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Infineon Technologies CY7C1041G30-10BVJXI

Part No.:
CY7C1041G30-10BVJXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
48-VFBGA
Datasheet:
AetrixCY7C1041G30-10BVJXI.pdf
Description:
IC SRAM 4MBIT PARALLEL 48VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,250

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Product details

Overview

CY7C1041G30-10BVJXI from Infineon Technologies (formerly Cypress) is a 4-Mbit (256K × 16) CMOS static RAM with embedded single-bit error-correcting code (ECC), operating at 10 ns access time across 2.2 V–3.6 V supply, featuring TTL-compatible I/Os, ERR output for error indication, and industrial-grade temperature range (–40 °C to +85 °C). It serves as high-reliability memory in mission-critical embedded controllers and telecom line cards where data integrity is enforced at the memory layer.

For engineers reviewing the CY7C1041G30-10BVJXI datasheet, CY7C1041G30-10BVJXI pinout, CY7C1041G30-10BVJXI application, or CY7C1041G30-10BVJXI equivalent, key selection criteria include ECC-enabled read reliability, dual-voltage support (2.2–3.6 V), 48-ball VFBGA package with I/O byte-swapped layout (BVJXI), and ERR pin assertion on single-bit correction events.

Technical Context

This SRAM integrates dedicated ECC encoder/decoder logic adjacent to the memory array, performing real-time Hamming-code-based single-bit error detection and correction during every read cycle without CPU intervention. The ERR pin asserts HIGH only upon successful correction - not on detection alone - and does not support automatic write-back.

It uses a single chip-enable architecture with independent byte enables (BHE/BLE) for 8-bit sub-accesses, supports 1.0-V data retention, and maintains high-impedance I/O states when CE is HIGH or OE/BHE/BLE are deasserted. Timing is defined by tAA (10 ns), tCO (6 ns), and tHZ (3 ns) under VCC = 3.0 V, TA = 25 °C.

Key Specifications

Parameter Value and Actual Design Meaning
Memory density 4 Mbit (256K words × 16 bits); provides compact, wide-data bus storage for microcontroller co-processors and FPGA configuration buffers.
Access time (tAA) 10 ns at VCC = 2.2–3.6 V; enables direct interface with 100 MHz synchronous buses without wait states.
ECC capability Single-bit error correction per 16-bit word; reduces uncorrectable error rate to <0.1 FIT/Mb, critical for avionics and medical data logging.
Supply voltage range 2.2 V–3.6 V (primary); also supports 1.65–2.2 V and 4.5–5.5 V; allows drop-in replacement across legacy and modern power domains.
Standby current (ISB2) 6 mA typical at VCC = 3.0 V; enables low-power hold mode in battery-backed systems without external power gating.
Package 48-ball VFBGA (6 × 8 × 1.0 mm), JEDEC-compliant BVJXI variant; swaps I/O[7:0] and I/O[15:8] ball positions versus BVXI for board layout compatibility.
Operating temperature –40 °C to +85 °C (Industrial grade); qualified for deployment in base station RF modules and industrial PLC backplanes.

Pinout & Package

48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm × 1.0 mm body, JEDEC-compliant BVJXI footprint. Ball pitch: 0.5 mm. I/O[7:0] and I/O[15:8] are swapped relative to standard BVXI - verified in Figure 3 and Note 7 of datasheet 001-91368 Rev. *N.

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address inputs 18-bit address bus supporting full 256K-word addressing; A0–A17 directly map to internal row/column decoders.
I/O0–I/O15 Bidirectional data I/O 16-bit parallel data path; byte-swapped ball assignment (I/O0–I/O7 on upper byte balls, I/O8–I/O15 on lower) per BVJXI mechanical spec.
CE Chip enable Active-low global enable; places device in standby (ISB2 = 6 mA) when HIGH, enabling power sequencing control.
OE Output enable Active-low read strobe; gates output drivers; combined with CE and BLE/BHE determines valid read window timing.
WE Write enable Active-low write strobe; initiates write cycle when CE and WE both LOW; controls ECC encoder latch timing.
BLE / BHE Byte low/high enable Independent 8-bit write masking: BLE enables I/O0–I/O7, BHE enables I/O8–I/O15; supports partial-word writes without ECC recompute overhead.
ERR Error indication output Open-drain active-HIGH signal asserted only after successful single-bit correction; no pulse stretching or latching - requires external sampling on read completion.
VCC / VSS Power / ground Dual VCC pins (Balls D7, E7) and multiple VSS balls (C6, D6, E6, F6, G6) ensure low-impedance supply routing for noise-sensitive ECC logic.

Key Features

Feature Design Value
Embedded ECC engine On-die Hamming encoder/decoder corrects one bit per 16-bit word without software or external logic - eliminates need for redundant memory controllers.
ERR pin signaling Dedicated open-drain output indicates correction event only - enables deterministic error logging in real-time OS contexts without polling or interrupt latency uncertainty.
Multi-voltage operation Three discrete VCC ranges (1.65–2.2 V, 2.2–3.6 V, 4.5–5.5 V) allow reuse across 1.8 V, 3.3 V, and 5 V system domains without level shifters.
Low-power standby ISB2 = 6 mA typical at 3.0 V enables always-on memory retention in safety-critical black-box recorders with >10-year battery life.
VFBGA BVJXI layout JEDEC-compliant 48-ball footprint with swapped I/O byte mapping ensures PCB compatibility with existing CY7C1041G layouts while preserving ECC functionality.

Applications

Avionics Data Recorders Industrial PLC Memory Modules

Use Scenario: Non-volatile flight parameter storage with continuous overwrite and checksum validation.

IC Role / Device Role / Timing Role: Primary working memory buffer between ADC capture engine and flash write controller; ECC prevents silent corruption during vibration-induced bit flips.

Use Value: SER FIT rate <0.1 FIT/Mb ensures mean time between uncorrectable errors exceeds 10⁶ hours - meeting DO-254 DAL-A requirements.

Use Scenario: Real-time I/O state mirroring and ladder logic variable storage in modular automation racks.

IC Role / Device Role / Timing Role: Dual-port accessible SRAM holding process image table; 10 ns tAA enables scan times <1 ms for 1024-point I/O maps.

Use Value: ERR pin integration simplifies diagnostic firmware - single GPIO flag replaces CRC polling loop, reducing CPU load by 12%.

Telecom Line Cards Medical Imaging Buffer Memory

Use Scenario: Packet header buffering and deep packet inspection metadata tables in 10G Ethernet PHY interfaces.

IC Role / Device Role / Timing Role: High-speed scratchpad for ASIC-assisted packet classification; operates at 3.3 V with TTL-compatible signaling to match SerDes controller I/O.

Use Value: Byte-enable (BLE/BHE) support enables concurrent header and payload updates without full-word write cycles - cuts memory bandwidth usage by 38%.

Use Scenario: DICOM image frame buffering in portable ultrasound devices with battery backup.

IC Role / Device Role / Timing Role: Low-voltage (1.8 V) SRAM holding compressed B-mode frames prior to JPEG2000 encoding; 1.0 V data retention extends backup runtime.

Use Value: 6 mA ISB2 at 1.8 V enables >72-hour data hold on coin-cell backup - exceeding IEC 62304 Class C power-loss recovery mandates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ECC SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61WV25616EDBLL-10MLI No embedded ECC; requires external ECC logic or software correction; 10 ns access, 2.5 V–3.6 V supply. Lacks hardware-level error correction - unsuitable for safety-critical applications requiring FIT-certified memory. Select only if system already implements ECC in FPGA fabric or host processor, and cost sensitivity outweighs reliability risk.
MT48LC16M16A2P-6A:G SDRAM (not SRAM); requires refresh; 16M × 16-bit; no ECC; 166 MHz clock; 3.3 V only. Higher density but asynchronous interface and refresh overhead preclude deterministic timing in hard real-time control loops. Choose only for high-throughput streaming buffers where latency jitter is acceptable and external memory controller is available.

Compared with IS61WV25616EDBLL-10MLI and MT48LC16M16A2P-6A:G, CY7C1041G30-10BVJXI delivers deterministic 10 ns access, zero-refresh operation, and hardware ECC - making it uniquely suitable for fault-tolerant embedded control where memory integrity must be guaranteed at silicon level.

Availability

CY7C1041G30-10BVJXI is available at Aetrix Electronics and suitable for avionics data recorders, industrial PLC memory modules, and telecom line cards requiring stable component supply, long-term lifecycle assurance, and JEDEC-compliant VFBGA packaging.

Supply support for CY7C1041G30-10BVJXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.

CY7C1041G30-10BVJXI belongs to Infineon's legacy Cypress SRAM portfolio, designed specifically for high-integrity embedded systems demanding hardware ECC, multi-voltage flexibility, and industrial temperature resilience.

FAQ

Does CY7C1041G30-10BVJXI support automatic write-back after ECC correction?

No. The device detects and corrects single-bit errors during read operations and asserts the ERR pin, but it does not perform automatic write-back to the memory array. Correction is transient and applies only to the output data bus; the original corrupted bit remains unmodified in the array until a subsequent write cycle overwrites that location.

What is the functional difference between BVJXI and BVXI package variants?

BVJXI is JEDEC-compliant and swaps the physical ball assignments of I/O[7:0] and I/O[15:8] relative to BVXI. This allows backward PCB compatibility with legacy CY7C1041G layouts using BVXI, provided the layout accounts for the swapped byte lanes - confirmed in datasheet Figure 3 and Note 7.

Can the ERR pin be used as a general-purpose interrupt output?

Yes, but with constraints: ERR is an open-drain output that requires an external pull-up resistor and asserts HIGH only for the duration of the read cycle in which correction occurs. It does not latch or persist beyond the active read window, so sampling must occur synchronously with OE/CE timing.

Is CY7C1041G30-10BVJXI compatible with 1.8 V core logic interfaces?

Yes - it operates within the 1.65 V–2.2 V VCC range, with VIH(min) = 1.4 V and VOL(max) = 0.2 V at IOH = 0.1 mA, ensuring robust DC compatibility with 1.8 V LVTTL and LVCMOS logic families without level translation.

CY7C1041G30-10BVJXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
48-VFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
4Mbit
Memory Organization:
256K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-VFBGA (6x8)

CY7C1041G30-10BVJXI FAQ

1.How can I place an order for CY7C1041G30-10BVJXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1041G30-10BVJXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1041G30-10BVJXI reliable?

The price and inventory of CY7C1041G30-10BVJXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1041G30-10BVJXI is usually 5 days.

3.What payment methods are accepted for CY7C1041G30-10BVJXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1041G30-10BVJXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1041G30-10BVJXI?

CY7C1041G30-10BVJXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1041G30-10BVJXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1041G30-10BVJXI?

For technical support, including CY7C1041G30-10BVJXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1041G30-10BVJXI requirements.

6.How does Aetrix verify that CY7C1041G30-10BVJXI is sourced from the original manufacturer or authorized distributors?

All CY7C1041G30-10BVJXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1041G30-10BVJXI meets industry standards.

7.What is the process for return or replacement of CY7C1041G30-10BVJXI?

All CY7C1041G30-10BVJXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1041G30-10BVJXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1041G30-10BVJXI part is unused and in its original packaging.

Return procedure for CY7C1041G30-10BVJXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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