Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies CY7C1041G18-15ZSXIT

Name: CY7C1041G18-15ZSXIT
Brand: Infineon Technologies
SKU: CY7C1041G18-15ZSXIT
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: CY7C1041G18-15ZSXIT

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 44-TSOP (0.400", 10.16mm Width)

Datasheet:: CY7C1041G18-15ZSXIT.pdf

Description:: IC SRAM 4MBIT PARALLEL 44TSOP II

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:3,892

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

CY7C1041G18-15ZSXIT from Infineon Technologies (formerly Cypress) is a 4-Mbit (256K × 16-bit) CMOS static RAM with embedded single-bit error-correcting code (ECC), designed for high-reliability industrial memory subsystems operating at 15 ns access time across 1.65–2.2 V supply. It features TTL-compatible I/O, ERR pin for real-time ECC event indication, and low standby current (6 mA typical) in a 48-ball VFBGA package.

For engineers reviewing the CY7C1041G18-15ZSXIT datasheet, CY7C1041G18-15ZSXIT pinout, CY7C1041G18-15ZSXIT application, or CY7C1041G18-15ZSXIT equivalent, this page delivers verified functional identity, validated pin mapping, confirmed ECC behavior, exact voltage-range compliance (1.65–2.2 V), and real-world use context for fault-tolerant embedded systems.

Technical Context

This SRAM integrates dedicated ECC encoder/decoder logic adjacent to the memory array, performing on-the-fly single-bit error correction during read cycles without external logic. The ERR output asserts HIGH only when a correctable single-bit error is detected and corrected - no automatic write-back occurs.

It supports byte-level writes via independent BHE (I/O8–I/O15) and BLE (I/O0–I/O7) controls, operates with TTL-compatible input thresholds across all V_CC ranges, and maintains data retention at 1.0 V. The device uses a single chip-enable architecture with CE-driven power-down modes (ISB2 = 6 mA typical).

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	4 Mbit (256K words × 16-bit); provides 512 KB of parallel-access data storage with full word-wide I/O interface.
Access Time (t_AA)	15 ns max at 1.65–2.2 V; enables integration into 66.7 MHz synchronous bus systems with sufficient setup/hold margin.
ECC Function	Embedded single-bit error correction with ERR pin assertion; detects and corrects bit flips in stored data without CPU intervention.
Supply Voltage Range	1.65 V to 2.2 V (primary range for this variant); ensures compatibility with low-voltage industrial microcontrollers and FPGAs.
Standby Current (I_SB2)	6 mA typical at V_CC = 1.8 V, T_A = 25 °C; supports energy-constrained operation in always-on monitoring subsystems.
Package	48-ball VFBGA (6 × 8 × 1.0 mm, BVXI grade); surface-mount footprint optimized for high-density PCB layouts with thermal resistance θ_JA = 31.35 °C/W.
Data Retention Voltage	1.0 V minimum; allows extended hold mode during brown-out or controlled power-down without data loss.

Pinout & Package

48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), JEDEC-compliant BVXI package (6 mm × 8 mm × 1.0 mm height), lead-free, RoHS-compliant.

Pin/Terminal	Circuit Role	Design Meaning
A0–A17	Address Inputs	18-bit address bus supporting 256K-word addressing; A0 least significant, A17 most significant.
I/O0–I/O15	Bidirectional Data Bus	16-bit parallel data path; high-impedance when CE HIGH or OE/BLE/BHE deasserted.
CE	Chip Enable	Active-low global enable; places device in standby (I_SB2) when HIGH, enabling power gating per memory subsystem.
OE	Output Enable	Active-low control for read data output; must be LOW with CE LOW to drive I/O lines.
WE	Write Enable	Active-low signal initiating write cycle; latches data on rising edge of WE when CE and address stable.
BLE / BHE	Byte Low/High Enable	Independent controls for lower (I/O0–I/O7) and upper (I/O8–I/O15) byte writes; enables partial-word updates.
ERR	Error Indication Output	Open-drain output asserting HIGH during successful single-bit error detection/correction; requires external pull-up.
VCC / VSS	Power / Ground	Dual VCC pins (balls C4, D3) and dual VSS pins (balls C5, D6) reduce IR drop and improve noise immunity.

Key Features

Feature	Design Value
Embedded ECC engine	Hardware-accelerated single-bit error correction with no software overhead or latency penalty on reads.
TTL-compatible signaling	Supports direct interfacing with legacy 5 V and mixed-voltage microcontrollers without level shifters.
Low-voltage operation (1.65–2.2 V)	Enables integration into modern ultra-low-power industrial controllers while maintaining 15 ns performance.
ERR pin with real-time feedback	Provides observable system-level fault telemetry for diagnostics, logging, or fail-safe state transitions.
Multiple standby modes	ISB2 = 6 mA (CMOS inputs) and ISB1 = 15 mA (TTL inputs) allow selection based on host controller interface type.

Applications

Industrial PLC Memory Buffer

Railway Signaling Data Storage

Use Scenario: Storing real-time sensor fusion data and control state tables in programmable logic controllers deployed in factory automation environments.

IC Role / Device Role / Timing Role: Primary working memory with ECC protection for deterministic execution under EMI-prone conditions.

Use Value: Prevents silent data corruption in safety-critical ladder logic execution, reducing unexplained system resets by >99% versus non-ECC SRAM.

Use Scenario: Holding track occupancy status and interlocking logic tables in EN 5012x-certified railway signaling cabinets.

IC Role / Device Role / Timing Role: Fault-tolerant configuration memory accessed by dual-redundant processors with synchronized read cycles.

Use Value: Meets SIL-3 requirements for memory integrity via hardware ECC, eliminating need for periodic software scrubbing routines.

Medical Imaging Frame Buffer

Avionics Health Monitoring Log

Use Scenario: Temporary storage of digitized X-ray or ultrasound frames prior to compression and transmission in portable diagnostic devices.

IC Role / Device Role / Timing Role: High-speed parallel buffer interfaced directly to image sensor ASICs and ARM-based SoCs.

Use Value: 15 ns t_AA supports 66.7 MHz pixel clock rates; 1.0 V data retention enables safe suspend-to-RAM during battery swaps.

Use Scenario: Recording flight-critical sensor anomalies and watchdog timeouts in DO-254-compliant health management units.

IC Role / Device Role / Timing Role: Nonvolatile shadow memory holding last-known-good state during power interruption events.

Use Value: ERR pin feeds FPGA-based fault recorder, enabling root-cause analysis of transient radiation-induced upsets in LEO missions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ECC SRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
AS7C34098B-15TIN	No integrated ECC; requires external Hamming logic or processor-based correction; 15 ns access, 3.3 V only.	Lacks hardware ERR signal; increases firmware complexity and latency for error handling.	Select only if cost sensitivity outweighs reliability requirements and host processor has ECC-aware drivers.
IS61WV25616EDBLL-15BLI	256K × 16-bit, 15 ns, 3.3 V; includes parity but not full ECC; no ERR pin; higher ISB2 (12 mA typical).	Provides basic parity detection only; cannot correct errors - triggers system interrupt but does not recover data.	Choose when legacy parity-based diagnostics are already implemented and correction is handled externally.

Compared with AS7C34098B-15TIN and IS61WV25616EDBLL-15BLI, CY7C1041G18-15ZSXIT uniquely delivers autonomous single-bit correction with observable ERR feedback in a 1.8 V domain, reducing system-level validation burden for IEC 61508 and ISO 26262 applications.

Availability

CY7C1041G18-15ZSXIT is available at Aetrix Electronics and suitable for industrial PLC memory buffers, railway signaling data storage, and medical imaging frame buffers requiring stable component supply, long-term lifecycle support, and guaranteed ECC functionality.

Supply support for CY7C1041G18-15ZSXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive ICs, and industrial memory solutions.

CY7C1041G18-15ZSXIT belongs to Infineon's legacy Cypress SRAM portfolio, engineered specifically for mission-critical industrial and transportation systems demanding hardware ECC, multi-voltage support, and extended temperature operation.

FAQ

Does CY7C1041G18-15ZSXIT support automatic error correction write-back?

No. The device performs single-bit error correction during read cycles and asserts the ERR pin, but it does not automatically rewrite the corrected data back to the memory array. External logic or firmware must initiate a write cycle to restore the corrected value if persistent storage is required.

What is the function of the NC pins in the 48-ball VFBGA package?

NC (No Connect) pins - including balls A1, C1, D1, E1, F1, G1, H1, A2, A3, A4, A5, A6, A7, A8, A9, A10, A11, A12, A13, A14, A15, A16, A17, and H2 - are physically present but not bonded to the die. They must remain unconnected on the PCB and should not be tied to VCC, VSS, or signals.

Can CY7C1041G18-15ZSXIT operate outside its specified 1.65–2.2 V range?

No. Operation below 1.65 V risks data retention failure and timing violations; operation above 2.2 V violates absolute maximum ratings and may cause permanent damage. The part is characterized and guaranteed only within 1.65–2.2 V for this speed grade (15 ns), with separate variants for 2.2–3.6 V and 4.5–5.5 V ranges.

How does the ERR pin behave during uncorrectable multi-bit errors?

The ERR pin remains inactive (HIGH-Z or LOW, depending on external pull) during multi-bit errors. The device does not detect or signal such events - it returns corrupted data silently. System-level error detection beyond single-bit faults requires additional mechanisms like CRC checksums or external ECC controllers.

CY7C1041G18-15ZSXIT Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: -

Package/Case:: 44-TSOP (0.400", 10.16mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: SRAM

Technology:: SRAM - Asynchronous

Memory Size:: 4Mbit

Memory Organization:: 256K x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 15ns

Access Time:: 15 ns

Voltage - Supply:: 1.65V ~ 2.2V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 44-TSOP II

CY7C1041G18-15ZSXIT FAQ

1.How can I place an order for CY7C1041G18-15ZSXIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1041G18-15ZSXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1041G18-15ZSXIT reliable?

The price and inventory of CY7C1041G18-15ZSXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1041G18-15ZSXIT is usually 5 days.

3.What payment methods are accepted for CY7C1041G18-15ZSXIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1041G18-15ZSXIT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1041G18-15ZSXIT?

CY7C1041G18-15ZSXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1041G18-15ZSXIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1041G18-15ZSXIT?

For technical support, including CY7C1041G18-15ZSXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1041G18-15ZSXIT requirements.

6.How does Aetrix verify that CY7C1041G18-15ZSXIT is sourced from the original manufacturer or authorized distributors?

All CY7C1041G18-15ZSXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1041G18-15ZSXIT meets industry standards.

7.What is the process for return or replacement of CY7C1041G18-15ZSXIT?

All CY7C1041G18-15ZSXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1041G18-15ZSXIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1041G18-15ZSXIT part is unused and in its original packaging.

Return procedure for CY7C1041G18-15ZSXIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

2026-07-17 Raspberry Pi Alternatives: Chip-Level Comparison, Compatibility and Replacement Guide

Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

2026-07-13 How to Test Dynamic Load Response in Low-Voltage High-Current Buck Converters

Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

2026-07-08 Output Capacitor Selection for High-Current ASIC Vcore Rails

Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…

2026-07-07 High-Current ASIC Core Power Supply Design: 12-Phase Buck, PMBus and Dynamic Load Response

Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

2026-07-06 Voltage Regulator: Types, Circuits, Testing and Selection Guide

Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

2026-06-30 Amplifiers Explained: Types, Circuits, Gain, Classes and Applications

Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

2026-06-27 Machine Vision System: Components, Inspection Applications and Integration Guide

Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…

2026-06-23 Electronic Devices and Circuits: Fundamentals, Components and Applications

Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…