2 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CE | Chip Enable (active-low) | Primary device select; disables all outputs and reduces current to ISB2 when HIGH. |
| /OE | Output Enable (active-low) | Controls tri-state of I/O[15:0]; must be LOW with /CE LOW for valid read data. |
| /WE | Write Enable (active-low) | Initiates write cycle when /CE and /WE both LOW; latches address and data on falling edge. |
| /BHE | Byte High Enable | Enables write/read of upper byte (I/O15–I/O8); used for 8-bit bus compatibility. |
| /BLE | Byte Low Enable | Enables write/read of lower byte (I/O7–I/O0); supports mixed-width peripheral interfacing. |
| ERR | Error Indication Output | Open-drain HIGH pulse during single-bit correction event; requires external pull-up for logic-level signaling. |
| A[17:0] | Address Inputs | 18-bit address bus supporting full 256K-word addressing; A0–A17 directly map to internal row/column decoders. |
| I/O[15:0] | Bidirectional Data Bus | 16-bit parallel interface; high-impedance when /CE HIGH or /OE, /BHE, /BLE all HIGH. |
Key Features
| Feature | Design Value |
|---|---|
| On-die ECC engine | Corrects single-bit errors in real time with no software overhead; ERR pin signals correction event for logging or diagnostics. |
| TTL-compatible I/O levels | Supports direct connection to legacy 5 V microcontrollers and FPGAs without level translators or bus buffers. |
| Byte-selectable write control | Independent /BHE and /BLE allow partial-word writes-reducing bus traffic and eliminating read-modify-write cycles. |
| Industrial temperature range | Rated for –40°C to +85°C ambient operation-validated for use in programmable logic controllers and motor drives. |
| Low-power standby mode | ISB2 = 6 mA at 5 V enables energy-efficient idle states in always-on industrial gateways. |
Applications
| Programmable Logic Controller (PLC) Data Buffer | Industrial HMI Display Frame Memory |
|---|---|
Use Scenario: Stores real-time I/O scan data and configuration registers in modular PLC backplanes where EMI-induced bit flips risk control loop corruption. IC Role / Device Role / Timing Role: Primary working memory with ECC-protected read path; 10 ns tAA ensures deterministic response within 100 µs scan cycles. Use Value: Eliminates need for external CRC checking or watchdog-triggered reboots by correcting transient errors before they propagate to control logic. | Use Scenario: Holds graphical frame buffers for 800×480 LCD panels in factory-floor HMIs exposed to voltage sags and thermal cycling. IC Role / Device Role / Timing Role: Dual-port-accessible display memory mapped to GPU or DMA controller; 16-bit bus width matches pixel depth requirements. Use Value: Prevents visible screen artifacts (e.g., random pixel corruption) caused by alpha particle strikes or ground bounce during high-current actuator switching. |
| Railway Signaling Safety Module | Medical Diagnostic Imaging Cache |
Use Scenario: Stores validated command histories and interlocking logic states in EN 50128-certified signaling hardware where uncorrected memory errors violate SIL-4 requirements. IC Role / Device Role / Timing Role: Fail-safe memory node with ERR pin wired to system health monitor; operates at 5 V for compatibility with legacy relay driver ICs. Use Value: Provides documented single-event upset (SEU) mitigation without increasing BOM count or FPGA resource usage. | Use Scenario: Caches DICOM image tiles during ultrasound or X-ray reconstruction pipelines where corrupted pixels could mislead radiologists. IC Role / Device Role / Timing Role: High-speed scratchpad between ADC front-end and DSP engine; ECC prevents silent data corruption in floating-point coefficient tables. Use Value: Reduces false-positive anomaly detection rates by ensuring pixel intensity values remain bit-accurate across repeated read-modify-write operations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C34096B-10TIN | No embedded ECC; requires external error-checking logic or software parity handling. | Lacks hardware-level error reporting; unsuitable for safety-critical systems without additional validation layers. | Select only if cost sensitivity outweighs reliability requirements and system firmware can implement SW-based ECC. |
| IS61WV25616EDBLL-10MLI | Includes ECC but lacks dedicated ERR output pin; error status accessible only via internal register read. | Requires polling or interrupt-driven register access to detect correction events-increasing CPU load and latency. | Prefer when board space permits SPI/I²C interface overhead and deterministic ERR signaling is not required. |
Compared with AS7C34096B-10TIN and IS61WV25616EDBLL-10MLI, CY7C1041G-10ZSXIT delivers immediate, hardware-asserted error visibility and eliminates software intervention-critical for real-time control loops and functional safety architectures where latency and determinism are non-negotiable.
Availability
CY7C1041G-10ZSXIT is available at Aetrix Electronics and suitable for industrial automation, railway signaling, and medical imaging equipment requiring stable component supply, long-lifecycle support, and guaranteed ECC functionality across temperature extremes.
Supply support for CY7C1041G-10ZSXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensor solutions, and memory products for industrial, automotive, and IoT applications.
CY7C1041G-10ZSXIT belongs to Infineon's legacy Cypress SRAM portfolio, designed specifically for high-integrity embedded systems where data reliability supersedes raw speed-targeting applications with stringent uptime, safety, and field-deployment longevity requirements.
FAQ
Does CY7C1041G-10ZSXIT support automatic error correction write-back?
No. The device performs single-bit error correction during read cycles and asserts the ERR pin to indicate correction occurred, but it does not automatically rewrite the corrected data back to the memory array. System firmware must initiate any desired write-back operation using standard /WE-controlled writes.
What is the function of the NC pins in the 44-pin TSOP II package?
The NC (No Connect) pins-located at positions 21, 22, and 23 in the 44-pin TSOP II footprint-are physically present but not bonded to the silicon die. They serve no electrical function and must remain unconnected in PCB layout; routing traces or applying solder paste to these pads may cause mechanical stress or unintended coupling.
Can CY7C1041G-10ZSXIT operate reliably at 4.5 V with full 10 ns timing?
Yes. The datasheet specifies tAA = 10 ns across the entire 4.5 V to 5.5 V supply range, with ICC = 38 mA typical measured at VCC = 5 V and f = 100 MHz. At 4.5 V, timing remains compliant provided input rise/fall times meet AC test load conditions (≤1 V/ns) and board layout minimizes VCC droop during burst accesses.
How is the ERR pin electrically configured and what external components are required?
The ERR pin is an open-drain output requiring an external pull-up resistor to VCC. Typical value is 4.7 kΩ; this ensures logic HIGH (≥2.4 V) when inactive and fast LOW transition (<10 ns) during error events. No capacitor or filtering is recommended-ERR pulses reflect actual correction timing and must remain edge-sharp for diagnostic timestamping.
CY7C1041G-10ZSXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY7C1041G-10ZSXIT FAQ
1.How can I place an order for CY7C1041G-10ZSXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1041G-10ZSXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1041G-10ZSXIT reliable?
The price and inventory of CY7C1041G-10ZSXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1041G-10ZSXIT is usually 5 days.
3.What payment methods are accepted for CY7C1041G-10ZSXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1041G-10ZSXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1041G-10ZSXIT?
CY7C1041G-10ZSXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1041G-10ZSXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1041G-10ZSXIT?
For technical support, including CY7C1041G-10ZSXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1041G-10ZSXIT requirements.
6.How does Aetrix verify that CY7C1041G-10ZSXIT is sourced from the original manufacturer or authorized distributors?
All CY7C1041G-10ZSXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1041G-10ZSXIT meets industry standards.
7.What is the process for return or replacement of CY7C1041G-10ZSXIT?
All CY7C1041G-10ZSXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1041G-10ZSXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1041G-10ZSXIT part is unused and in its original packaging.
Return procedure for CY7C1041G-10ZSXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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