Infineon Technologies CY7C1041G30-10BVJXIT

Overview

CY7C1041G30-10BVJXIT from Infineon Technologies (formerly Cypress) is a 4-Mbit (256K × 16-bit) CMOS static RAM with embedded single-bit error-correcting code (ECC), operating at 10 ns access time over 2.2 V–3.6 V supply, featuring ERR output pin, TTL-compatible I/Os, and low standby current (6 mA typical). It serves as fault-tolerant data buffer in industrial control modules requiring ECC-enabled memory for mission-critical register storage.

For engineers reviewing the CY7C1041G30-10BVJXIT datasheet, CY7C1041G30-10BVJXIT pinout, CY7C1041G30-10BVJXIT application, or CY7C1041G30-10BVJXIT equivalent, this page delivers verified package mapping (48-ball VFBGA, BVJXI), confirmed ECC correction behavior, validated byte-enable timing, and real-world use cases in safety-aware embedded systems.

Technical Context

This SRAM implements on-die ECC encoding/decoding logic that detects and corrects single-bit errors during read cycles, with ERR pin assertion indicating successful correction-no automatic write-back occurs. The device uses separate Byte High Enable (BHE) and Byte Low Enable (BLE) inputs to control 8-bit sub-word writes without affecting adjacent bytes.

It supports three voltage ranges (1.65–2.2 V, 2.2–3.6 V, 4.5–5.5 V); the "30" suffix denotes 2.2–3.6 V operation at 10 ns speed. Its 48-ball VFBGA (BVJXI) package swaps I/O[7:0] and I/O[15:8] ball positions versus BVXI, maintaining JEDEC compliance while enabling layout optimization in high-density PCBs.

Key Specifications

Pinout & Package

48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm × 1.0 mm body, JEDEC-compliant BVJXI package variant. Ball pitch: 0.5 mm. I/O[7:0] and I/O[15:8] balls are swapped relative to BVXI to improve PCB trace symmetry.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ECC SRAM applications.

Compared with AS7C34096B-10TIN and IS61WV25616EDBLL-10MLI, CY7C1041G30-10BVJXIT uniquely delivers integrated ECC correction with ERR indication in a JEDEC-compliant VFBGA, eliminating external logic while meeting industrial temperature and data integrity requirements.

Availability

CY7C1041G30-10BVJXIT is available at Aetrix Electronics and suitable for industrial PLC data buffers, railway signaling memory modules, and medical imaging frame buffers requiring stable component supply across extended product lifecycles.

Supply support for CY7C1041G30-10BVJXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power systems, sensors, and memory solutions for industrial, automotive, and IoT applications.

CY7C1041G30-10BVJXIT belongs to Infineon's legacy Cypress SRAM portfolio, designed specifically for high-reliability embedded systems demanding hardware-accelerated ECC and multi-voltage interoperability.

FAQ

Does CY7C1041G30-10BVJXIT support automatic error correction write-back?

No. The device performs single-bit error correction during read cycles and asserts the ERR pin, but does not automatically rewrite the corrected data back to the memory array. Write-back must be handled externally via system-level logic or firmware if persistent correction is required.

What is the function of the ERR pin, and how is it electrically driven?

The ERR pin is an open-drain output that goes HIGH during a read cycle when a single-bit error is detected and corrected. It requires an external pull-up resistor (typically 4.7 kΩ to VCC) and remains inactive (HIGH-Z) otherwise-no internal pull-up is provided.

Can CY7C1041G30-10BVJXIT operate at 1.8 V?

No. The "30" suffix specifies the 2.2 V–3.6 V operating range. For 1.65 V–2.2 V operation, the CY7C1041G18-15BVJXIT variant must be used. Attempting 1.8 V operation on this part may result in undefined timing or functional failure.

How does the BVJXI package differ from BVXI in PCB layout?

The BVJXI package swaps the physical ball positions of I/O[7:0] and I/O[15:8] relative to BVXI-meaning the lower-byte and upper-byte data lines occupy opposite sides of the die. This requires updated PCB footprint and routing; it is not pin-compatible without layout revision.